Abstract: A dry mica tape includes a base material, a binder resin layer A formed on the base material and including an epoxy resin and an accelerator, a mica paper layer formed in contact with the binder resin layer A, and a binder resin layer B formed in contact with the mica paper layer, including an epoxy resin, and providing a cured resin with a higher glass transition point than that of a cured resin of an impregnating varnish only by reacting with an impregnating varnish including an epoxy resin impregnated into the dry mica tape wound around a conductor.

Abstract: A dry mica tape includes a base material, a binder resin layer A formed on the base material and including an epoxy resin and an accelerator, a mica paper layer formed in contact with the binder resin layer A, and a binder resin layer B formed in contact with the mica paper layer, including an epoxy resin, and providing a cured resin with a higher glass transition point than that of a cured resin of an impregnating varnish only by reacting with an impregnating varnish including an epoxy resin impregnated into the dry mica tape wound around a conductor.

Abstract: In order to offer the epoxy resin composition allowing much lower viscosity and higher heat resistance (glass transition temperature) of cured product to coexist and lowering hygroscopic property, and the insulation coil and one-piece impregnation type rotating machine with improved insulation performance using the composition, the epoxy resin composition made of a mixture of 1 to 5 by weight of sulfonium salt cationic polymerization initiator and 3 to 15 by weight of reactive diluent with 100 by weight of epoxy resin is provided. The insulation coil that is an insulation coil made of plain conductor wire formed into a specified shape and wound with insulation material, impregnated with the epoxy resin composition and then cured is provided.