Patents by Inventor Yoshihiro Ihara
Yoshihiro Ihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11322478Abstract: A semiconductor device includes a wiring substrate and multiple semiconductor chips mounted on the wiring substrate by flip chip bonding with a resin being interposed between the wiring substrate and the semiconductor chips. The wiring substrate includes a chip mounting region in which the semiconductor chips are arranged in a matrix, and a resin injection region protruding from an end of the chip mounting region. The outer edge of the wiring substrate in the chip mounting region is positioned inward of the outer edge of the semiconductor chips arranged in the matrix. The outer edge of the wiring substrate in the resin injection region protrudes outward of the outer edge of the semiconductor chips arranged in the matrix.Type: GrantFiled: April 22, 2020Date of Patent: May 3, 2022Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takaharu Yamano, Yoshihiro Ihara
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Patent number: 11309224Abstract: A semiconductor device includes a flexible wiring substrate. The wiring substrate includes at least two mounting portions and at least one connecting portion. The mounting portions are stacked spaced apart from each other. Each connecting portion is bent to connect two mounting portions that are adjacent in a stacking direction. The semiconductor device further includes at least one semiconductor chip mounted on at least one of the at least two mounting portions and a plurality of conductive connecting members connecting the mounting portions to each other in the stacking direction.Type: GrantFiled: December 10, 2018Date of Patent: April 19, 2022Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yasuyoshi Horikawa, Yoshihiro Ihara, Yoshihiro Kita, Hikaru Tanaka
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Publication number: 20200365556Abstract: A semiconductor device includes a wiring substrate and multiple semiconductor chips mounted on the wiring substrate by flip chip bonding with a resin being interposed between the wiring substrate and the semiconductor chips. The wiring substrate includes a chip mounting region in which the semiconductor chips are arranged in a matrix, and a resin injection region protruding from an end of the chip mounting region. The outer edge of the wiring substrate in the chip mounting region is positioned inward of the outer edge of the semiconductor chips arranged in the matrix. The outer edge of the wiring substrate in the resin injection region protrudes outward of the outer edge of the semiconductor chips arranged in the matrix.Type: ApplicationFiled: April 22, 2020Publication date: November 19, 2020Inventors: Takaharu YAMANO, Yoshihiro IHARA
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Patent number: 10588533Abstract: A bioelectrode component includes an electrode member. The electrode member includes a metal plate, a coupling bar, and a needle part. The metal plate includes a first surface and a second surface opposite to the first surface, and includes an opening formed in the metal plate. The coupling bar extends inward from an inner wall of the opening. The needle part is arranged at a leading end of the coupling bar and protrudes toward the first surface of the metal plate.Type: GrantFiled: November 13, 2018Date of Patent: March 17, 2020Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Hideaki Sakaguchi, Yoshihiro Ihara
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Publication number: 20190198411Abstract: A semiconductor device includes a flexible wiring substrate. The wiring substrate includes at least two mounting portions and at least one connecting portion. The mounting portions are stacked spaced apart from each other. Each connecting portion is bent to connect two mounting portions that are adjacent in a stacking direction. The semiconductor device further includes at least one semiconductor chip mounted on at least one of the at least two mounting portions and a plurality of conductive connecting members connecting the mounting portions to each other in the stacking direction.Type: ApplicationFiled: December 10, 2018Publication date: June 27, 2019Inventors: Yasuyoshi HORIKAWA, Yoshihiro IHARA, Yoshihiro KITA, Hikaru TANAKA
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Patent number: 10319963Abstract: A battery includes a supporting substrate, resin layers, and a plurality of cells. Each resin layer includes a first resin and has 0.5 MPa to 10 MPa in tensile strength. The cells are stacked on the supporting substrate with the resin layers between the cells.Type: GrantFiled: June 3, 2014Date of Patent: June 11, 2019Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kazuyuki Kubota, Mitsuhiro Aizawa, Yoshihiro Ihara
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Publication number: 20190143091Abstract: A bioelectrode component includes an electrode member. The electrode member includes a metal plate, a coupling bar, and a needle part. The metal plate includes a first surface and a second surface opposite to the first surface, and includes an opening formed in the metal plate. The coupling bar extends inward from an inner wall of the opening. The needle part is arranged at a leading end of the coupling bar and protrudes toward the first surface of the metal plate.Type: ApplicationFiled: November 13, 2018Publication date: May 16, 2019Inventors: Hideaki Sakaguchi, Yoshihiro Ihara
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Patent number: 10257934Abstract: A circuit board module is electrically connectable to a socket by inserting one end part thereof into the socket, and includes a circuit board and a terminal board having a first surface provided with a column of socket-connection pads and mounted on the surface of the circuit board at the one end part. The terminal board includes first, second, and third pad columns provided on a second surface of the terminal board opposite to the first surface. The circuit board includes fourth, fifth, and sixth pad columns respectively provided on the surface of the circuit board opposing the second surface of the terminal board, at positions opposing the first, second, and third pad columns of the terminal board, respectively.Type: GrantFiled: February 26, 2018Date of Patent: April 9, 2019Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kenichi Mori, Kazuyuki Kubota, Yoshihiro Ihara
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Patent number: 10219745Abstract: A sensor includes: a base layer; first and second conduction paths supported by the base layer; a first adhesive layer covering a first portion of the first conduction path; a second adhesive layer covering the second conduction path; an insulation sheet including: a first protecting portion covering the second adhesive laver; a second protecting portion disposed between a second portion of the first conduction path, and a part of the second conduction path; and a third protecting portion covering the first adhesive layer; a detecting section; a wireless transmitter; and a power source. When the insulation sheet is peeled off, the second portion of the first conduction path, and the part of the second conduction path are caused to be in contact with each other, and an electric power is supplied from the power source to the detecting section and the wireless transmitter.Type: GrantFiled: July 26, 2016Date of Patent: March 5, 2019Assignees: NIHON KOHDEN CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Norihito Konno, Yoshihiro Ihara, Tomoharu Fujii
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Publication number: 20180317321Abstract: A circuit board module is electrically connectable to a socket by inserting one end part thereof into the socket, and includes a circuit board and a terminal board having a first surface provided with a column of socket-connection pads and mounted on the surface of the circuit board at the one end part. The terminal board includes first, second, and third pad columns provided on a second surface of the terminal board opposite to the first surface. The circuit board includes fourth, fifth, and sixth pad columns respectively provided on the surface of the circuit board opposing the second surface of the terminal board, at positions opposing the first, second, and third pad columns of the terminal board, respectively.Type: ApplicationFiled: February 26, 2018Publication date: November 1, 2018Inventors: Kenichi MORI, Kazuyuki KUBOTA, Yoshihiro IHARA
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Patent number: 9716053Abstract: A semiconductor device includes a wiring substrate, a semiconductor element mounted on the wiring substrate, and a heat dissipation component arranged on the wiring substrate. The heat dissipation component includes a cavity that accommodates the semiconductor element and includes an inner surface opposing the wiring substrate. The semiconductor element is located between the inner surface of the cavity and the wiring substrate. A heat conductor is bonded to the semiconductor element and to the inner surface of the cavity. The heat conductor includes linear heat conductive matters arranged between the semiconductor element and the heat dissipation component. A first alloy layer bonded to the semiconductor element covers lower ends of the heat conductive matters. The heat dissipation component includes a through hole extending through the heat dissipation component toward the heat conductor from a location outside of the heat conductor in a plan view.Type: GrantFiled: April 23, 2015Date of Patent: July 25, 2017Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kei Murayama, Yoshihiro Ihara
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Publication number: 20170027516Abstract: A sensor includes: a base layer; first and second conduction paths supported by the base layer; a first adhesive layer covering a first portion of the first conduction path; a second adhesive layer covering the second conduction path; an insulation sheet including: a first protecting portion covering the second adhesive laver; a second protecting portion disposed between a second portion of the first conduction path, and a part of the second conduction path; and a third protecting portion covering the first adhesive layer; a detecting section; a wireless transmitter; and a power source. When the insulation sheet is peeled off, the second portion of the first conduction path, and the part of the second conduction path are caused to be in contact with each other, and an electric power is supplied from the power source to the detecting section and the wireless transmitter.Type: ApplicationFiled: July 26, 2016Publication date: February 2, 2017Inventors: Norihito Konno, Yoshihiro Ihara, Tomoharu Fujii
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Patent number: 9508670Abstract: A semiconductor device includes a support body provided with a wiring layer that includes a first pad; a first semiconductor chip; a first relay substrate stacked on the first semiconductor chip through a first non-conductive adhesion layer and including a first conductive portion and a first protruding electrode electrically connected to the first conductive portion; a second semiconductor chip stacked on the first relay substrate through a second non-conductive adhesion layer, the first protruding electrode of the first relay substrate penetrating the second non-conductive adhesion layer to be connected to the second semiconductor chip; and a first metal wire formed at the first relay substrate to be connected to the first conductive portion for electrically connecting the first conductive portion with the first pad of the wiring layer of the support body.Type: GrantFiled: October 20, 2014Date of Patent: November 29, 2016Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Koji Hara, Yoshihiro Ihara
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Patent number: 9245856Abstract: A semiconductor device includes a wiring substrate. The wiring substrate includes a first surface, a second surface located at an opposite side of the first surface, a cavity formed in the first surface, an electrode pad formed on the first surface surrounding the cavity, and a high frequency wire exposed on the first surface. A semiconductor element is accommodated in the cavity. A bonding wire connects the semiconductor element and the electrode pad. A first protection film is arranged on the first surface of the wiring substrate to cover the first surface, the semiconductor element, the electrode pad, the bonding wire, and the high frequency wire.Type: GrantFiled: January 6, 2015Date of Patent: January 26, 2016Assignee: Shinko Electric Industries Co., Ltd.Inventors: Tomoharu Fujii, Yoshihiro Ihara
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Publication number: 20150327397Abstract: A semiconductor device includes a wiring substrate, a semiconductor element mounted on the wiring substrate, and a heat dissipation component arranged on the wiring substrate. The heat dissipation component includes a cavity that accommodates the semiconductor element and includes an inner surface opposing the wiring substrate. The semiconductor element is located between the inner surface of the cavity and the wiring substrate. A heat conductor is bonded to the semiconductor element and to the inner surface of the cavity. The heat conductor includes linear heat conductive matters arranged between the semiconductor element and the heat dissipation component. A first alloy layer bonded to the semiconductor element covers lower ends of the heat conductive matters. The heat dissipation component includes a through hole extending through the heat dissipation component toward the heat conductor from a location outside of the heat conductor in a plan view.Type: ApplicationFiled: April 23, 2015Publication date: November 12, 2015Applicant: Shinko Electric Industries Co., LTD.Inventors: Kei Murayama, Yoshihiro Ihara
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Publication number: 20150262957Abstract: A semiconductor package includes a wiring substrate including a first surface and a second surface that are opposed to each other, a plurality of mounting pads arranged on the first surface, and a plurality of connection pads arranged on the second surface, and a plurality of connection members respectively connected to the connection pads. Each of the connection members includes a holding member opposing the second surface of the wiring substrate, and a plurality of elastic and conductive connection terminals. Each of the connection terminals includes a first end and a second end. The first end is held by the holding member so that the first end is exposed from a surface of the holding member that is located at a side opposite to the wiring substrate. The second end is connected to a corresponding one of the connection pads.Type: ApplicationFiled: March 4, 2015Publication date: September 17, 2015Applicant: Shinko Electric Industries Co., LTD.Inventor: Yoshihiro Ihara
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Publication number: 20150221599Abstract: A semiconductor device includes a wiring substrate. The wiring substrate includes a first surface, a second surface located at an opposite side of the first surface, a cavity formed in the first surface, an electrode pad formed on the first surface surrounding the cavity, and a high frequency wire exposed on the first surface. A semiconductor element is accommodated in the cavity. A bonding wire connects the semiconductor element and the electrode pad. A first protection film is arranged on the first surface of the wiring substrate to cover the first surface, the semiconductor element, the electrode pad, the bonding wire, and the high frequency wire.Type: ApplicationFiled: January 6, 2015Publication date: August 6, 2015Inventors: Tomoharu Fujii, Yoshihiro Ihara
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Publication number: 20150130053Abstract: A semiconductor device includes a support body provided with a wiring layer that includes a first pad; a first semiconductor chip; a first relay substrate stacked on the first semiconductor chip through a first non-conductive adhesion layer and including a first conductive portion and a first protruding electrode electrically connected to the first conductive portion; a second semiconductor chip stacked on the first relay substrate through a second non-conductive adhesion layer, the first protruding electrode of the first relay substrate penetrating the second non-conductive adhesion layer to be connected to the second semiconductor chip; and a first metal wire formed at the first relay substrate to be connected to the first conductive portion for electrically connecting the first conductive portion with the first pad of the wiring layer of the support body.Type: ApplicationFiled: October 20, 2014Publication date: May 14, 2015Inventors: Koji HARA, Yoshihiro IHARA
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Publication number: 20140370365Abstract: A battery includes a supporting substrate, resin layers, and a plurality of cells. Each resin layer includes a first resin and has 0.5 MPa to 10 MPa in tensile strength. The cells are stacked on the supporting substrate with the resin layers between the cells.Type: ApplicationFiled: June 3, 2014Publication date: December 18, 2014Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kazuyuki KUBOTA, Mitsuhiro AIZAWA, Yoshihiro IHARA
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Patent number: 8827730Abstract: There is provided a socket. The socket includes: a wiring substrate including a first surface and a second surface opposite to the first surface; a plurality of connection terminals provided on the wiring substrate and each including a contact portion, wherein the connection terminals extend from the first surface of the wiring substrate; and a positioning member formed in a frame shape and provided on the wiring substrate to surround the connection terminals. The positioning member includes a sidewall plate having a plurality of holes formed therethrough.Type: GrantFiled: December 7, 2011Date of Patent: September 9, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventor: Yoshihiro Ihara