Abstract: In a solid-state imaging device, a material forming an underfill part is prevented from flowing toward a side of a pixel region, shortening of a distance between an end portion of an opening of a substrate and the pixel region is enabled, and miniaturization is promoted. The device includes: an imaging element having a pixel region including a large number of pixels on one plate surface of a semiconductor substrate; a substrate provided on the surface side with respect to the imaging element and having an opening for passing light to be received by the pixel region; and an underfill part including a cured fluid and covering a connection part that electrically connects the imaging element and the substrate, in which the substrate has a groove for guiding the fluid forming the underfill part in a direction away from the surface of the imaging element.

Abstract: In a solid-state imaging device, a material forming an underfill part is prevented from flowing toward a side of a pixel region, shortening of a distance between an end portion of an opening of a substrate and the pixel region is enabled, and miniaturization is promoted. The device includes: an imaging element having a pixel region including a large number of pixels on one plate surface of a semiconductor substrate; a substrate provided on the surface side with respect to the imaging element and having an opening for passing light to be received by the pixel region; and an underfill part including a cured fluid and covering a connection part that electrically connects the imaging element and the substrate, in which the substrate has a groove for guiding the fluid forming the underfill part in a direction away from the surface of the imaging element.

Abstract: In a solid-state imaging device, a material forming an underfill part is prevented from flowing toward a side of a pixel region, shortening of a distance between an end portion of an opening of a substrate and the pixel region is enabled, and miniaturization is promoted. The device includes: an imaging element having a pixel region including a large number of pixels on one plate surface of a semiconductor substrate; a substrate provided on the surface side with respect to the imaging element and having an opening for passing light to be received by the pixel region; and an underfill part including a cured fluid and covering a connection part that electrically connects the imaging element and the substrate, in which the substrate has a groove for guiding the fluid forming the underfill part in a direction away from the surface of the imaging element.

Abstract: Support arms are disposed on a tilting shaft on a bracket of an outboard motor. An electric actuator is mounted between the support arms. The electric actuator includes a cover member, first and second electric motors disposed individually on the opposite ends of the cover member, a feed screw configured to be rotated by the electric motors, a nut member configured to move along an axis as the feed screw rotates, a drive arm configured to move integrally with the nut member and transversely relative to the boat body, and protective boots. The drive arm is connected to a steering arm through an engaging member. If the drive arm moves in the direction of the axis along the cover member, the steering angle of the steering arm changes depending on the degree of movement of the drive arm.

Abstract: A case of a helm device is provided with a steering shaft. A rotation of the steering shaft is detected by a helm sensor. A friction generating mechanism is disposed in the case. The friction generating mechanism includes a rotor disposed on the steering shaft, an inner disk configured to rotate together with the rotor, an outer disk opposed to the inner disk, an electromagnetic actuator, and an armature configured to be driven by the electromagnetic actuator. An assist spring is disposed in the case. The assist spring urges the armature in such a direction as to press the disks against each other.

Abstract: A case of a helm device is provided with a steering shaft. A rotation of the steering shaft is detected by a helm sensor. A friction generating mechanism is disposed in the case. The friction generating mechanism includes a rotor disposed on the steering shaft, an inner disk configured to rotate together with the rotor, an outer disk opposed to the inner disk, an electromagnetic actuator, and an armature configured to be driven by the electromagnetic actuator. An assist spring is disposed in the case. The assist spring urges the armature in such a direction as to press the disks against each other.

Abstract: Support arms are disposed on a tilting shaft on a bracket of an outboard motor. An electric actuator is mounted between the support arms. The electric actuator includes a cover member, first and second electric motors disposed individually on the opposite ends of the cover member, a feed screw configured to be rotated by the electric motors, a nut member configured to move along an axis as the feed screw rotates, a drive arm configured to move integrally with the nut member and transversely relative to the boat body, and protective boots. The drive arm is connected to a steering arm through an engaging member. If the drive arm moves in the direction of the axis along the cover member, the steering angle of the steering arm changes depending on the degree of movement of the drive arm.

Abstract: To provide a low-cost semiconductor device that obtains a reduction in pitch and an increase in the number of pins using conventional equipment and to provide a method of manufacturing the semiconductor device. The semiconductor device according to the present invention includes: a flexible printed circuit, on which a semiconductor chip is mounted, having a connection terminal portion that includes a plurality of land-shaped connection terminals arranged in a step form or a grid form and an insulating film provided to a conductor connected with the respective land-shaped connection terminals.