Abstract: A semiconductor device is provided, including a seal portion; an electronic element within the seal portion; first, second, and third lead terminals; first and second connecting elements; and first and second conductive bonding agents, one end of the first connecting element having a protrusion downward and electrically connected to a control electrode of the electronic element with the first conductive bonding agent, a first side surface extending from the one end to the other end of the first connecting element is parallel to an extending direction along which the one end of the second connecting element extends, a wall portion being disposed on a top surface of the one end of the second lead terminal, and the wall portion being in contact with the other end of the first connecting element.

Abstract: An electronic module includes a power supply wiring line disposed on a substrate along a first side and connected to a power supply terminal, a ground wiring line disposed on the substrate along a second side and connected to a ground terminal, and first to third half bridges each having a high-side switch and a low-side switch connected in series between the power supply wiring line and the ground wiring line. Connection points of the high-side switches and the low-side switches are connected to first to third motor terminals and also connected in parallel to one another. The first motor terminal, the second motor terminal, and the third motor terminal are disposed between the power supply terminal and the ground terminal.

Abstract: A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein the first ground terminal GND1, the second ground terminal GND2, and the third ground terminal GND3 are arranged along the second side B2 to be separated from one another and electrically isolated from one another.

Abstract: An electronic module has a sealing part 90; a rear surface-exposed conductor 10, 20, 30 having a rear surface-exposed part 12, 22, 32 whose rear surface is exposed; a rear surface-unexposed conductor 40, 50 whose rear surface is not exposed; an electronic element 15, 25, which is provided in the sealing part 90 and provided on a front surface of the rear surface-exposed conductor 40, 50; a first connector 60 for electrically connecting the electronic element 15, 25 with the rear surface-exposed conductor 10, 20, 30; and a second connector 70 for electrically connecting the electronic element 15, 25 with the rear surface-unexposed conductor 40, 50. A thickness T1 of the first connector 60 is thicker than a thickness T2 of the second connector 70.

Abstract: An electronic module has a sealing part 90; electronic elements 15, 25 provided in the sealing part 90; rear surface-exposed conductors 10, 20, 30 having rear surface-exposed parts whose rear surface are exposed from the sealing part 90, and having one-terminal parts 11, 21, 31, which extend from the rear surface-exposed parts 12, 22, 32 and protrude outwardly from a side of the sealing part 90; and rear surface-unexposed conductors 40, 50 having unexposed parts 42, 52, which are sealed in the sealing part 90, and having other-terminal parts 41, 51, which extend from the unexposed parts 42, 52 and protrude outwardly from a side of the sealing part 90. The electronic elements 15, 25 are placed on the rear surface-exposed parts 12, 22, 32. The other-terminal parts 41, 51 have a width narrower than a width of the one-terminal parts 11, 21, 31.

Abstract: An electronic module has a rear surface-exposed conductor 10, 20, 30 having a rear surface-exposed part 12, 22, 32 whose rear surface is exposed; an electronic element 15, 25 provided on a front surface of the rear surface-exposed conductor 10, 20, 30; and a connector 60 configure to connect the rear surface-exposed conductor 10, 20, 30 and the electronic element 15, 25 or two rear surface-exposed conductors 10, 20, 30 each other. A groove 150 is provided on the front surface of the rear surface-exposed conductor 10, 20, 30. The sealing part 90 is provided with a press hole or a press impression 110, 120, 130 used to press the rear surface-exposed conductor 10, 20, 30. In an in-plane direction, a center portion of the press hole or the press impression 110, 120, 130 is provided on the side opposite to the connector 60 or the electronic element 15, 25 with respect to the groove 150.

Abstract: A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein a first gap M1 between side surfaces of the first and the second central wiring lines, which side surfaces are close to each other and face each other, and a second gap M2 between side surfaces of the second and the third central wiring lines, which side surfaces are close to each other and face each other, are bent on the top surface of the substrate.

Abstract: An electronic module includes a shunt resistor having one end that is connected to one end of a first ground wiring line and another end that is connected to another end of a second ground wiring line. Signal terminals are disposed to be close to the shunt resistor, the signal terminals including a first current detection terminal electrically connected to the one end of the shunt resistor, and a second current detection terminal disposed to be close to the shunt resistor and electrically connected to the other end of the shunt resistor. The shunt resistor is disposed to be close to a first side of a substrate along which the signal terminals are arranged.

Abstract: An electronic module comprises a sealing part 90, a rear surface-exposed conductor 10, 20, 30, a rear surface-unexposed conductor 40, 50 and a second connector 70 for electrically connecting an electronic element 15, 25 to the rear surface-unexposed conductor 40, 50. The rear surface-unexposed conductor 40, 50 is positioned on a front surface side compared with the rear surface-exposed part 12, 22, 32. The second connection tip part 72 is positioned on a rear surface side compared with the second connection base part 71. A distance H in a thickness direction between a rear surface side end part of the second connection base part 71 and a rear surface side end part of the second connection tip part 72 is larger than a width W of the second connection tip part 72 of the second connector 70.

Abstract: A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein the first to the third control signal terminals Q1, Q2, and Q3 are arranged in a direction along which the first side B1 extends in a manner that one ends of the first to the third control signal terminals are in the vicinity of the first side B1 of the substrate B, and wherein the fourth to the sixth control signal terminals Q4, Q5, and Q6 are arranged in a direction along which the second side B2 extends in a manner that one ends of the fourth to the sixth control signal terminals are in the vicinity of the second side B2 of the substrate B.

Abstract: An electronic module has a sealing part 90; a rear surface-exposed conductor 10, 20, 30 having a rear surface-exposed part 12, 22, 32 whose rear surface is exposed; a rear surface-unexposed conductor 40, 50 whose rear surface is not exposed; an electronic element 15, 25, which is provided in the sealing part 90 and provided on a front surface of the rear surface-exposed conductor 40, 50; a first connector 60 for electrically connecting the electronic element 15, 25 with the rear surface-exposed conductor 10, 20, 30; and a second connector 70 for electrically connecting the electronic element 15, 25 with the rear surface-unexposed conductor 40, 50. A thickness T1 of the first connector 60 is thicker than a thickness T2 of the second connector 70.

Abstract: A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein a first gap M1 between side surfaces of the first and the second central wiring lines, which side surfaces are close to each other and face each other, and a second gap M2 between side surfaces of the second and the third central wiring lines, which side surfaces are close to each other and face each other, are bent on the top surface of the substrate.

Abstract: A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein the first to the third control signal terminals Q1, Q2, and Q3 are arranged in a direction along which the first side B1 extends in a manner that one ends of the first to the third control signal terminals are in the vicinity of the first side B1 of the substrate B, and wherein the fourth to the sixth control signal terminals Q4, Q5, and Q6 are arranged in a direction along which the second side B2 extends in a manner that one ends of the fourth to the sixth control signal terminals are in the vicinity of the second side B2 of the substrate B.

Abstract: A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein the first to the third control signal terminals Q1, Q2, and Q3 are arranged in a direction along which the first side B1 extends in a manner that one ends of the first to the third control signal terminals are in the vicinity of the first side B1 of the substrate B, and wherein the fourth to the sixth control signal terminals Q4, Q5, and Q6 are arranged in a direction along which the second side B2 extends in a manner that one ends of the fourth to the sixth control signal terminals are in the vicinity of the second side B2 of the substrate B.

Abstract: A semiconductor device includes: a seal portion; a first electronic element; a first lead terminal; a second lead terminal having one end that is disposed to be close to the one end of the first lead terminal within the seal portion, and another end that is exposed from another end of the seal portion, the other end of the seal portion being along the longitudinal direction; a first connecting element disposed within the seal portion, and having one end that is electrically connected to the first electrode disposed on the first electronic element, and another end that is electrically connected to the one end of the second lead terminal; and a conductive bonding agent.

Abstract: An electronic module includes a shunt resistor having one end that is connected to one end of a first ground wiring line and another end that is connected to another end of a second ground wiring line. Signal terminals are disposed to be close to the shunt resistor, the signal terminals including a first current detection terminal electrically connected to the one end of the shunt resistor, and a second current detection terminal disposed to be close to the shunt resistor and electrically connected to the other end of the shunt resistor. The shunt resistor is disposed to be close to a first side of a substrate along which the signal terminals are arranged.

Abstract: An electronic module includes a power supply wiring line disposed on a substrate along a first side and connected to a power supply terminal, a ground wiring line disposed on the substrate along a second side and connected to a ground terminal, and first to third half bridges each having a high-side switch and a low-side switch connected in series between the power supply wiring line and the ground wiring line. Connection points of the high-side switches and the low-side switches are connected to first to third motor terminals and also connected in parallel to one another. The first motor terminal, the second motor terminal, and the third motor terminal are disposed between the power supply terminal and the ground terminal.

Abstract: A semiconductor device includes: a seal portion; a first electronic element; a first lead terminal; a second lead terminal having one end that is disposed to be close to the one end of the first lead terminal within the seal portion, and another end that is exposed from another end of the seal portion, the other end of the seal portion being along the longitudinal direction; a first connecting element disposed within the seal portion, and having one end that is electrically connected to the first electrode disposed on the first electronic element, and another end that is electrically connected to the one end of the second lead terminal; and a conductive bonding agent.

Abstract: A semiconductor device includes: a seal portion; an electronic element disposed within the seal portion; a first lead terminal; a second lead terminal having one end that is disposed to be close to the one end of the first lead terminal within the seal portion, and another end that is exposed from the seal portion; a first connecting element disposed within the seal portion, and having one end that is electrically connected to a control electrode of the electronic element, and another end that is electrically connected to the one end of the second lead terminal; a first conductive bonding agent for joining together the control electrode of the electronic element and the one end of the first connecting element in a conductive manner; and a second conductive bonding agent.

Abstract: An electronic module has a sealing part 90; electronic elements 15, 25 provided in the sealing part 90; back-surface exposed conductors 10, 20, 30 having back-surface exposed parts 12, 22, 32, which have back surfaces exposed from the sealing part 90, and having one-terminal parts 11, 21, 31, which extend from the back-surface exposed parts 12, 22, 32 and protrude outward from a side of the sealing part 90; and back-surface unexposed conductors 40, 50 having unexposed parts 42, 52, which are sealed in the sealing part 90, and having other-terminal parts 41, 51, which extend from the unexposed parts 42, 52 and protrude outward from a side of the sealing part 90. The electronic elements 15, 25 are placed on the back-surface exposed parts 12, 22, 32. The other-terminal parts 41, 51 have a width narrower than a width of the one-terminal parts 11, 21, 31.