Patents by Inventor Yoshihiro Kodaira
Yoshihiro Kodaira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240431041Abstract: A semiconductor module includes a circuit board mounted on a base, a case having a sidewall and a lid and covering the circuit board, a plurality of conductive plates each parallel to a predetermined plane, electrically connected to different conductive patterns. The lid of the case has a partition that protrudes from an inner surface of the lid toward the base between two of the conductive plates. The partition has a first portion at a position where the partition and the conductive plates overlap each other, and a second portion at a position where the partition and the conductive plates do not overlap each other in a side view. The second portion has a cutout section disposed such that in a depth direction, a distance from the base to the second portion is greater than a distance from the base to the first portion.Type: ApplicationFiled: August 30, 2024Publication date: December 26, 2024Applicant: FUJI ELECTRIC CO., LTD.Inventors: Taichi ITOH, Yoshihiro KODAIRA
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Publication number: 20240404912Abstract: A semiconductor device includes a base plate that includes a body plate containing a silicon carbide, a metal-filled body having a top surface and a bottom surface opposite to each other and having a through hole, and a protective member disposed on the bottom surface of the metal-filled body and having a hardness less than a hardness of the body plate, an insulating board disposed on the base plate, a semiconductor element mounted on a top surface of the base plate via the insulating board, and a cooling member attached to a bottom surface of the base plate and fastened to the base plate with a screw that passes through the through-hole.Type: ApplicationFiled: July 24, 2024Publication date: December 5, 2024Applicant: FUJI ELECTRIC CO., LTD.Inventors: Taichi ITOH, Yoshihiro KODAIRA
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Publication number: 20240075559Abstract: A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 6.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.Type: ApplicationFiled: November 10, 2023Publication date: March 7, 2024Applicant: FUJI ELECTRIC CO., LTD.Inventors: Hirohiko WATANABE, Shunsuke SAITO, Yoshihiro KODAIRA
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Patent number: 11850685Abstract: A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 5.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.Type: GrantFiled: March 1, 2019Date of Patent: December 26, 2023Assignee: FUJI ELECTRIC CO., LTD.Inventors: Hirohiko Watanabe, Shunsuke Saito, Yoshihiro Kodaira
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Publication number: 20230345637Abstract: A semiconductor device includes a first insulated circuit board that is rectangular with first to fourth sides, including a first input wiring board and a first output wiring board each extending in a first direction parallel to the first side and being adjacent to each other. The first output wiring board includes a first output region electrically connected to a first output terminal and a first connection wiring region electrically connected to the output electrodes of the plurality of first semiconductor chips and being closer to the second side than is the first output region. The first connection wiring region has a first slit extending in the first direction from an end of the first connection wiring region at a side thereof where the first output region is located.Type: ApplicationFiled: March 13, 2023Publication date: October 26, 2023Applicant: FUJI ELECTRIC CO., LTD.Inventors: Yoshihiro KODAIRA, Yusuke SEKINO, Taichi ITOH
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Patent number: 11107787Abstract: A member for semiconductor device includes a metal portion configured to be bonded to another member by solder, and a treated coating covering a surface of the metal portion, the treated coating including a treatment agent. The treated coating vaporizes at a temperature lower than or equal to a solidus temperature of the solder.Type: GrantFiled: November 8, 2018Date of Patent: August 31, 2021Assignee: FUJI ELECTRIC CO., LTD.Inventors: Shinji Sano, Yoshihiro Kodaira, Masayuki Soutome, Kazunaga Onishi
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Patent number: 10777473Abstract: Provided is a semiconductor device having: a terminal portion having a through hole is formed on a principal surface portion; and a casing portion in which an opening to make the principal surface portion of the terminal portion exposed is provided, wherein the opening has a corner portion corresponding to a corner of the principal surface portion of the terminal portion, wherein the casing portion has a thick portion, in which thickness of a resin may be greater than that of a middle portion between adjacent corner portions across two sides forming the corner portion, in a surrounding area of the opening. Furthermore, a slit portion extending outward from the corner portion may be formed in the casing portion. At least a part of the outline of the slit portion as viewed from the upper surface direction of the casing portion may be curved.Type: GrantFiled: December 21, 2018Date of Patent: September 15, 2020Assignee: FUJI ELECTRIC CO., LTD.Inventor: Yoshihiro Kodaira
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Patent number: 10522434Abstract: A semiconductor device is provided. The semiconductor device includes a terminal portion and a casing portion. The terminal portion has a through hole in a principal surface portion. The casing portion has a depression at a position facing the through hole and has an end surface facing portion facing an end surface of the terminal portion. An end surface protruding portion is provided on at least one of the end surface and the end surface facing portion.Type: GrantFiled: December 27, 2017Date of Patent: December 31, 2019Assignee: FUJI ELECTRIC CO., LTD.Inventor: Yoshihiro Kodaira
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Patent number: 10504868Abstract: The present invention suppresses fracture at an interface between different materials, and provides a solder joining which includes: a solder joining layer 10 having a melted solder material, containing Sb at more than 5.0% by mass and 10.0% by mass or less, Ag at 2.0 to 4.0% by mass, Ni at more than 0 and 1.0% by mass or less, and a balance made up of Sn and inevitable impurities; and joining members 11 and 123 at least one of which is a Cu or Cu-alloy member 123, in which the solder joining layer includes a first structure 1 containing (Cu, Ni)6(Sn, Sb)5 and a second structure 2 containing (Ni, Cu)3(Sn, Sb)X (in the formula, X is 1, 2, or 4) at an interface with the Cu or Cu-alloy member 123, and an electronic device and a semiconductor device including the solder joining.Type: GrantFiled: May 31, 2018Date of Patent: December 10, 2019Assignee: FUJI ELECTRIC CO., LTD.Inventors: Hirohiko Watanabe, Shunsuke Saito, Yoshihiro Kodaira
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Publication number: 20190193210Abstract: A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 5.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.Type: ApplicationFiled: March 1, 2019Publication date: June 27, 2019Applicant: FUJI ELECTRIC CO., LTD.Inventors: Hirohiko WATANABE, Shunsuke Saito, Yoshihiro Kodaira
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Publication number: 20190157171Abstract: Provided is a semiconductor device having: a terminal portion having a through hole is formed on a principal surface portion; and a casing portion in which an opening to make the principal surface portion of the terminal portion exposed is provided, wherein the opening has a corner portion corresponding to a corner of the principal surface portion of the terminal portion, wherein the casing portion has a thick portion, in which thickness of a resin may be greater than that of a middle portion between adjacent corner portions across two sides forming the corner portion, in a surrounding area of the opening. Furthermore, a slit portion extending outward from the corner portion may be formed in the casing portion. At least a part of the outline of the slit portion as viewed from the upper surface direction of the casing portion may be curved.Type: ApplicationFiled: December 21, 2018Publication date: May 23, 2019Inventor: Yoshihiro KODAIRA
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Patent number: 10297533Abstract: A semiconductor device is provided, including: a bottom portion having a pad formed of a conductive material; a lid portion covering at least a part of the bottom portion; and a first terminal portion and a second terminal portion which are provided in parallel with each other, are fixed to the lid portion, and each contact a corresponding pad, wherein: the first terminal portion is provided with a first plate-shaped portion; the second terminal portion is provided with a second plate-shaped portion; and each of the first plate-shaped portion and the second plate-shaped portion has a principal surface in a direction facing the pad and is flexible in a direction toward the pad.Type: GrantFiled: December 27, 2017Date of Patent: May 21, 2019Assignee: FUJI ELECTRIC CO., LTD.Inventor: Yoshihiro Kodaira
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Publication number: 20190081020Abstract: A member for semiconductor device includes a metal portion configured to be bonded to another member by solder, and a treated coating covering a surface of the metal portion, the treated coating including a treatment agent. The treated coating vaporizes at a temperature lower than or equal to a solidus temperature of the solder.Type: ApplicationFiled: November 8, 2018Publication date: March 14, 2019Inventors: Shinji SANO, Yoshihiro KODAIRA, Masayuki SOUTOME, Kazunaga ONISHI
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Patent number: 10153246Abstract: There is provided a method for producing a member for semiconductor device which can reduce generation of a large number of voids in a solder-bonded portion without increasing production cost. The method includes the step of preparing a first member including a metal portion capable of being bonded by solder and the step of coating the surface of the metal portion of the first member with a treatment agent to form a treated coating which vaporizes at a temperature lower than or equal to the solidus temperature of the solder.Type: GrantFiled: November 30, 2016Date of Patent: December 11, 2018Assignee: FUJI ELECTRIC CO., LTD.Inventors: Shinji Sano, Yoshihiro Kodaira, Masayuki Soutome, Kazunaga Onishi
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Publication number: 20180277506Abstract: The present invention suppresses fracture at an interface between different materials, and provides a solder joining which includes: a solder joining layer 10 having a melted solder material, containing Sb at more than 5.0% by mass and 10.0% by mass or less, Ag at 2.0 to 4.0% by mass, Ni at more than 0 and 1.0% by mass or less, and a balance made up of Sn and inevitable impurities; and joining members 11 and 123 at least one of which is a Cu or Cu-alloy member 123, in which the solder joining layer includes a first structure 1 containing (Cu, Ni)6(Sn, Sb)5 and a second structure 2 containing (Ni, Cu)3(Sn, Sb)X (in the formula, X is 1, 2, or 4) at an interface with the Cu or Cu-alloy member 123, and an electronic device and a semiconductor device including the solder joining.Type: ApplicationFiled: May 31, 2018Publication date: September 27, 2018Applicant: FUJI ELECTRIC CO., LTD.Inventors: Hirohiko WATANABE, Shunsuke SAITO, Yoshihiro KODAIRA
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Patent number: 10070527Abstract: When a nut housing member is inserted from a first opening portion into a case (terminal housing area) in a semiconductor device, first and second protrusions of the nut housing member slide on and pass through the first and second opening portions. Ultimately, the nut housing member is housed in the case (terminal housing area), with the first protrusion being in contact with a lower end of the second opening portion and the second protrusion being in contact with a lower end of the first opening portion. Even if the nut housing member is not inserted in parallel with the terminal housing area, the forefront does not hit against a first beam. Therefore, the nut housing member is inserted stably and housed reliably in the terminal housing area of the case, and the assemblability of the nut housing member with respect to the case is improved.Type: GrantFiled: July 1, 2016Date of Patent: September 4, 2018Assignee: FUJI ELECTRIC CO., LTD.Inventor: Yoshihiro Kodaira
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Publication number: 20180122723Abstract: A semiconductor device is provided, including: a bottom portion having a pad formed of a conductive material; a lid portion covering at least a part of the bottom portion; and a first terminal portion and a second terminal portion which are provided in parallel with each other, are fixed to the lid portion, and each contact a corresponding pad, wherein: the first terminal portion is provided with a first plate-shaped portion; the second terminal portion is provided with a second plate-shaped portion; and each of the first plate-shaped portion and the second plate-shaped portion has a principal surface in a direction facing the pad and is flexible in a direction toward the pad.Type: ApplicationFiled: December 27, 2017Publication date: May 3, 2018Inventor: Yoshihiro KODAIRA
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Publication number: 20180122715Abstract: A semiconductor device is provided. The semiconductor device includes a terminal portion and a casing portion. The terminal portion has a through hole in a principal surface portion. The casing portion has a depression at a position facing the through hole and has an end surface facing portion facing an end surface of the terminal portion. An end surface protruding portion is provided on at least one of the end surface and the end surface facing portion.Type: ApplicationFiled: December 27, 2017Publication date: May 3, 2018Inventor: Yoshihiro KODAIRA
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Patent number: 9941254Abstract: A semiconductor device 10 includes: multi-layered substrates 12 each having a circuit board 12c; control terminals 14 whose one end is fixed on the circuit board 12c of each multi-layered substrate 12; a resin case 15 which has openings 20 and is arranged to cover the multi-layered substrates 12, through which openings 20 the other ends of the control terminals 14 extend outwardly; and resin blocks 18 which are each inserted into the openings 20 of the resin case 15 and press-fixes the control terminals 14 against the side walls of the respective openings 20. The control terminals 14 each have a low-rigidity portion 14j at a position that is further interior of the resin case 15 than a position where each control terminal 14 is in contact with the resin block 18 in the respective openings 20 of the resin case 15.Type: GrantFiled: March 27, 2017Date of Patent: April 10, 2018Assignee: FUJI ELECTRIC CO., LTD.Inventor: Yoshihiro Kodaira
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Patent number: 9831152Abstract: A control terminal 14 of a semiconductor device has a recessed portion 14c. A resin case 15 is provided with a fixing member 152 engaging with and fixing a recessed portion 14c of a control terminal 14. The fixing member 152 is constituted by a resin block portion 154 having a step portion engaging with the recessed portion 14c, a nut-housing portion 153, and a beam portion 155 integrated by linking the resin block portion 154 and the nut-housing portion 153. A resin case main body 151 to which the fixing member 152 is fixed is provided with a hollow portion enabling insertion of the resin block portion 154. The nut-housing portion 153 of the fixing member 152 and the resin block portion 154 are attached to the resin case main body 151 from one direction.Type: GrantFiled: September 29, 2016Date of Patent: November 28, 2017Assignee: FUJI ELECTRIC CO., LTD.Inventors: Fumio Shigeta, Yoshihiro Kodaira