Abstract: A method for manufacturing a printed wiring board includes forming a base insulating layer, forming a conductor layer on the base layer, forming a solder resist layer on the base layer such that the resist layer covers the conductor layer, forming first opening exposing a first pad of the conductor layer, forming second opening exposing a second pad of the conductor layer and having diameter smaller than diameter of the first opening, forming a first bump on the first pad, and forming a second bump on the second pad such that the second bump has diameter smaller than diameter of the first bump. The first bump includes a first base plating layer and a first top plating layer, and the second bump includes a second base plating layer and a second top plating layer having upper surface higher than the uppermost position of upper surface of the first top layer.

Abstract: A stator unit for including a plurality of coils includes a stator core configured to have the coils wound around the stator core; and a routing member including a plurality of groove configured to have wires routed in the groove, the wires extending from the coils.

Abstract: A bus bar unit includes: a plurality of bus bars arranged to be laminated, the respective bus bars having conductivity, the respective bus bars having a hole part; an insulating member interposed between the bus bars, the insulating member having insulating property, the insulating member having a hole part; a positioning member formed by insulating resin, the positioning member having a pin protruding in direction of laminating the bus bars, the pin being inserted through the hole parts of the bus bars and the hole part of the insulating member; and a fixing part provided at a tip end of the pin, the fixing part being configured to fix the bus bars and the insulating member.

Abstract: A bus bar unit includes a bus bar for energizing a coil wound around a stator; and a bus bar holder formed by an insulating member and holds the bus bar. The bus bar holder includes an engaged part which is configured to be engaged with an engaging part formed at an extending part extended from the stator in axial direction of the stator.

Abstract: A method for manufacturing a printed wiring board includes forming a base insulating layer, forming a conductor layer on the base layer, forming a solder resist layer on the base layer such that the resist layer covers the conductor layer, forming first opening exposing a first pad of the conductor layer, forming second opening exposing a second pad of the conductor layer and having diameter smaller than diameter of the first opening, forming a first bump on the first pad, and forming a second bump on the second pad such that the second bump has diameter smaller than diameter of the first bump. The first bump includes a first base plating layer and a first top plating layer, and the second bump includes a second base plating layer and a second top plating layer having upper surface higher than the uppermost position of upper surface of the first top layer.

Abstract: A bus bar unit includes a bus bar for energizing a coil wound around a stator; and a bus bar holder formed by an insulating member and holds the bus bar. The bus bar holder includes an engaged part which is configured to be engaged with an engaging part formed at an extending part extended from the stator in axial direction of the stator.

Abstract: A bus bar unit includes: a plurality of bus bars arranged to be laminated, the respective bus bars having conductivity, the respective bus bars having a hole part; an insulating member interposed between the bus bars, the insulating member having insulating property, the insulating member having a hole part; a positioning member formed by insulating resin, the positioning member having a pin protruding in direction of laminating the bus bars, the pin being inserted through the hole parts of the bus bars and the hole part of the insulating member; and a fixing part provided at a tip end of the pin, the fixing part being configured to fix the bus bars and the insulating member.

Abstract: A stator unit for including a plurality of coils includes a stator core configured to have the coils wound around the stator core; and a routing member including a plurality of groove configured to have wires routed in the groove, the wires extending from the coils.

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Abstract: A composite layer composed of an Ni layer 72 and a Pd layer 73 is formed on a solder pad 77U, and a solder 76? on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by means of thermal stress.

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Abstract: A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Abstract: This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.