Patents by Inventor Yoshihiro Nakai

Yoshihiro Nakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10729405
    Abstract: Provided is a composition for an acoustic wave probe including a polysiloxane mixture containing polysiloxane and silica particles of which an average primary particle diameter exceeds 16 nm and less than 100 nm and which are subjected to surface treatment, and organic peroxide, and a silicone resin for an acoustic wave probe, the acoustic wave probe, an ultrasound probe, an acoustic wave measurement apparatus, an ultrasound diagnostic apparatus, a photoacoustic wave measurement apparatus, and an ultrasound endoscope using the composition for an acoustic wave probe.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: August 4, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Yoshihiro Nakai, Atsushi Osawa
  • Publication number: 20200234841
    Abstract: An aluminum alloy wire composed of an aluminum alloy, wherein the aluminum alloy contains more than or equal to 0.03 mass % and less than or equal to 1.5 mass % of Mg, more than or equal to 0.02 mass % and less than or equal to 2.0 mass % of Si, and a remainder of Al and an inevitable impurity, Mg/Si being more than or equal to 0.5 and less than or equal to 3.5 in mass ratio, and the aluminum alloy wire has a dynamic friction coefficient of less than or equal to 0.8.
    Type: Application
    Filed: April 7, 2020
    Publication date: July 23, 2020
    Applicants: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato KUSAKARI, Tetsuya KUWABARA, Yoshihiro NAKAI, Taichiro NISHIKAWA, Yasuyuki OTSUKA, Hayato OOI
  • Patent number: 10716540
    Abstract: Provided are a resin composition for an acoustic wave probe including, a polymer which has a structural unit having a siloxane bond and a structural unit having a urea bond, an acoustic lens using the same, the acoustic wave probe, acoustic wave measurement apparatus, ultrasound diagnostic apparatus, photoacoustic wave measurement apparatus, and ultrasound endoscope.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: July 21, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Yuzo Nagata, Yoshihiro Nakai, Shigeki Uehira, Atsushi Osawa
  • Patent number: 10706986
    Abstract: An aluminum alloy wire is composed of an aluminum alloy. The aluminum alloy contains equal to or more than 0.005 mass % and equal to or less than 2.2 mass % of Fe, and a remainder of Al and an inevitable impurity. In a transverse section of the aluminum alloy wire, a surface-layer crystallization measurement region in a shape of a rectangle having a short side length of 50 ?m and a long side length of 75 ?m is defined within a surface layer region extending from a surface of the aluminum alloy wire by 50 ?m in a depth direction, and an average area of crystallized materials in the surface-layer crystallization measurement region is equal to or more than 0.05 ?m2 and equal to or less than 3 ?m2.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: July 7, 2020
    Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato Kusakari, Tetsuya Kuwabara, Yoshihiro Nakai, Taichiro Nishikawa, Yasuyuki Otsuka, Hayato Ooi
  • Publication number: 20200206393
    Abstract: A composition for an acoustic wave probe, containing the following ingredients (A) to (D): (A) a linear polysiloxane having a vinyl group; (B) a linear polysiloxane having two or more Si—H groups in a molecular chain; (C) a polysiloxane resin; and (D) surface-treated silica particles having an average primary particle diameter more than 16 nm and less than 100 nm, as well as, a silicone resin for an acoustic wave probe, an acoustic wave probe, an ultrasound probe, an acoustic wave measurement apparatus, an ultrasound diagnostic apparatus, a photoacoustic wave measurement apparatus, and an ultrasound endoscope, using the composition for an acoustic wave probe.
    Type: Application
    Filed: March 6, 2020
    Publication date: July 2, 2020
    Applicants: FUJIFILM Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro NAKAI, Shigeki UEHIRA, Taichi KITAGAWA, Nobuaki MATSUMOTO
  • Publication number: 20200187754
    Abstract: Provided are an adhesive for an endoscope, a cured product thereof, an endoscope produced using the adhesive for an endoscope, and a method for producing the endoscope. The adhesive for an endoscope is a two-component adhesive for an endoscope. The two-component adhesive has a base and a curing agent. The base includes at least one epoxy resin (A) selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins. The curing agent includes at least one specific polyamine compound (B). The adhesive for an endoscope is used to fix at least one of a metal member or a glass member constituting the endoscope.
    Type: Application
    Filed: February 26, 2020
    Publication date: June 18, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Kazushi FURUKAWA, Toshihide YOSHITANI, Yoshihiro NAKAI
  • Publication number: 20200187755
    Abstract: Provided are an adhesive for an endoscope, a cured product, an endoscope, and a method for producing an endoscope. The adhesive for an endoscope is a two-component adhesive for an endoscope. The two-component adhesive has a base and a curing agent. The base includes at least one epoxy resin (A) selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins. The curing agent includes a tertiary amine compound (B). The tertiary amine compound (B) accounts for 60 mass % or more of a curing component included in the curing agent.
    Type: Application
    Filed: February 26, 2020
    Publication date: June 18, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Kazushi FURUKAWA, Toshihide YOSHITANI, Yoshihiro NAKAI
  • Publication number: 20200181741
    Abstract: An aluminum alloy wire composed of an aluminum alloy is provided. The aluminum alloy contains at least 0.03 mass % and at most 1.5 mass % of Mg, at least 0.02 mass % and at most 2.0 mass % of Si, and a remainder composed of Al and an inevitable impurity, a mass ratio Mg/Si being not lower than 0.5 and not higher than 3.5. In a transverse section of the aluminum alloy wire, a rectangular surface-layer crystallization measurement region having a short side of 50 ?m long and a long side of 75 ?m long is taken from a surface-layer region extending by up to 50 ?m in a direction of depth from a surface of the aluminum alloy wire, and an average area of crystallized materials present in the surface-layer crystallization measurement region is not smaller than 0.05 ?m2 and not greater than 3 ?m2.
    Type: Application
    Filed: August 28, 2017
    Publication date: June 11, 2020
    Applicants: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato KUSAKARI, Tetsuya KUWABARA, Yoshihiro NAKAI, Taichiro NISHIKAWA, Yasuyuki OTSUKA, Hayato OOI
  • Patent number: 10660611
    Abstract: Provided is a composition for an acoustic wave probe including a polysiloxane mixture containing polysiloxane having a vinyl group, polysiloxane having two or more Si—H groups in a molecular chain, and silica particles of which an average primary particle diameter exceeds 16 nm and less than 100 nm and which are subjected to surface treatment, a silicone resin for an acoustic wave probe, the acoustic wave probe, an acoustic wave measurement apparatus, an ultrasound diagnostic apparatus, an ultrasound probe, a photoacoustic wave measurement apparatus, and an ultrasound endoscope.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: May 26, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Yoshihiro Nakai, Atsushi Osawa
  • Patent number: 10650936
    Abstract: An aluminum alloy wire composed of an aluminum alloy, wherein the aluminum alloy contains more than or equal to 0.03 mass % and less than or equal to 1.5 mass % of Mg, more than or equal to 0.02 mass % and less than or equal to 2.0 mass % of Si, and a remainder of Al and an inevitable impurity, Mg/Si being more than or equal to 0.5 and less than or equal to 3.5 in mass ratio, and the aluminum alloy wire has a dynamic friction coefficient of less than or equal to 0.8.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: May 12, 2020
    Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato Kusakari, Tetsuya Kuwabara, Yoshihiro Nakai, Taichiro Nishikawa, Yasuyuki Otsuka, Hayato Ooi
  • Publication number: 20200107697
    Abstract: Provided is a flexible tube, for an endoscope, having a flexible tube substrate, for an endoscope, that is flexible and tubular and a resin layer covering the flexible tube substrate for an endoscope. The resin layer includes one or more layers, the layers including a layer A including a polyester elastomer (a) as a resin component, a hindered amine compound (b), and a particular compound (c). Also provided are an endoscopic medical device including the flexible tube for an endoscope and a resin composition and a set of resin compositions that are suitable for forming the resin layer of the flexible tube for an endoscope.
    Type: Application
    Filed: December 4, 2019
    Publication date: April 9, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Kazushi FURUKAWA, Yoshihiro NAKAI
  • Publication number: 20200100646
    Abstract: Provided is a flexible tube, for an endoscope, having a flexible tube substrate, for an endoscope, that is flexible and tubular and a resin layer covering the flexible tube substrate for an endoscope. The resin layer includes one or more layers, the layers including a layer A including a polyester elastomer (a) as a resin component, at least one of a phosphorus-containing compound (b1) or a thioether compound (b2), and a hindered amine compound (c). Also provided are an endoscopic medical device including the flexible tube for an endoscope and a resin composition and a set of resin compositions that are suitable for forming the resin layer of the flexible tube for an endoscope.
    Type: Application
    Filed: December 4, 2019
    Publication date: April 2, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Kazushi FURUKAWA, Yoshihiro NAKAI
  • Publication number: 20200100652
    Abstract: A flexible tube for an endoscope, the flexible tube having a flexible tube base made of metal, a resin cover layer that covers an outer periphery of the flexible tube base, and a primer layer that includes a compound represented by formula (1) and that is disposed between the flexible tube base and the resin cover layer, in which the resin cover layer includes a polyurethane elastomer on a side in contact with the primer layer. X1 and X2 each represent a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, an aryl group, an acyl group, an alkoxycarbonyl group, or a carbamoyl group, Y1 represents a hydroxy group or an alkoxy group, and Y2 and Y3 each represent a hydroxy group, an alkoxy group, or an alkyl group. L represents a single bond or a specific divalent group.
    Type: Application
    Filed: December 4, 2019
    Publication date: April 2, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Toshihide YOSHITANI, Shinya ABE, Yoshihiro NAKAI
  • Publication number: 20200090828
    Abstract: An aluminum alloy contains at least 0.03 mass % and at most 1.5 mass % of Mg, at least 0.02 mass % and at most 2.0 mass % of Si, and a remainder composed of Al and an inevitable impurity, a mass ratio Mg/Si being not lower than 0.5 and not higher than 3.5. In a transverse section of the aluminum alloy wire, a rectangular surface-layer void measurement region having a short side of 30 ?m long and a long side of 50 ?m long is taken from a surface-layer region extending by up to 30 ?m in a direction of depth from a surface of the aluminum alloy wire. A total cross-sectional area of voids present in the surface-layer void measurement region is not greater than 2 ?m2.
    Type: Application
    Filed: April 4, 2017
    Publication date: March 19, 2020
    Applicants: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato KUSAKARI, Tetsuya KUWABARA, Yoshihiro NAKAI, Taichiro NISHIKAWA, Yasuyuki OTSUKA, Hayato OOI
  • Publication number: 20200075191
    Abstract: An aluminum alloy wire is composed of an aluminum alloy. The aluminum alloy contains equal to or more than 0.005 mass % and equal to or less than 2.2 mass % of Fe, and a remainder of Al and an inevitable impurity. In a transverse section of the aluminum alloy wire, a surface-layer crystallization measurement region in a shape of a rectangle having a short side length of 50 ?m and a long side length of 75 ?m is defined within a surface layer region extending from a surface of the aluminum alloy wire by 50 ?m in a depth direction, and an average area of crystallized materials in the surface-layer crystallization measurement region is equal to or more than 0.05 ?m2 and equal to or less than 3 ?m2.
    Type: Application
    Filed: November 5, 2019
    Publication date: March 5, 2020
    Applicants: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato KUSAKARI, Tetsuya KUWABARA, Yoshihiro NAKAI, Taichiro NISHIKAWA, Yasuyuki OTSUKA, Hayato OOI
  • Publication number: 20200075192
    Abstract: An aluminum alloy wire composed of an aluminum alloy, wherein the aluminum alloy contains more than or equal to 0.03 mass % and less than or equal to 1.5 mass % of Mg, more than or equal to 0.02 mass % and less than or equal to 2.0 mass % of Si, and a remainder of Al and an inevitable impurity, Mg/Si being more than or equal to 0.5 and less than or equal to 3.5 in mass ratio, and the aluminum alloy wire has a dynamic friction coefficient of less than or equal to 0.8.
    Type: Application
    Filed: November 8, 2019
    Publication date: March 5, 2020
    Applicants: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato KUSAKARI, Tetsuya KUWABARA, Yoshihiro NAKAI, Taichiro NISHIKAWA, Yasuyuki OTSUKA, Hayato OOI
  • Publication number: 20200066420
    Abstract: An aluminum alloy contains equal to or more than 0.005 mass % and equal to or less than 2.2 mass % of Fe, and a remainder of Al and an inevitable impurity. In a transverse section of the aluminum alloy wire, a surface-layer void measurement region in a shape of a rectangle having a short side length of 30 ?m and a long side length of 50 ?m is defined within a surface layer region extending from a surface of the aluminum alloy wire by 30 ?m in a depth direction, and a total cross-sectional area of voids in the surface-layer void measurement region is equal to or less than 2 ?m2.
    Type: Application
    Filed: April 4, 2017
    Publication date: February 27, 2020
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Misato KUSAKARI, Tetsuya KUWABARA, Yoshihiro NAKAI, Taichiro NISHIKAWA, Yasuyuki OTSUKA, Hayato OOI
  • Patent number: 10553328
    Abstract: An aluminum alloy wire is composed of an aluminum alloy. The aluminum alloy contains equal to or more than 0.005 mass % and equal to or less than 2.2 mass % of Fe, and a remainder of Al and an inevitable impurity. In a transverse section of the aluminum alloy wire, a surface-layer crystallization measurement region in a shape of a rectangle having a short side length of 50 ?m and a long side length of 75 ?m is defined within a surface layer region extending from a surface of the aluminum alloy wire by 50 ?m in a depth direction, and an average area of crystallized materials in the surface-layer crystallization measurement region is equal to or more than 0.05 ?m2 and equal to or less than 3 ?m2.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: February 4, 2020
    Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato Kusakari, Tetsuya Kuwabara, Yoshihiro Nakai, Taichiro Nishikawa, Yasuyuki Otsuka, Hayato Ooi
  • Publication number: 20200035377
    Abstract: Provided are: a copper alloy wire having an excellent electrical conductivity, a high strength, and an excellent elongation; a copper alloy stranded wire including the copper alloy wire; an electric wire including the copper alloy wire or the copper alloy stranded wire as a conductor; a terminal-fitted electric wire including the aforementioned electric wire; and a method of manufacturing a copper alloy wire. The copper alloy wire has a composition including: not less than 0.2% by mass and not more than 1% by mass of Mg; not less than 0.02% by mass and not more than 0.1% by mass of P; and the balance including Cu and inevitable impurities. The copper alloy wire has an electrical conductivity of not less than 60% IACS, a tensile strength of not less than 400 MPa, and an elongation at breakage of not less than 5%.
    Type: Application
    Filed: September 30, 2019
    Publication date: January 30, 2020
    Applicants: Sumitomo Electric Industries, Ltd., AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Akiko Inoue, Tetsuya Kuwabara, Yoshihiro Nakai, Taichiro Nishikawa, Hiroyuki Kobayashi
  • Patent number: 10522263
    Abstract: An aluminum alloy wire composed of an aluminum alloy, wherein the aluminum alloy contains more than or equal to 0.03 mass % and less than or equal to 1.5 mass % of Mg, more than or equal to 0.02 mass % and less than or equal to 2.0 mass % of Si, and a remainder of Al and an inevitable impurity, Mg/Si being more than or equal to 0.5 and less than or equal to 3.5 in mass ratio, and the aluminum alloy wire has a dynamic friction coefficient of less than or equal to 0.8.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: December 31, 2019
    Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Misato Kusakari, Tetsuya Kuwabara, Yoshihiro Nakai, Taichiro Nishikawa, Yasuyuki Otsuka, Hayato Ooi