Patents by Inventor Yoshihiro Mochizuki

Yoshihiro Mochizuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9669515
    Abstract: A polishing apparatus having a polishing pad surface property measuring device that is capable of measuring surface properties of a polishing pad in a state where a liquid film exists on the polishing pad is disclosed.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: June 6, 2017
    Assignees: Ebara Corporation, Kyushu Institute of Technology
    Inventors: Hisanori Matsuo, Yoshihiro Mochizuki, Keisuke Suzuki, Takahiro Tajiri, Souichirou Ichioka
  • Publication number: 20160184960
    Abstract: A polishing pad surface property measuring method which can measure surface properties of a polishing pad that reflect CMP performance by applying a laser beam to the polishing pad at a plurality of incident angles is disclosed. The method includes applying a laser beam to a surface of the polishing pad, and receiving light reflected by the surface of the polishing pad and performing Fourier transform on the received light to determine surface properties of the polishing pad. The laser beam is applied to the polishing pad at a plurality of incident angles.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 30, 2016
    Inventors: Hisanori MATSUO, Yoshihiro MOCHIZUKI, Keisuke SUZUKI, Takahiro TAJIRI, Panart KHAJORNRUNGRUANG
  • Patent number: 9242339
    Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus includes a polishing liquid supply nozzle for supplying a polishing liquid onto the polishing pad, a polishing liquid storage mechanism disposed on the polishing pad for storing the polishing liquid on the polishing pad by damming the polishing liquid, and a polishing liquid sensor for measuring a physical quantity representing the freshness of the polishing liquid stored by the polishing liquid storage mechanism. The polishing apparatus further includes a freshness measuring instrument for calculating the freshness of the stored polishing liquid from the physical quantity measured by the polishing liquid sensor, and a freshness controller for controlling supply conditions of the polishing liquid or storage state of the polishing liquid, based on the freshness of the polishing liquid that is determined by the freshness measuring instrument.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: January 26, 2016
    Assignee: Ebara Corporation
    Inventors: Hisanori Matsuo, Yoshihiro Mochizuki, Chikako Takatoh, Tadashi Obo
  • Publication number: 20150283669
    Abstract: A polishing apparatus having a polishing pad surface property measuring device that is capable of measuring surface properties of a polishing pad in a state where a liquid film exists on the polishing pad is disclosed.
    Type: Application
    Filed: March 11, 2015
    Publication date: October 8, 2015
    Inventors: Hisanori MATSUO, Yoshihiro MOCHIZUKI, Keisuke SUZUKI, Takahiro TAJIRI, Souichirou ICHIOKA
  • Patent number: 8965555
    Abstract: A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: February 24, 2015
    Assignee: Ebara Corporation
    Inventors: Akira Fukuda, Yoshihiro Mochizuki, Yutaka Wada, Yoichi Shiokawa, Hirokuni Hiyama
  • Publication number: 20140273753
    Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus includes a polishing liquid supply nozzle for supplying a polishing liquid onto the polishing pad, a polishing liquid storage mechanism disposed on the polishing pad for storing the polishing liquid on the polishing pad by damming the polishing liquid, and a polishing liquid sensor for measuring a physical quantity representing the freshness of the polishing liquid stored by the polishing liquid storage mechanism. The polishing apparatus further includes a freshness measuring instrument for calculating the freshness of the stored polishing liquid from the physical quantity measured by the polishing liquid sensor, and a freshness controller for controlling supply conditions of the polishing liquid or storage state of the polishing liquid, based on the freshness of the polishing liquid that is determined by the freshness measuring instrument.
    Type: Application
    Filed: March 10, 2014
    Publication date: September 18, 2014
    Inventors: Hisanori MATSUO, Yoshihiro MOCHIZUKI, Chikako TAKATOH, Tadashi OBO
  • Publication number: 20140120808
    Abstract: A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.
    Type: Application
    Filed: January 8, 2014
    Publication date: May 1, 2014
    Applicant: EBARA CORPORATION
    Inventors: Akira FUKUDA, Yoshihiro MOCHIZUKI, Yutaka WADA, Yoichi SHIOKAWA, Hirokuni HIYAMA
  • Patent number: 8655478
    Abstract: A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.
    Type: Grant
    Filed: September 24, 2009
    Date of Patent: February 18, 2014
    Assignee: Ebara Corporation
    Inventors: Akira Fukuda, Yoshihiro Mochizuki, Yutaka Wada, Yoichi Shiokawa, Hirokuni Hiyama
  • Patent number: 8148902
    Abstract: In a mercury-free arc tube, regions including molybdenum foils 17 of electrode assemblies each of which is formed by connecting and integrating an electrode 16, a molybdenum foil 17, and a lead wire 18, are pinch-sealed where the electrode 16 projects inside a closed glass bulb 12, which encloses luminescent substances, etc. The molybdenum foil 17 is doped with or coated with TiO2 in the form of discontinuous lands and subjected to surface roughening by etching including oxidation and reduction. TiO2 particles or a TiO2 layer exposed on the rough surface 17c of the molybdenum foil 17 increases chemical joining strength to glass and makes deeper, more complicated minute unevenness 17b on the molybdenum foil surface to increase the mechanical joining strength to glass, so that even when a heat stress occurs at the interface between the molybdenum foil and glass in the pinch-sealed portion, foil floating does not occur.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: April 3, 2012
    Assignee: Koito Manufacturing Co., Ltd.
    Inventors: Michio Takagaki, Akira Homma, Yoshihiro Mochizuki, Takeshi Fukuyo
  • Patent number: 8002607
    Abstract: A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) 201 and the wafer held by a holding member (top ring) 52 and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring 52 for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag 202 for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: August 23, 2011
    Assignee: Ebara Corporation
    Inventors: Akira Fukuda, Yoshihiro Mochizuki, Kazuto Hirokawa
  • Patent number: 7976358
    Abstract: A polishing apparatus polishes wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) and the wafer held by a holding member (top ring) and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.
    Type: Grant
    Filed: November 5, 2009
    Date of Patent: July 12, 2011
    Assignee: Ebara Corporation
    Inventors: Akira Fukuda, Yoshihiro Mochizuki, Kazuto Hirokawa
  • Patent number: 7967660
    Abstract: A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) 201 and the wafer held by a holding member (top ring) 52 and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring 52 for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag 202 for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: June 28, 2011
    Assignee: Ebara Corporation
    Inventors: Akira Fukuda, Yoshihiro Mochizuki, Kazuto Hirokawa
  • Publication number: 20110014851
    Abstract: A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) 201 and the wafer held by a holding member (top ring) 52 and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring 52 for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag 202 for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.
    Type: Application
    Filed: September 9, 2010
    Publication date: January 20, 2011
    Inventors: Akira FUKUDA, Yoshihiro Mochizuki, Kazuto Hirokawa
  • Publication number: 20100295448
    Abstract: A vehicle discharge lamp is provided with an outer tube, an arc tube disposed within the outer tube, and a pair of electrodes disposed within the arc tube. The arc tube includes a light emitting portion, and a pair of pinch seal portions. Molybdenum foils are sealed in the respective pinch seal portions. Each of the electrodes includes a sealed portion sealed within the pinch seal portion, a projecting portion projecting into the light emitting portion, and a welding portion welded to the molybdenum foil. A concavo-convex part is formed on the sealed portion.
    Type: Application
    Filed: May 18, 2010
    Publication date: November 25, 2010
    Applicant: KOITO MANUFACTURING CO., LTD.
    Inventors: Michio TAKAGAKI, Akira HOMMA, Yoshiro ITO, Yoshihiro MOCHIZUKI, Masato HARAZAKI
  • Publication number: 20100081361
    Abstract: A method of dressing a polishing member with a diamond dresser having diamond particles arranged on a surface thereof is provided. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the dressing conditions determined. The simulation includes calculation of the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.
    Type: Application
    Filed: September 24, 2009
    Publication date: April 1, 2010
    Inventors: Akira Fukuda, Yoshihiro Mochizuki, Yutaka Wada, Yoichi Shiokawa, Hirokuni Hiyama
  • Publication number: 20100076588
    Abstract: A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer W by applying a pressure between a polishing member (polishing pad) 201 and the wafer W held by a holding member (top ring) 52 and relatively moving the polishing member 201 to the wafer W. The polishing apparatus comprises a top ring 52 for holding the wafer W, a pressure adjusting mechanism 206 for adjusting a supporting pressure with which the wafer W is supported on a supporting surface by a retainer ring 203, and a control unit 208 for controlling the pressure adjusting mechanism 206 to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer W. The top ring 52 comprises an air bag 202 for pressing the wafer W against the polishing pad 201, a retainer ring 203 which surrounds the wafer W, and an air bag 204 for pressing the retainer ring 203.
    Type: Application
    Filed: November 5, 2009
    Publication date: March 25, 2010
    Inventors: Akira FUKUDA, Yoshihiro Mochizuki, Kazuto Hirokawa
  • Publication number: 20100066246
    Abstract: In a mercury-free arc tube, regions including molybdenum foils 17 of electrode assemblies each of which is formed by connecting and integrating an electrode 16, a molybdenum foil 17, and a lead wire 18, are pinch-sealed where the electrode 16 projects inside a closed glass bulb 12, which encloses luminescent substances, etc. The molybdenum foil 17 is doped with or coated with TiO2 in the form of discontinuous lands and subjected to surface roughening by etching including oxidation and reduction. TiO2 particles or a TiO2 layer exposed on the rough surface 17c of the molybdenum foil 17 increases chemical joining strength to glass and makes deeper, more complicated minute unevenness 17b on the molybdenum foil surface to increase the mechanical joining strength to glass, so that even when a heat stress occurs at the interface between the molybdenum foil and glass in the pinch-sealed portion, foil floating does not occur.
    Type: Application
    Filed: September 10, 2009
    Publication date: March 18, 2010
    Applicant: KOITO MANUFACTURING CO., LTD.
    Inventors: Michio TAKAGAKI, Akira HOMMA, Yoshihiro MOCHIZUKI, Takeshi FUKUYO
  • Publication number: 20090239446
    Abstract: A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer W by applying a pressure between a polishing member (polishing pad) 201 and the wafer W held by a holding member (top ring) 52 and relatively moving the polishing member 201 to the wafer W. The polishing apparatus comprises a top ring 52 for holding the wafer W, a pressure adjusting mechanism 206 for adjusting a supporting pressure with which the wafer W is supported on a supporting surface by a retainer ring 203, and a control unit 208 for controlling the pressure adjusting mechanism 206 to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer W. The top ring 52 comprises an air bag 202 for pressing the wafer W against the polishing pad 201, a retainer ring 203 which surrounds the wafer W, and an air bag 204 for pressing the retainer ring 203.
    Type: Application
    Filed: August 30, 2005
    Publication date: September 24, 2009
    Applicant: EBARA CORPORATION
    Inventors: Akira Fukuda, Yoshihiro Mochizuki, Kazuto Hirokawa
  • Patent number: 7361076
    Abstract: A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: April 22, 2008
    Assignee: Ebara Corporation
    Inventors: Kunihiko Sakurai, Tetsuji Togawa, Yoshihiro Mochizuki, Akira Fukuda, Hirokuni Hiyama, Kazuto Hirokawa, Manabu Tsujimura
  • Publication number: 20070254558
    Abstract: A polishing apparatus (30) has a polishing surface (32), a top ring (36) for holding a wafer (W), motors (46, 56) to move the polishing surface (32) and the wafer (W) relative to each other at a relative speed, and a vertical movement mechanism (54) to press the wafer (W) against the polishing surface (32) under a pressing pressure. The polishing apparatus (30) also has a controller (44) to adjust a polishing condition in a non-Preston range in which a polishing rate is not proportional to a product of the pressing pressure and the relative speed. The polishing apparatus (30) can simultaneously achieve uniform supply of a chemical liquid to a surface of the wafer (W) and a uniform polishing rate within the surface of the wafer (W).
    Type: Application
    Filed: August 26, 2005
    Publication date: November 1, 2007
    Inventors: Masako Kodera, Yoshihiro Mochizuki, Akira Fukuda, Akira Kodera, Hirokuni Hiyama, Manabu Tsujimura, Kazuto Hirokawa, Akira Fukunaga