Patents by Inventor Yoshihiro Ikuma

Yoshihiro Ikuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOUND INSULATION MATERIAL
    Publication number: 20150034414
    Abstract: The performance of a sound insulation material in which chips are utilized is improved. The sound insulation material includes a chip layer containing many chips. The chip layer is covered with a coat, and the chip layer includes an unbreathable intermediate membrane layer dividing the chip layer into a plurality of layers.
    Type: Application
    Filed: July 3, 2013
    Publication date: February 5, 2015
    Inventors: Mitsuaki Arata, Hiroaki Kaneda, Shinichiro Emori, Taisuke Kameoka, Yoshihiro Kohara, Yoshihiro Ikuma