Patents by Inventor Yoshihiro Higashikawa

Yoshihiro Higashikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE
    Publication number: 20240096762
    Abstract: A first chip on a first lead frame includes a first source electrode on a surface opposite to the first lead frame. A first source terminal is located in a first direction from the first lead frame. A first gate terminal is located in a second direction from the first source terminal. A first conductor contacts the first source electrode and the first source terminal via conductors. A second chip on a second lead frame includes a second source electrode on a surface opposite to the second lead frame. A second gate terminal is located in a second direction from the first gate terminal. A second source terminal is located in the second direction from the second gate terminal. A second conductor contacts the second source electrode and the second source terminal via conductors.
    Type: Application
    Filed: February 1, 2023
    Publication date: March 21, 2024
    Inventors: Kyo Tanabiki, Yoshihiro Higashikawa, Hajime Takagi