Patents by Inventor Yoshihiro Fukuba

Yoshihiro Fukuba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid integrated-circuit device having an asymmetrical thermal dissipator
    Patent number: 5260602
    Abstract: A hybrid integrated circuit device includes first and second circuit boards having heat emitting semiconductor devices mounted on each circuit board, the circuit boards being respectively attached to opposite sides of a heat radiating plate with an adhesive and extending in opposite directions beyond the heat radiating plate. The respective edges of the circuit boards extending beyond the heat radiating plate are grasped by clip leads for supporting the heat radiating plate and the two circuit boards on a main circuit board. Further, these clip leads electrically connect the semiconductor devices to external circuits.
    Type: Grant
    Filed: March 12, 1992
    Date of Patent: November 9, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshihiro Fukuba, Hazime Kato