Abstract: A semiconductor device includes a flexible wiring substrate. The wiring substrate includes at least two mounting portions and at least one connecting portion. The mounting portions are stacked spaced apart from each other. Each connecting portion is bent to connect two mounting portions that are adjacent in a stacking direction. The semiconductor device further includes at least one semiconductor chip mounted on at least one of the at least two mounting portions and a plurality of conductive connecting members connecting the mounting portions to each other in the stacking direction.

Abstract: A wiring substrate includes a plurality of wiring layers, a component mounting part on which an electronic component can be mounted, and a component non-mounting part on which an electronic component cannot be mounted. A portion located in the component non-mounting part of one wiring layer of the plurality of the wiring layers includes a plurality of first through-holes having an elongated shape as seen from above and aligned with predetermined intervals with longitudinal directions of the first through-holes being faced toward a direction perpendicular to a longitudinal direction of the wiring substrate.

Abstract: A wiring substrate includes a plurality of wiring layers, a component mounting part on which an electronic component can be mounted, and a component non-mounting part on which an electronic component cannot be mounted. A portion located in the component non-mounting part of one wiring layer of the plurality of the wiring layers includes a plurality of first through-holes having an elongated shape as seen from above and aligned with predetermined intervals with longitudinal directions of the first through-holes being faced toward a direction perpendicular to a longitudinal direction of the wiring substrate.

Abstract: An interconnect substrate includes an insulating layer having a first resin layer and a second resin layer covering an upper surface of the first resin layer, a first conductive layer having an upper surface and side surfaces covered with the first resin layer, a lower surface of the first conductive layer being exposed from a lower surface of the first resin layer, and a second conductive layer including an interconnect pattern and a via interconnect, the interconnect pattern being disposed on an upper surface of the second resin layer, the via interconnect penetrating through both the second resin layer and the first resin layer to connect the interconnect pattern to the upper surface of the first conductive layer, wherein the first resin layer is made of a resin having a higher modulus of elasticity and a lower coefficient of elongation than the second resin layer.

Abstract: An interconnect substrate includes an insulating layer having a first resin layer and a second resin layer covering an upper surface of the first resin layer, a first conductive layer having an upper surface and side surfaces covered with the first resin layer, a lower surface of the first conductive layer being exposed from a lower surface of the first resin layer, and a second conductive layer including an interconnect pattern and a via interconnect, the interconnect pattern being disposed on an upper surface of the second resin layer, the via interconnect penetrating through both the second resin layer and the first resin layer to connect the interconnect pattern to the upper surface of the first conductive layer, wherein the first resin layer is made of a resin having a higher modulus of elasticity and a lower coefficient of elongation than the second resin layer.

Abstract: A semiconductor device includes a flexible wiring substrate. The wiring substrate includes at least two mounting portions and at least one connecting portion. The mounting portions are stacked spaced apart from each other. Each connecting portion is bent to connect two mounting portions that are adjacent in a stacking direction. The semiconductor device further includes at least one semiconductor chip mounted on at least one of the at least two mounting portions and a plurality of conductive connecting members connecting the mounting portions to each other in the stacking direction.

Abstract: The operation efficiency and accuracy of the simultaneous analysis of phospholipids, including fatty acid compositions are increased. After a first-time LC/MS/MS analysis for determining the phospholipid classes of the phospholipid contained in a sample is performed (S2-S3), a second-time LC/MS/MS analysis for determining fatty acid compositions is performed only for the detected phospholipids (S4-S8). By associating a method list in which an MRM transition for phospholipid class determination is recorded for each compound of phospholipid classes with a method list in which an MRM transition for fatty acid composition determination is recorded for each phospholipid compound, it is possible to promptly select MRM transitions for fatty acid composition determination that correspond to compounds of the detected phospholipid classes, and to easily create an analysis method for the second-time analysis.

Abstract: The operation efficiency and accuracy of the simultaneous analysis of phospholipids, including fatty acid compositions are increased. After a first-time LC/MS/MS analysis for determining the phospholipid classes of the phospholipid contained in a sample is performed (S2-S3), a second-time LC/MS/MS analysis for determining fatty acid compositions is performed only for the detected phospholipids (S4-S8). By associating a method list in which an MRM transition for phospholipid class determination is recorded for each compound of phospholipid classes with a method list in which an MRM transition for fatty acid composition determination is recorded for each phospholipid compound, it is possible to promptly select MRM transitions for fatty acid composition determination that correspond to compounds of the detected phospholipid classes, and to easily create an analysis method for the second-time analysis.

Abstract: A production method of a water-absorbent resin includes the steps of: obtaining a hydrogel by supplying monomer liquid to a reaction device so that the monomer liquid is polymerized; and detaching the hydrogel from the reaction device, wherein the reaction device's surface in contact with the monomer liquid at a position where polymerization occurs is made of a fluororesin having a melt viscosity of less than 1×108 poise at 380° C. On this account, it is possible to obtain a water-absorbent resin having less amounts of an extractable content with high productivity and it is possible to carry out continuous production for an extended period of time.

Abstract: The separating and holding apparatus of the invention is for separating products which have been cut out of a workpiece, and a remainder (skeleton) of the workpiece from each other, and for carrying and holding the products and the remainder. The apparatus includes a workpiece holding table, skeleton holding table provided beside the workpiece holding table, truck unit, product holding table provided on the truck unit, skeleton holding member provided below the product holding table. The truck unit horizontally moves so as to have the product holding table above the workpiece holding table and the skeleton holding table, in turn. The skeleton holding member lifts the skeleton from the workpiece on the workpiece holding table, separates the skeleton from the products. The skeleton is transferred to the skeleton holding table, and the products are deposited on the product holding table by the function of the product holding member.

Abstract: A production method of a water-absorbent resin includes the steps of: obtaining a hydrogel by supplying monomer liquid to a reaction device so that the monomer liquid is polymerized; and detaching the hydrogel from the reaction device, wherein the reaction device's surface in contact with the monomer liquid at a position where polymerization occurs is made of a fluororesin having a melt viscosity of less than 1×108 poise at 380° C. On this account, it is possible to obtain a water-absorbent resin having less amounts of an extractable content with high productivity and it is possible to carry out continuous production for an extended period of time.

Abstract: The invention relates to a gas hydrate dewatering cooling and outputting apparatus which dewaters and solidifies gas hydrate slurry and takes out the solidified gas hydrate under ambient pressure. The apparatus comprises an output apparatus body 31 having a supply port 32 for the gas hydrate slurry on an upper part of a pressure vessel, a screw extruder 33 provided at a lower part inside the output apparatus body 31 and having a drain 37 and an outlet sealing device, and a cooling device 41 which cools the vicinity of the outlet 39 of the screw extruder 33. According to such a construction, slurry gas hydrate can be efficiently and continuously dewatered, cooled and solidified, and gas hydrate powder can be consolidated into blocks and taken out to the atmosphere.