Patents by Inventor Yoshihiro IMAGAWA

Yoshihiro IMAGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220077839
    Abstract: Provided is a joined body including a piezoelectric substrate and a polycrystalline spinel substrate provided on one main surface of the piezoelectric substrate, wherein a ratio T1/T2 between T1 and T2 is 0.1 or less, where the T1 represents an average thickness of the piezoelectric substrate and the T2 represents an average thickness of the polycrystalline spinel substrate, and the polycrystalline spinel substrate has a TTV of 1.5 ?m or less in a main surface which contacts the piezoelectric substrate.
    Type: Application
    Filed: January 18, 2019
    Publication date: March 10, 2022
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Masato HASEGAWA, Yuichiro YAMANAKA, Yoshihiro IMAGAWA, Hirohisa SAITO
  • Publication number: 20220069802
    Abstract: Provided is a joined body including a piezoelectric substrate and a polycrystalline spinel substrate provided on one main surface of the piezoelectric substrate, wherein the polycrystalline spinel substrate has a porosity of 0.005% or more and 0.6% or less.
    Type: Application
    Filed: January 18, 2019
    Publication date: March 3, 2022
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Hirohisa SAITO, Shigeru NAKAYAMA, Yoshihiro IMAGAWA, Keiichiro GESHI, Yuichiro YAMANAKA