Patents by Inventor Yoshihiko Watanabe
Yoshihiko Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090068399Abstract: It is an object of the present invention to provide a composite metal sheet having remarkably enhanced electrical property and reliability, a method for preparing the same composite metal sheet, and a device for preparing the same composite metal sheet.Type: ApplicationFiled: September 11, 2008Publication date: March 12, 2009Applicant: Yazaki CorporationInventors: Kazuhiro Murakami, Kazuhide Takahashi, Kimitoshi Makino, Yoshihiko Watanabe
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Publication number: 20080256781Abstract: The present invention provides a joining method of metal plates, which can connect two metal plates without a projection in a surface of the metal plates and a gap, and a joined unit having metal plates which are connected without a projection in a surface of the metal plates and a gap between the metal plates. The joined unit has a pair of metal plates. One of the metal plates has a hole, and another metal plate has a projection having a height less than a thickness of the one of the metal plates. The projection passes through the hole, the one of the metal plates is placed on the other of the metal plates each other, and a central part of an end surface of the projection is crushed in the hole. Thereby, the metal plates are joined to each other, and the joined unit can be provided.Type: ApplicationFiled: April 16, 2008Publication date: October 23, 2008Applicant: Yazaki CorporationInventors: Kazuhiro Murakami, Yoshihiko Watanabe, Kazuhide Takahashi, Kimitoshi Makino
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Publication number: 20070062643Abstract: A method of separating an adhesive-bonded body is provided, by which a pair of pieces bonded together by using an adhesive can be easily securely separated from each other, wherein the adhesive has excellent adhesive force without being influenced by environmental temperature, excellent storage stability and wide scope of selection of the piece to be bonded. An adhesive-bonded body 1 includes a pair of pieces 2 bonded together and an adhesive layer 4. The adhesive layer 4 bonds the pair of pieces 2 to each other. Ultrasonic vibration is applied to the adhesive-bonded body 1 which is put between a tool horn 6 and an anvil 7 of an ultrasonic vibration applying device 3. The ultrasonic vibration is generated by applying a voltage to a piezoelectric vibrator 5 and vibrates the tool horn 6. The tool horn 6 vibrates ultrasonically together with one piece 2. The pair of the pieces 2 bonded together shifts relatively each other due to the ultrasonic vibration.Type: ApplicationFiled: September 9, 2004Publication date: March 22, 2007Inventors: Yoshihiko Watanabe, Takashi Uematsu, Yuichiro Yamamura, Mikotoshi Suematsu, Shinishi Yamaguchi, Masanori Matsuda
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Patent number: 7154616Abstract: In case a file is prepared by executing an application, the fee for the use of the application is charged according to whether such file is subjected to an output process. Thus the user of the application need not pay the fee for the use of the application for the mere preparation of the file by using the application.Type: GrantFiled: April 24, 2001Date of Patent: December 26, 2006Assignee: Canon Kabushiki KaishaInventors: Yoshihiko Watanabe, Jiro Kojima, Masayuki Yoshida, Tsuneaki Kurumida, Tsutomu Negishi, Yuichiro Yamasawa, Yoshio Kimura, Yoshiji Kanamoto
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Patent number: 6996293Abstract: In an electric filing apparatus, a document is read, and the read document is divided into blocks by a predetermined dividing number. Further, the divided block is divided into a partial image or partial character train, and a partial image or partial character train is extracted from a predetermined position every block. The extracted partial images or partial character trains are combined, thereby forming a reduced image smaller than an original image or character train. When selecting a document registered by the user, a list of the reduced images is displayed.Type: GrantFiled: June 14, 2000Date of Patent: February 7, 2006Assignee: Canon Kabushiki KaishaInventor: Yoshihiko Watanabe
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Patent number: 6897415Abstract: A workpiece stage of a resist curing device is devised in which a workpiece on which a resist has been applied is held on a workpiece stage by vacuum suction, in which the workpiece is irradiated with UV radiation with a simultaneous temperature increase, in which it is cooled after UV radiation and by which the resist is cured, the workpiece stage having heating and cooling arrangements, major warping of the carrier is avoided and reliable holding of the workpiece on the carrier surface by vacuum suction obtained by the carrier being made of an aluminum alloy or a copper alloy which meets the following condition: ?/?y3.1 ? labeling the thermal stress which is determined using the following formula: where E is Young's modulus (N/mm2) at 200° C., ? is the coefficient of linear expansion (1/° C.) at 200° C. and ?T is a temperature difference (° C.) of 120° C., and ?y is the fracture point at 200° C.Type: GrantFiled: June 27, 2002Date of Patent: May 24, 2005Assignee: Ushiodenki Kabushiki KaishaInventors: Yoshinori Fujiwara, Yasuhiko Kenjo, Yoshihiko Watanabe
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Patent number: 6858804Abstract: The cable-enrolling conductive thin-film sheet 1 consists of a conductive thin film 2 and an insulated cable 3. The conductive thin film 2 has a conductor layer 4 and first and second insulating layers 5, 6. The first insulating layer 5 is laminated on one face of the conductor layer 4, while the second insulating layer 6 is laminated on the other face of the conductor layer 4. The insulated cable 3 has an electrically conductive core wire 10 and an insulating sheath 11 covering the core wire 10. The insulated cable 3 laid on the first insulating layer 5 is partially welded to the sheet 2 by ultrasonic welding to obtain the cable-enrolling conductive thin-film sheet 1. The first insulating layer 5 is welded to be secured to the sheath 11, and the conductor layer 4 is mechanically connected to the core wire 10 by the ultrasonic welding.Type: GrantFiled: November 29, 2001Date of Patent: February 22, 2005Assignee: Yazaki CorporationInventors: Kazuhiro Murakami, Yoshihiko Watanabe, Akira Baba
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Patent number: 6806417Abstract: A conductor-equipped conductive thin film sheet 1 includes a conductive thin film sheet 2 and a metallic piece 8. The conductive thin film sheet 2 is composed of a conductive layer 4 and an insulating layer 7. The metallic piece 8 is superposed on the insulating layer 7 and is partially bonded to the conductive layer 4 by ultrasonic welding. In this configuration, when the sheet is wound around an electric wire, noise can be surely dissipated. A shield harness using the conductive thin film is also disclosed.Type: GrantFiled: May 16, 2002Date of Patent: October 19, 2004Assignee: Yazaki CorporationInventors: Kazuhiro Murakami, Yoshihiko Watanabe, Akira Baba, Tomohiro Ikeda, Satoshi Saito
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Patent number: 6655530Abstract: The household waste treatment requires neither incineration nor disposal in landfills. Two processing sub-systems, first one for combustibles and the other or second one for incombustibles, cooperate with each other as a single system for recycling the waste. The first sub-system deals with combustible waste to yields products for fertilizing and/or conditioning soil. In the process, what are inappropriate to the production of the soil fertilizing and/or conditioning products are sent to the second sub-system, which deals with incombustible waste. This sub-system sorts the incombustible waste materials into various kinds of recyclable products. Combustibles among the incombustible waste materials are sent to the first sub-system.Type: GrantFiled: June 27, 2001Date of Patent: December 2, 2003Assignee: NEC CorporationInventors: Koichi Nakamura, Yoshihiko Watanabe, Kazufumi Watabe
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Patent number: 6527161Abstract: The object is to provide a method of connecting covered wires mutually which can solve increasing cost. Each of the covered wires 2, 3 is comprised of a conductor 4, 10 and a cover 5, 11. The covered wires 2, 3 are connected to each other by ultrasonic welding. An ultrasonic welding machine includes a chip and an anvil. The covered wires 2, 3 are placed between the chip and the anvil. The chip is located with the length of its cross section disposed along the length of the other covered wire 3. The chip and the anvil are pushed toward each other and the chip is vibrated. Friction heat is generated between the covered wires 2, 3. The covers 5, 11 are adhered together and the conductors 4, 10 are bonded to each other by ultrasonic welding.Type: GrantFiled: August 6, 2001Date of Patent: March 4, 2003Assignee: Yazaki CorporationInventors: Kazuhiro Murakami, Kenichi Hanazaki, Yoshihiko Watanabe, Hiroyuki Murakoshi
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Publication number: 20030017713Abstract: A workpiece stage of a resist curing device is devised in which a workpiece on which a resist has been applied is held on a workpiece stage by vacuum suction, in which the workpiece is irradiated with UV radiation with a simultaneous temperature increase, in which it is cooled after UV radiation and by which the resist is cured, the workpiece stage having heating and cooling arrangements, major warping of the carrier is avoided and reliable holding of the workpiece on the carrier surface by vacuum suction obtained by the carrier being made of an aluminum alloy or a copper alloy which meets the following condition:Type: ApplicationFiled: June 27, 2002Publication date: January 23, 2003Applicant: Ushiodenki Kabushiki KaishaInventors: Yoshinori Fujiwara, Yasuhiko Kenjo, Yoshihiko Watanabe
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Publication number: 20020170729Abstract: A conductor-equipped conductive thin film sheet 1 includes a conductive thin film sheet 2 and a metallic piece 8. The conductive thin film sheet 2 is composed of a conductive layer 4 and an insulating layer 7. The metallic piece 8 is superposed on the insulating layer 7 and is partially bonded to the conductive layer 4 by ultrasonic welding. In this configuration, when the sheet is wound around an electric wire, noise can be surely dissipated. A shield harness using the conductive thin film is also disclosed.Type: ApplicationFiled: May 16, 2002Publication date: November 21, 2002Applicant: Yazaki CorporationInventors: Kazuhiro Murakami, Yoshihiko Watanabe, Akira Baba, Tomohiro Ikeda, Satoshi Saito
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Patent number: 6438449Abstract: To provide a substrate transport device and a transport teaching system which can automatically perform a teaching processing in order to reduce the burden of an operator and to eliminate a positional shift accurately and efficiently in a short time. Optical connectors 251, 252, 253 and 254 of a jig 200 and optical connectors 256, 257, 258 and 259 fixedly provided on a substrate transport device are opposed to each other and optical axes are coincident with each other. A lens having a high condensation ratio is provided in each optical connector. A light signal is output from optical sensor heads 231 and 241 through an optical fiber F2, each optical connector and an optical fiber F1, and a light signal input to optical sensor heads 232 and 242 is guided into the substrate transport device. Then, an arm 31b is automatically moved in a three-axis direction. Thus, an edge position of a detected portion 122 is detected to acquire positional information so that teaching information is obtained.Type: GrantFiled: November 29, 2000Date of Patent: August 20, 2002Assignees: Dainippon Screen Mfg. Co., Ltd., Kawasaki Jukogyo Kabushiki KaishaInventors: Yasuo Kawamatsu, Yoshihiko Watanabe, Yasuhiko Hashimoto
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Publication number: 20020096358Abstract: The cable-enrolling conductive thin-film sheet 1 consists of a conductive thin film 2 and an insulated cable 3. The conductive thin film 2 has a conductor layer 4 and first and second insulating layers 5, 6. The first insulating layer 5 is laminated on one face of the conductor layer 4, while the second insulating layer 6 is laminated on the other face of the conductor layer 4. The insulated cable 3 has an electrically conductive core wire 10 and an insulating sheath 11 covering the core wire 10. The insulated cable 3 laid on the first insulating layer 5 is partially welded to the sheet 2 by ultrasonic welding to obtain the cable-enrolling conductive thin-film sheet 1. The first insulating layer 5 is welded to be secured to the sheath 11, and the conductor layer 4 is mechanically connected to the core wire 10 by the ultrasonic welding.Type: ApplicationFiled: November 29, 2001Publication date: July 25, 2002Applicant: Yazaki Corporation, Tokyo, JapanInventors: Kazuhiro Murakami, Yoshihiko Watanabe, Akira Baba
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Publication number: 20020051164Abstract: In case a file is prepared by executing an application, the fee for the use of the application is charged according to whether such file is subjected to an output process. Thus the user of the application need not pay the fee for the use of the application for the mere preparation of the file by using the application.Type: ApplicationFiled: April 24, 2001Publication date: May 2, 2002Inventors: Yoshihiko Watanabe, Jiro Kojima, Masayuki Yoshida, Tsuneaki Kurumida, Tsutomu Negishi, Yuichiro Yamasawa, Yoshio Kimura, Yoshiji Kanamoto
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Publication number: 20020017550Abstract: The object is to provide a method of connecting covered wires mutually which can solve cost increasing.Type: ApplicationFiled: August 6, 2001Publication date: February 14, 2002Applicant: Yazaki CorporationInventors: Kazuhiro Murakami, Kenichi Hanazaki, Yoshihiko Watanabe, Hiroyuki Murakoshi
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Patent number: 6344864Abstract: A plurality of windows are displayed on a display screen, and a file within one of the plurality of windows is specified by an input section. The one window having the specified file is displayed on the display screen in such a way that the size of the one window is reduced. When a window of a transfer destination is specified by the input section, the window of a transfer source is displayed as a window having the original size.Type: GrantFiled: July 20, 1998Date of Patent: February 5, 2002Assignee: Canon Kabushiki KaishaInventor: Yoshihiko Watanabe
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Publication number: 20010049951Abstract: The household waste treatment requires neither incineration nor disposal in landfills. Two processing sub-systems, first one for combustibles and the other or second one for incombustibles, cooperate with each other as a single system for recycling the waste. The first sub-system deals with combustible waste to yields products for fertilizing and/or conditioning soil. In the process, what are inappropriate to the production of the soil fertilizing and/or conditioning products are sent to the second sub-system, which deals with incombustible waste. This sub-system sorts the incombustible waste materials into various kinds of recyclable products. Combustibles among the incombustible waste materials are sent to the first sub-system.Type: ApplicationFiled: June 27, 2001Publication date: December 13, 2001Inventors: Koichi Nakamura, Yoshihiko Watanabe, Kazufumi Watabe
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Patent number: 6279748Abstract: The household waste treatment requires neither incineration nor disposal in landfills. Two processing sub-systems, first one for combustibles and the other or second one for incombustibles, cooperate with each other as a single system for recycling the waste. The first sub-system deals with combustible waste to yield products for fertilizing and/or conditioning soil. In the process, what are inappropriate to the production of the soil fertilizing and/or conditioning products are sent to the second sub-system, which deals with incombustible waste. This sub-system sorts the incombustible waste materials into various kinds of recyclable products. Combustibles among the incombustible waste materials are sent to the first sub-system.Type: GrantFiled: February 17, 1999Date of Patent: August 28, 2001Assignee: NEC CorporationInventors: Koichi Nakamura, Yoshihiko Watanabe, Kazufumi Watabe
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Publication number: 20010002447Abstract: To provide a substrate transport device and a transport teaching system which can automatically perform a teaching processing in order to reduce the burden of an operator and to eliminate a positional shift accurately and efficiently in a short time. Optical connectors 251, 252, 253 and 254 of a jig 200 and optical connectors 256, 257, 258 and 259 fixedly provided on a substrate transport device are opposed to each other and optical axes are coincident with each other. A lens having a high condensation ratio is provided in each optical connector. A light signal is output from optical sensor heads 231 and 241 through an optical fiber F2, each optical connector and an optical fiber F1, and a light signal input to optical sensor heads 232 and 242 is guided into the substrate transport device. Then, an arm 31b is automatically moved in a three-axis direction. Thus, an edge position of a detected portion 122 is detected to acquire positional information so that teaching information is obtained.Type: ApplicationFiled: November 29, 2000Publication date: May 31, 2001Applicant: Dainippon Screen Mfg. Co., Ltd.Inventors: Yasuo Kawamatsu, Yoshihiko Watanabe, Yasuhiko Hashimoto