Patents by Inventor Yoshihiko Tsujimura

Yoshihiko Tsujimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180244912
    Abstract: [Problem] To provide a thermoplastic resin composition for use in an organ model, wherein said composition has a softness closer to that of an organ, a high mechanical strength, and a texture close to an organ, exhibits excellent durability, and can be handled easily. [Solution] A resin composition for an organ model, said composition containing, as component (A), 100 parts by mass of a hydrogenated block copolymer having an MFR (measured at a temperature of 230° C. and a load of 2.16 kg) of 1 g/10 min. or less, and an oil as component (B). Moreover, the composition may also contain a cross copolymer as component (C), a polypropylene resin as component (D), and a filler as component (E).
    Type: Application
    Filed: August 17, 2016
    Publication date: August 30, 2018
    Inventors: Akira Miyama, Yoshihiko TSUJIMURA, Toru Arai
  • Patent number: 8883564
    Abstract: A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 ?m; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 ?m, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10?6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: November 11, 2014
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Hirotsuru, Satoshi Higuma, Shinya Narita, Yoshihiko Tsujimura
  • Publication number: 20110316038
    Abstract: A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 ?m; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 ?m, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10?6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.
    Type: Application
    Filed: February 8, 2010
    Publication date: December 29, 2011
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Hideki Hirotsuru, Satoshi Higuma, Shinya Narita, Yoshihiko Tsujimura
  • Patent number: 7709939
    Abstract: A metal base circuit board to be used for a hybrid integrated circuit, including circuits provided on a metal plate via an insulating layer, a power semiconductor mounted on the circuit, and a control semiconductor to control the power semiconductor, provided on the circuit. A low capacitance portion is embedded under a circuit portion on which the control semiconductor is mounted, preferably. The low capacitance portion is made of a resin containing an inorganic filler and has a dielectric constant of from 2 to 9.
    Type: Grant
    Filed: April 15, 2004
    Date of Patent: May 4, 2010
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Naomi Yonemura, Katsunori Yashima, Yoshihiko Tsujimura, Hidenori Ishikura, Takashi Saiki
  • Publication number: 20070128772
    Abstract: A metal base circuit board to be used for a hybrid integrated circuit, including circuits provided on a metal plate via an insulating layer, a power semiconductor mounted on the circuit, and a control semiconductor to control the power semiconductor, provided on the circuit. A low capacitance portion is embedded under a circuit portion on which the control semiconductor is mounted, preferably. The low capacitance portion is made of a resin containing an inorganic filler and has a dielectric constant of from 2 to 9.
    Type: Application
    Filed: April 15, 2004
    Publication date: June 7, 2007
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Naomi Yonemura, Katunori Yashima, Yoshihiko Tsujimura, Hidenori Ishikura, Takashi Saiki
  • Patent number: 6197435
    Abstract: An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the first metal and the second metal are different, or (2) the following first metal-third metal-second metal bonded product, and wherein in (1) and (2), the first metal is bonded to the ceramic substrate; first metal: a metal selected from the group consisting of aluminum (Al), lead (Pb), platinum (Pt) and an alloy containing at least one of these metal components; second metal: a metal selected from the group consisting of copper (Cu), silver (Ag), gold (Au), aluminum (Al) and an alloy containing at least one of these metal components; and third metal: a metal selected from the group consisting of titanium (Ti), nickel (Ni), zirconium (Zr), molybdenum (Mo), tungsten (W) and an alloy containing at least one of these metal components.
    Type: Grant
    Filed: October 20, 1998
    Date of Patent: March 6, 2001
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Yoshihiko Tsujimura, Miyuki Nakamura, Yasuhito Fushii