Abstract: A cylindrical cover-attached encoder apparatus, including a magnetic metal-based body having a cylindrical shape, a magnetic rubber-based encoder having a cylindrical shape and formed around the outer peripheral surface of said magnetic metal-based cylindrical body, and a nonmagnetic material-based cover having a cylindrical shape and adapted to be mounted on said magnetic rubber-based encoder for covering the outer peripheral surface of the cylindrical portion of said magnetic rubber-based encoder.

Abstract: A semiconductor device manufacturing apparatus includes a pre-alignment section having a pre-alignment camera which is adapted to recognize marks formed on a multi-arrayed substrate, a dicing section which dices the substrate with a cutting blade in accordance with information resulting from image recognition of the marks by the pre-alignment section, and an xy table which carries the substrate. The pre-alignment section recognizes in advance all marks on the substrate based on image recognition thereby to determine the dicing positions, and the dicing section merely recognizes a few points of the substrate with an alignment camera. Consequently, pre-alignment and dicing can take place concurrently, and the throughput of the dicing process can be improved.

Abstract: A magnetic rubber composition for encoder having a magnetic characteristic in sufficient application range, used as encoder after magnetization as well as heat resistance, water resistance and oil resistance required for use as encoder, and excellent processing property, and capable of being bonded by vulcanization with a metal, is provided. Furthermore, a magnetic rubber composition for encoder capable of obtaining sufficient magnetic force required for encoder on a circumference of the molded encoder as well as capable of effectively restraining variation of the level of magnetic force, is provided. It is provided by comprising 300 to 1,800 parts of strontium-ferrite, or 300 to 1,800 parts of barium-ferrite, or 300 to 1,800 parts of a mixture of strontium-ferrite and barium-ferrite, 0.5 to 2 parts of silane coupling agent, and 1 to 10 parts of lubricating agent, per 100 parts of a hydrogenated nitrile butadiene rubber with 15 to 50% of acrylonitrile amount and 80 to 99% of hydrogenation ratio.

Abstract: To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method.

Abstract: A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

Abstract: A method of manufacturing a magnetic rubber ring comprises: providing an unvulcanized rubber containing rubber materials and magnetic powers; using an extruding machine to extrude the unvulcanized rubber into a rubber band having a nearly round cross section; cutting the rubber band into a strip of rubber band of a predetermined length; forming a rubber band ring by joining opposite ends of the strip of rubber band together, wherein the opposite ends of the strip of rubber band have respective meeting slanted faces cut at a predetermined angle such that a joint of the rubber band ring obtained by joining the opposite ends of the strip of rubber band become thinner in a direction of compression when the rubber band ring is compressed in a direction of its center line; and compressing the rubber band ring under applied heating in the direction of the center line.

Abstract: To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method. The semiconductor device comprises: a tub 1e for supporting a semiconductor chip 2; a sealing body 3 formed by sealing the semiconductor chip 2 with a resin; a plurality of leads 1a made of a copper alloy, exposed to the back face 3a of the sealing body 3, and having a soldered layer 8 on the exposed mounted face 1d; and wires 4 for connecting the pads 2a of the semiconductor chip 2 and the corresponding leads 1a.

Abstract: An unvulcanized raw rubber is provided, to which magnetic ferrite powder is added. A resulting mixture composed of the unvulcanized raw rubber and magnetic ferrite powder is passed through a rolling machine or an extruding machine such that the mixture is formed into a sheet blank that contains the magnetic ferrite powder aligned regularly in a particular orientation. Alternatively, the resulting mixture may be first passed through an extruding machine and then through a rolling machine. The sheet blank is then stamped across a planar direction such that a ring-like sheet is formed. The ring-like sheet, along with a supplemental ring, is placed inside a metal mold, where the ring-like sheet and supplemental ring are compressed in an axial direction, while applying heat thereto, so that the ring-like sheet is vulcanized and joined to the supplemental ring. Finally, the vulcanized ring-like sheet is magnetized so that S poles and N poles appear alternately around its circumference.

Abstract: An encoder made of rubber material in which the S-poles and the N-poles are alternately magnetized in circumference, whose magnetic force is strong and whose variation of the magnetic force is slight in the circumferential direction when it is magnetized. And a manufacturing method thereof. A ring shaped rubber compound made of unvulcanized rubber material into which magnetic powders are mixed and having thickness t1 of 1.5 times to 5 times thicker than the thickness t of the encoder made of rubber material as the final product is vulcanizingly molded. In this vulcanizingly molding process, the thickness of ring shaped rubber compound is reduced to one fifth (⅕) to two thirds (⅔) by compressing the ring shaped rubber compound in the axial direction under high temperature. And then, vulcanizingly molded one is magnetized S-poles and N-poles alternately in circumference.

Abstract: The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.

Abstract: A magnetic rubber composition for encoder having a magnetic characteristic in sufficient application range, used as encoder after magnetization as well as heat resistance, water resistance and oil resistance required for use as encoder, and excellent processing property, and capable of being bonded by vulcanization with a metal, is provided. Furthermore, a magnetic rubber composition for encoder capable of obtaining sufficient magnetic force required for encoder on a circumference of the molded encoder as well as capable of effectively restraining variation of the level of magnetic force, is provided. It is provided by comprising 300 to 1,800 parts of strontium-ferrite, or 300 to 1,800 parts of barium-ferrite, or 300 to 1,800 parts of a mixture of strontium-ferrite and barium-ferrite, 0.5 to 2 parts of silane coupling agent, and 1 to 10 parts of lubricating agent, per 100 parts of a hydrogenated nitrile butadiene rubber with 15 to 50% of acrylonitrile amount and 80 to 99% of hydrogenation ratio.

Abstract: A machine tool precision-measuring apparatus comprising: a first linear movement distance-measuring means 17 including a first slide shaft 11, a first slide bush 13 slidably attached to the first slide shaft 11, and a first distance sensor 15 for measuring a distance that the first slide shaft 11 relatively travels with respect to the first slide bush 13; and, a second linear movement distance-measuring means 18 including a second slide shaft 12 positioned across the first slide shaft 11, a second slide bush 14 connected to the first slide bush 13, the second slide bush 14 being slidably attached to the second slide shaft 12, and a second distance sensor 16 for measuring a distance that the second slide shaft 12 relatively moves with respect to the second slide bush 14.

Abstract: To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method.

Abstract: To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method.

Abstract: A method for manufacturing a magnetic encoder is disclosed, wherein the magnetic encoder may be used with a sensor on a semiconductor sensor chip that may be placed opposite the magnetic encoder, and is capable of providing codes as represented by a sequence of pulses generated by the magnetic forces. According to the method, an unvulcanized raw rubber is provided, to which a magnetic ferrite powder is added. The resulting mixture composed of the unvulcanized raw rubber and magnetic ferrite powder is then passed through a rolling machine or an extruding machine where the mixture is formed into a sheet blank that contains the magnetic ferrite powder aligned regularly in a particular orientation, or alternatively may be passed through the extruding machine, followed by being passed through the rolling machine, where the mixture is formed into a sheet blank that contains the magnetic ferrite powder aligned regularly in the particular orientation.

Abstract: The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.

Abstract: An encoder made of rubber material in which the S-poles and the N-poles are alternately magnetized in circumference, whose magnetic force is strong and whose variation of the magnetic force is slight in the circumferential direction when it is magnetized. And a manufacturing method thereof.

Abstract: To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method.

Abstract: Disclosed is a dc-to-dc converter comprising a switching transistor, a pulse-width modulation controller, a sandwich-type planar inductor, which accumulates an electromagnetic energy at ON state and releases the accumulated electromagnetic energy at OFF state of the switching transistor, a smoothing capacitor, a rectifying element, and a planar search coil for detecting an overcurrent flowing the planar coil, disposed on one of the outer surfaces of the soft magnetic layers constituting the planar inductor.

Abstract: Disclosed is a dc-to-dc converter comprising a switching transistor, a pulse-width modulation controller, a sandwich-type planar inductor, which accumulates an electromagnetic energy at ON state and releases the accumulated electromagnetic energy at OFF state of the switching transistor, a smoothing capacitor, a rectifying element, and a planar search coil for detecting an overcurrent flowing the planar coil, disposed on one of the outer surfaces of the soft magnetic layers constituting the planar inductor.