Patents by Inventor Yoshihiro NAKAZUMI

Yoshihiro NAKAZUMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
    Patent number: 11939447
    Abstract: A thermosetting composition including a thermosetting compound and hexagonal boron nitride D, wherein the thermosetting compound contains a cyanate compound A and/or a maleimide compound B, and a modified polyphenylene ether C having a substituent with a carbon-carbon unsaturated double bond at at least one terminal, and a content of the hexagonal boron nitride D is 0.1 parts by mass or more and 25 parts by mass or less based on 100 parts by mass of the thermosetting compound.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: March 26, 2024
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Yoshihiro Nakazumi, Kentaro Takano
  • Thermosetting resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board
    Patent number: 11760871
    Abstract: A thermosetting resin composition containing a thermosetting resin (A), boron nitride (B), and a dispersant (C) with a pH of 8 or higher.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: September 19, 2023
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoshihiro Nakazumi, Kentaro Takano
  • THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD
    Publication number: 20210395514
    Abstract: A thermosetting resin composition containing a thermosetting resin (A), boron nitride (B), and a dispersant (C) with a pH of 8 or higher.
    Type: Application
    Filed: October 9, 2019
    Publication date: December 23, 2021
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoshihiro NAKAZUMI, Kentaro TAKANO
  • Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed circuit board
    Patent number: 11098195
    Abstract: A resin composition according to the present invention contains a cyanate compound (A). Further, the resin composition according to the present invention contains a maleimide compound (B) and/or an epoxy resin (C); and primary hexagonal boron nitride particles (D) having an average aspect ratio of 4 to 10.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: August 24, 2021
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoshihiro Nakazumi, Kentaro Takano
  • THERMOSETTING COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD
    Publication number: 20210238381
    Abstract: A thermosetting composition including a thermosetting compound and hexagonal boron nitride D, wherein the thermosetting compound contains a cyanate compound A and/or a maleimide compound B, and a modified polyphenylene ether C having a substituent with a carbon-carbon unsaturated double bond at at least one terminal, and a content of the hexagonal boron nitride D is 0.1 parts by mass or more and 25 parts by mass or less based on 100 parts by mass of the thermosetting compound.
    Type: Application
    Filed: April 2, 2019
    Publication date: August 5, 2021
    Inventors: Yoshihiro NAKAZUMI, Kentaro TAKANO
  • Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed circuit board
    Patent number: 10689496
    Abstract: The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: June 23, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoshihiro Nakazumi, Daisuke Ueyama, Kentaro Takano
  • RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD
    Publication number: 20200031987
    Abstract: A resin composition having an epoxy resin (A) represented by general formula (1); and a cyanate compound (B).
    Type: Application
    Filed: April 9, 2018
    Publication date: January 30, 2020
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Shota KOGA, Yoshihiro NAKAZUMI, Kentaro TAKANO
  • RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED CIRCUIT BOARD
    Publication number: 20190153224
    Abstract: A resin composition according to the present invention contains a cyanate compound (A). Further, the resin composition according to the present invention contains a maleimide compound (B) and/or an epoxy resin (C); and primary hexagonal boron nitride particles (D) having an average aspect ratio of 4 to 10.
    Type: Application
    Filed: January 19, 2018
    Publication date: May 23, 2019
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoshihiro NAKAZUMI, Kentaro TAKANO
  • RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET AND PRINTED CIRCUIT BOARD
    Publication number: 20190153177
    Abstract: The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.
    Type: Application
    Filed: August 23, 2017
    Publication date: May 23, 2019
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoshihiro NAKAZUMI, Daisuke UEYAMA, Kentaro TAKANO