Patents by Inventor Yoshihiro Nakai

Yoshihiro Nakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210290034
    Abstract: Provided are a flexible tube for an endoscope, the flexible tube having a flexible tube base made of metal, a resin cover layer that covers an outer periphery of the flexible tube base, and a primer layer that includes a silane coupling agent with a specific structure having an amino group and that is disposed between the flexible tube base and the resin cover layer, in which the resin cover layer includes at least one compound selected from the group consisting of polyamides, polyesters, and polyolefins on a side of the resin cover layer in contact with the primer layer, an endoscopic medical device including the flexible tube for an endoscope, a method for producing the flexible tube for an endoscope, and a method for producing the endoscopic medical device.
    Type: Application
    Filed: June 10, 2021
    Publication date: September 23, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Yoshihiro NAKAI, Toshihide YOSHITANI, Shinya ABE, Kazuma HORITA, Takeshi SENGA
  • Publication number: 20210272717
    Abstract: An aluminum alloy wire composed of an aluminum alloy, wherein the aluminum alloy contains more than or equal to 0.03 mass % and less than or equal to 1.5 mass % of Mg, more than or equal to 0.02 mass % and less than or equal to 2.0 mass % of Si, and a remainder of Al and an inevitable impurity, Mg/Si being more than or equal to 0.5 and less than or equal to 3.5 in mass ratio, and the aluminum alloy wire has a dynamic friction coefficient of less than or equal to 0.8.
    Type: Application
    Filed: May 11, 2021
    Publication date: September 2, 2021
    Applicants: Sumitomo Electric Industries,Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato KUSAKARI, Tetsuya KUWABARA, Yoshihiro Nakai, Taichiro Nishikawa, Yasuyuki Otsuka, Hayato OOI
  • Patent number: 11096057
    Abstract: A communication control device for a host vehicle including a plurality of host vehicle communication devices each including a different communication object, the communication control device including: an unauthorized state detector to detect an unauthorized state occurring from communication using an unauthorized host vehicle communication device out of the plurality of host vehicle communication devices; and a communication controller to execute control for transmitting host vehicle unauthorized state information related to the unauthorized state by using at least one normal host vehicle communication device out of the plurality of host vehicle communication devices excluding the unauthorized host vehicle communication device when the unauthorized state is detected.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: August 17, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Yoshihiro Nakai
  • Patent number: 11081858
    Abstract: An optical transmitter module includes optical semiconductor devices including a first optical semiconductor device, a temperature adjustment means for collectively performing temperature adjustment on the optical semiconductor devices, and a first thermal resistor that is disposed between the first optical semiconductor device and the temperature adjustment means, in which, when the temperature adjustment means is driven, the temperature of the first optical semiconductor device is higher than temperatures of other optical semiconductor devices which are different from the first optical semiconductor device.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: August 3, 2021
    Assignee: Lumentum Japan, Inc.
    Inventors: Shunya Yamauchi, Yoshihiro Nakai, Takayuki Nakajima, Masahiro Ebisu
  • Patent number: 11072707
    Abstract: Provided are a resin material for an acoustic wave probe which contains a polymer formed of at least one of a structural unit (a) having a specific polysiloxane bond or a structural unit (b) having a specific partial structure, in which the structural unit (b) having the specific partial structure is an acryloyloxy structural unit (b1), an acrylamide structural unit (b2), or a styrene structural unit (b3); an acoustic lens; an acoustic wave probe; an acoustic wave measurement apparatus; an ultrasound diagnostic apparatus; a photoacoustic wave measurement apparatus; and an ultrasound endoscope.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: July 27, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Yuzo Nagata, Yoshihiro Nakai, Toshihide Yoshitani, Shigeki Uehira, Atsushi Osawa
  • Publication number: 20210189203
    Abstract: Provided are an adhesive for an endoscope and a cured product thereof. The adhesive for an endoscope includes an epoxy resin including at least one of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin, a polyamine compound, and an alcohol compound. Also provided are an endoscope in which the cured product is fixed and a method for producing the endoscope.
    Type: Application
    Filed: January 8, 2021
    Publication date: June 24, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Kazushi FURUKAWA, Yoshihiro NAKAI
  • Publication number: 20210183533
    Abstract: A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a plurality of copper alloy wires composed of a copper alloy and twisted together, and has a wire diameter of 0.5 mm or less, the copper alloy containing Ni, or Ni and Fe in an amount of 0.1% by mass or more and 1.6% by mass or less in total, and P in an amount of 0.05% by mass or more and 0.7% by mass or less, with a balance being Cu and impurities, in the copper alloy, a ratio of precipitation of P to solid solution of P being 1.1 or more.
    Type: Application
    Filed: June 13, 2019
    Publication date: June 17, 2021
    Applicants: Sumitomo Electric Industries, Ltd., Sumitomo Wiring Systems, Ltd., AutoNetworks Technologies, Ltd.
    Inventors: Kei SAKAMOTO, Akiko INOUE, Tetsuya KUWABARA, Yusuke OSHIMA, Minoru NAKAMOTO, Kazuhiro NANJO, Taichiro NISHIKAWA, Yoshihiro NAKAI, Kazuhiro GOTO, Ryo TOYOSHIMA, Yasuyuki OTSUKA, Fumitoshi IMASATO, Hiroyuki KOBAYASHI
  • Publication number: 20210183532
    Abstract: A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a plurality of copper alloy wires composed of a copper alloy and twisted together, and having a wire diameter of 0.5 mm or less, the copper alloy containing Fe in an amount of 0.1% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.7% by mass or less, and Sn in an amount of 0.05% by mass or more and 0.7% by mass or less, and further including one or more elements selected from Zr, Ti and B in an amount of 1000 ppm by mass or less in total, with a balance being Cu and impurities.
    Type: Application
    Filed: June 13, 2019
    Publication date: June 17, 2021
    Applicants: Sumitomo Electric Industries, Ltd., Sumitomo Wiring Systems, Ltd., AutoNetworks Technologies, Ltd.
    Inventors: Kei SAKAMOTO, Akiko INOUE, Tetsuya KUWABARA, Yusuke OSHIMA, Minoru NAKAMOTO, Kazuhiro NANJO, Taichiro NISHIKAWA, Yoshihiro NAKAI, Yasuyuki OTSUKA, Fumitoshi IMASATO, Hiroyuki KOBAYASHI
  • Publication number: 20210177243
    Abstract: Provided are a balloon for an ultrasonic endoscope, the balloon being formed of a synthetic elastomer, in which the balloon is used such that a relation between a width W of a bead portion of the balloon and a width X of a bead-portion attachment groove provided in an ultrasonic endoscope insertion section to fix the balloon is 1.1?W/X?2.5, and a relation between an inner diameter Y of an opening of the balloon, the opening being surrounded by the bead portion, and an outer diameter Z of a part of the bead-portion attachment groove in the ultrasonic endoscope insertion section, the part being surrounded by a top of a wall surface of the bead-portion attachment groove, is 0.30?Y/Z?0.55; an ultrasonic endoscope including the balloon for an ultrasonic endoscope; and a method for producing the ultrasonic endoscope.
    Type: Application
    Filed: February 17, 2021
    Publication date: June 17, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Kazuhiro HAMADA, Yoshihiro NAKAI
  • Patent number: 11037695
    Abstract: An aluminum alloy wire composed of an aluminum alloy, wherein the aluminum alloy contains more than or equal to 0.03 mass % and less than or equal to 1.5 mass % of Mg, more than or equal to 0.02 mass % and less than or equal to 2.0 mass % of Si, and a remainder of Al and an inevitable impurity, Mg/Si being more than or equal to 0.5 and less than or equal to 3.5 in mass ratio, and the aluminum alloy wire has a dynamic friction coefficient of less than or equal to 0.8.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: June 15, 2021
    Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato Kusakari, Tetsuya Kuwabara, Yoshihiro Nakai, Taichiro Nishikawa, Yasuyuki Otsuka, Hayato Ooi
  • Publication number: 20210134475
    Abstract: An aluminum alloy contains equal to or more than 0.005 mass % and equal to or less than 2.2 mass % of Fe, and a remainder of Al and an inevitable impurity. In a transverse section of the aluminum alloy wire, a surface-layer void measurement region in a shape of a rectangle having a short side length of 30 ?m and a long side length of 50 ?m is defined within a surface layer region extending from a surface of the aluminum alloy wire by 30 ?m in a depth direction, and a total cross-sectional area of voids in the surface-layer void measurement region is equal to or less than 2 ?m2.
    Type: Application
    Filed: December 21, 2020
    Publication date: May 6, 2021
    Applicants: Sumitomo Electric Industries, Ltd, AutoNetworks Technologies, Ltd, Sumitomo Wiring Systems, Ltd
    Inventors: Misato KUSAKARI, Tetsuya KUWABARA, Yoshihiro NAKAI, Taichiro NISHIKAWA, Yasuyuki OTSUKA, Hayato OOI
  • Publication number: 20210129509
    Abstract: There is provided a composition for a laminated material used for a medical lubricating member, the composition including a polymer b including a polysiloxane structure, a catalyst for crosslinking reaction, and a crosslinking agent having a particular structure. The polymer b includes at least one of an acrylic acid component, an acrylic acid ester component, an acrylamide component, or a styrene component and has a hydroxy group, a carboxy group, an amino group, an isocyanate group, an oxazolinyl group, an epoxy group, a vinyl group, an ethynyl group, a sulfanyl group, an azide group, a trialkoxysilyl group, or an acid anhydride structure. There are also provided a laminated material and a medical lubricating member produced from the composition, a medical device including the laminated material and the medical lubricating member, and a method for producing the laminated material and the medical lubricating member.
    Type: Application
    Filed: January 13, 2021
    Publication date: May 6, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Yoshihiro NAKAI, Sotaro INOMATA
  • Publication number: 20210106210
    Abstract: Provided are an adhesive for an endoscope, a cured product of the adhesive for an endoscope, an endoscope produced using the adhesive for an endoscope, and a method for producing an endoscope. The adhesive for an endoscope includes at least one epoxy resin (A) selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins, a polyamine compound (B), and a specific compound (C) having an epoxy group.
    Type: Application
    Filed: December 3, 2020
    Publication date: April 15, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Yoshihiro NAKAI, Kazushi FURUKAWA
  • Publication number: 20210110947
    Abstract: An aluminum alloy contains at least 0.03 mass % and at most 1.5 mass % of Mg, at least 0.02 mass % and at most 2.0 mass % of Si, and a remainder composed of Al and an inevitable impurity, a mass ratio Mg/Si being not lower than 0.5 and not higher than 3.5. In a transverse section of the aluminum alloy wire, a rectangular surface-layer void measurement region having a short side of 30 ?m long and a long side of 50 ?m long is taken from a surface-layer region extending by up to 30 ?m in a direction of depth from a surface of the aluminum alloy wire. A total cross-sectional area of voids present in the surface-layer void measurement region is not greater than 2 ?m2.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 15, 2021
    Applicants: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato KUSAKARI, Tetsuya KUWABARA, Yoshihiro NAKAI, Taichiro NISHIKAWA, Yasuyuki OTSUKA, Hayato OOI
  • Patent number: 10973392
    Abstract: Provided are an adhesive for an endoscope, a cured product, an endoscope, and a method for producing an endoscope. The adhesive for an endoscope is a two-component adhesive for an endoscope. The two-component adhesive has a base and a curing agent. The base includes at least one epoxy resin (A) selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins. The curing agent includes a tertiary amine compound (B). The tertiary amine compound (B) accounts for 60 mass % or more of a curing component included in the curing agent.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: April 13, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Kazushi Furukawa, Toshihide Yoshitani, Yoshihiro Nakai
  • Publication number: 20210044083
    Abstract: A buried semiconductor optical device comprises a semiconductor substrate; a mesa-stripe portion including a multi-quantum well layer on the semiconductor substrate; a buried layer consisting of a first portion and a second portion, the first portion covering one side of the mesa-stripe portion, the second portion covering the other side of the mesa-stripe portion, and the first portion and the second portion covering a surface of the semiconductor substrate; and an electrode configured to cause an electric current to flow through the mesa-stripe portion, the buried layer comprising, from the surface of the semiconductor substrate, a first sublayer, a second sublayer, and a third sublayer, the first sublayer, the second sublayer, and the third sublayer each consisting of semi-insulating InP, the first sublayer and the second sublayer forming a pair structure, the second sublayer being located above the multi-quantum well layer from the surface of the semiconductor substrate, and the second sublayer consisting
    Type: Application
    Filed: April 10, 2020
    Publication date: February 11, 2021
    Inventors: Shigenori HAYAKAWA, Hironori SAKAMOTO, Shunya YAMAUCHI, Yoshihiro NAKAI
  • Patent number: 10910125
    Abstract: An aluminum alloy contains at least 0.03 mass % and at most 1.5 mass % of Mg, at least 0.02 mass % and at most 2.0 mass % of Si, and a remainder composed of Al and an inevitable impurity, a mass ratio Mg/Si being not lower than 0.5 and not higher than 3.5. In a transverse section of the aluminum alloy wire, a rectangular surface-layer void measurement region having a short side of 30 ?m long and a long side of 50 ?m long is taken from a surface-layer region extending by up to 30 ?m in a direction of depth from a surface of the aluminum alloy wire. A total cross-sectional area of voids present in the surface-layer void measurement region is not greater than 2 ?m2.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: February 2, 2021
    Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato Kusakari, Tetsuya Kuwabara, Yoshihiro Nakai, Taichiro Nishikawa, Yasuyuki Otsuka, Hayato Ooi
  • Patent number: 10910126
    Abstract: An aluminum alloy contains equal to or more than 0.005 mass % and equal to or less than 2.2 mass % of Fe, and a remainder of Al and an inevitable impurity. In a transverse section of the aluminum alloy wire, a surface-layer void measurement region in a shape of a rectangle having a short side length of 30 ?m and a long side length of 50 ?m is defined within a surface layer region extending from a surface of the aluminum alloy wire by 30 ?m in a depth direction, and a total cross-sectional area of voids in the surface-layer void measurement region is equal to or less than 2 ?m2.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: February 2, 2021
    Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato Kusakari, Tetsuya Kuwabara, Yoshihiro Nakai, Taichiro Nishikawa, Yasuyuki Otsuka, Hayato Ooi
  • Publication number: 20210007579
    Abstract: Provided are a two-component adhesive for an endoscope and a cured product thereof, the adhesive having a base resin and a curing agent. The base resin contains an epoxy resin (A), and the epoxy resin (A) includes an epoxy resin (a) having an average degree of polymerization of 2 or more. Also provided are an endoscope produced by using the adhesive for an endoscope and a method for producing the endoscope.
    Type: Application
    Filed: July 23, 2020
    Publication date: January 14, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Kazushi FURUKAWA, Yoshihiro NAKAI, Shigeki UEHIRA
  • Publication number: 20200405918
    Abstract: A flexible tube for an endoscope has a flexible tube substrate that is flexible and tubular and a resin layer (A) covering the flexible tube substrate. The resin layer (A) includes a thermoplastic resin (a) including at least one of a polyatnide resin, a polyurethane resin, a polyester resin, a polystyrene resin, or an acrylic resin and having a tensile strength at 10% elongation of 10 Pa or more and a hindered amine compound (b) having a molecular weight of 500 or more. Also provided are an endoscopic medical device including the flexible tube for an endoscope and a resin composition suitable for forming the resin layer of the flexible tube for an endoscope.
    Type: Application
    Filed: September 16, 2020
    Publication date: December 31, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Yoshihiro NAKAI, Kazushi Furukawa