Abstract: Provided are a resin composition capable of yielding a cured product exhibiting a superior heat resistance over a long period of time, and a superior reflow resistance due to a low water absorption rate even at a high temperature; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition containing: (A) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (B) an inorganic filler; and (C) a radical polymerization initiator. The semiconductor device is encapsulated by the cured product of such heat-curable resin composition.

Abstract: Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains: (A) an epoxy resin being solid at 25° C.; (B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (C) an inorganic filler; and (D) an anionic curing accelerator.

Abstract: Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains: (A) an epoxy resin being solid at 25° C.; (B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (C) an inorganic filler; and (D) an anionic curing accelerator.

Abstract: Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains: (A) 90 to 10 parts by mass of a silicone-modified epoxy resin; (B) 10 to 90 parts by mass of a maleimide compound having a weight-average molecular weight (Mw) of 2,500 to 50,000; and (C) a curing catalyst, provided that a total of the components (A) and (B) is 100 parts by mass.

Abstract: The present invention provides the substrate comprises a fiber film base material comprising a sheet of a surface-treated fiber film or a plural number of sheets of the surface-treated fiber films being laminated, wherein the surface-treated fiber film has a value of a conventional flexural rigidity measured by a method according to JIS R 3420 of 3-fold to 100-fold to a value of a conventional flexural rigidity of an untreated fiber film. There can be provided a substrate having a uniform and homogeneous insulating layer which does not generate unfastening or twisting of a fiber, and in addition to heat resistance, dimensional stability and impact resistance, having further excellent in bendability and flexibility.

Abstract: The present invention provides a surface-modified glass fiber film having its surface modified by a silicon-containing compound, and a value of a common flexural rigidity of the surface-modified glass fiber film as measured by the method described in JIS R 3420 is in the range of 3 to 100 times as compared to a value of the common flexural rigidity of an unmodified glass fiber film. There can be provided a surface-modified glass fiber film having a high strength, a high heat resistance, a good dimensional stability, a good self-supporting property, a low average linear expansion coefficient, a high storage rigidity at high temperature, and an excellent surface uniformity.

Abstract: Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains: (A) 90 to 10 parts by mass of a silicone-modified epoxy resin; (B) 10 to 90 parts by mass of a maleimide compound having a weight-average molecular weight (Mw) of 2,500 to 50,000; and (C) a curing catalyst, provided that a total of the components (A) and (B) is 100 parts by mass.

Abstract: Provided are a resin composition capable of yielding a cured product exhibiting a superior heat resistance over a long period of time, and a superior reflow resistance due to a low water absorption rate even at a high temperature; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition containing: (A) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (B) an inorganic filler; and (C) a radical polymerization initiator. The semiconductor device is encapsulated by the cured product of such heat-curable resin composition.

Abstract: Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains: (A) an epoxy resin being solid at 25° C.; (B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (C) an inorganic filler; and (D) an anionic curing accelerator.

Abstract: Provided are a heat-curable maleimide resin composition capable of yielding a cured product superior in tracking resistance; and a semiconductor device encapsulated by the cured product of such resin composition. The heat-curable maleimide resin composition for semiconductor encapsulation contains: (A) a maleimide compound being solid at 25° C., and having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two maleimide groups; (B) an inorganic filler; and C) a curing accelerator.

Abstract: The present invention is a quartz glass fiber-containing prepreg, including: (A) at least one quartz glass fiber selected from the group consisting of a quartz cloth, a quartz chopped strand, a quartz nonwoven fabric, and a quartz wool; as well as a resin composition including (B) a maleimide compound that is a solid at 25° C., containing at least one dimer acid skeleton, at least one linear alkylene group having 6 or more carbon atoms, and at least two maleimide groups in the molecule; and (C) a curing accelerator, wherein the total content of uranium and thorium is 0 to 0.1 ppm. This provides a quartz glass fiber-containing prepreg to give a quartz glass fiber-containing substrate that is used as a PCB to prevent malfunction of a semiconductor device caused by the PCB to decrease transmission loss.

Abstract: The present invention is a quartz glass fiber-containing prepreg including: (A) a quartz glass fiber; and (B) a curable resin composition, wherein at least one condition of conditions: (1) a dose of ?-ray contained in the quartz glass fiber is 0.005 c/cm2·hour or smaller, and, each of metal ion contents of Na+, Li+ and K+ is 1 ppm or lower; (2) the quartz glass fiber contains the number of foams of 10 foams/m2 or smaller a unit area; and (3) the quartz glass fiber-containing prepreg has the common bending stiffness in the range of a thickness of 100 to 200 ?m measured by a method described in JIS R 3420:2013 of 500 N·m2 or larger is satisfied. This provides a quartz glass fiber-containing prepreg that has particularly excellent dielectric characteristics, has excellent dielectric characteristics and the heat resistance, and/or has high handling property because of high bending stiffness characteristics.

Abstract: The present invention provides a silicone resin transparent substrate, including one or more than one prepreg containing a silicone resin composition and a fibrous base, wherein the silicone resin transparent substrate has: an attached amount of the silicone resin composition to the fibrous base of 60% by mass or more and 99% by mass or less; a total light transmittance of 80% or more at 450 nm, as measured by a method disclosed in JIS K 7375:2008 in a thickness of 0.1 mm to 0.4 mm; and a water vapor permeability of 65 g/m2·day or less, as measured by Lyssy method in conformity with JIS K 7129:2008 in a thickness of 0.1 mm to 0.4 mm; together with a method for manufacturing the same. The silicone resin transparent substrate has excellent heat resistance and weatherability, together with flexibility, high transparency, and lower moisture permeability.

Abstract: The present invention provides a silicone resin substrate, including quartz cloth and a silicone resin composition, wherein the silicone resin composition contains a silicon atom-bonded aryl group in an amount of 10% by mol or more and 99% by mol or less based on the whole silicon atom-bonded organic groups contained in the silicone resin composition. The present invention also provides a metal layer-formed silicone resin substrate, a cured silicone resin substrate, and a metal layer-formed cured-silicone resin substrate, using the silicone resin substrate. Each substrate excels in heat resistance and weather resistance as well as dielectric properties at high frequency.

Abstract: An addition/condensation curable silicone resin sheet comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups and at least two silicon-bonded alkoxy or hydroxyl groups, (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms and at least two silicon-bonded alkoxy or hydroxyl groups, (C) an organopolysiloxane containing at least two silicon atoms having two alkoxy or hydroxyl groups and one hydrogen atom on a common silicon atom, and (D) a hydrosilylation catalyst is plastic and solid or semisolid at normal temperature. The silicone resin sheet is easy to work, effective to cure, and likely to form a cured layer around an LED chip.

Abstract: The present invention provides a method for producing a surface-treated glass fiber film comprising steps of: preparing a treatment solution consisting of a mixture of a hydrolysable silane compound and a partially hydrolyzed condensate thereof; coating a glass fiber film with the treatment solution so that the attached amount of the mixture is 2% by mass or more and 90% by mass or less, relative to 100% by mass of the surface-treated glass fiber film and drying the same; and heat-treating the glass fiber film coated. There can be provided a method for producing a surface-treated glass fiber film having high strength, a low average coefficient of linear expansion, a high storage rigidity at high temperature and excellent in heat resistance, flexibility, electric insulation, dimensional stability, and surface homogeneity, with less environmental impact.

Abstract: An addition/condensation curable silicone resin sheet comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups and at least two silicon-bonded alkoxy or hydroxyl groups, (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms and at least two silicon-bonded alkoxy or hydroxyl groups, (C) an organopolysiloxane containing at least two silicon atoms having two alkoxy or hydroxyl groups and one hydrogen atom on a common silicon atom, and (D) a hydrosilylation catalyst is plastic and solid or semisolid at normal temperature. The silicone resin sheet is easy to work, effective to cure, and likely to form a cured layer around an LED chip.

Abstract: The present invention provides a printed wiring board comprising: a conductor circuit on an insulating substrate, a white solder resist layer which is composed of a photosensitive resin composition on the insulating substrate having the conductor circuit, and a protective layer which is composed of a silicone resin composition on the white solder resist layer. The inventive printed wiring board shows superior thermo-discoloration resistivity and excellent patterning resolution.

Abstract: An optical semiconductor device in which an optical semiconductor element connected to a silver-plated copper lead frame is sealed with an addition curing silicone resin composition, the addition curing silicone resin composition having (A) organopolysiloxane that contains an aryl group and an alkenyl group and does not contain an epoxy group; (B) organohydrogenpolysiloxane that has at least two hydrosilyl groups per molecule and an aryl group, the organohydrogenpolysiloxane that contains 30 mol % or more of an HR2SiO0.5 unit in a constituent unit having an amount that a molar ratio of the hydrosilyl group in the component (B) with respect to the alkenyl group in the component (A) is 0.70 to 1.00; and (C) a hydrosilylation catalyst having a catalytic amount.

Abstract: The present invention provides a method for producing a surface-treated glass fiber film comprising steps of: preparing a treatment solution consisting of a mixture of a hydrolysable silane compound and a partially hydrolyzed condensate thereof; coating a glass fiber film with the treatment solution so that the attached amount of the mixture is 2% by mass or more and 90% by mass or less, relative to 100% by mass of the surface-treated glass fiber film and drying the same; and heat-treating the glass fiber film coated. There can be provided a method for producing a surface-treated glass fiber film having high strength, a low average coefficient of linear expansion, a high storage rigidity at high temperature and excellent in heat resistance, flexibility, electric insulation, dimensional stability, and surface homogeneity, with less environmental impact.