Patents by Inventor Yoshihiro Suzuki

Yoshihiro Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230025583
    Abstract: A problem to be solved by the invention is to improve the sensitivity of measurement of an analyte in a sample by a sandwich immunoassay. The sensitivity can be improved significantly in a sandwich immunoassay using a first antibody and a second antibody when one or both of the first antibody and the second antibody are a mixture of a monoclonal antibody recognizing a linear epitope and a monoclonal antibody recognizing a conformational epitope.
    Type: Application
    Filed: November 27, 2020
    Publication date: January 26, 2023
    Applicant: SEKISUI MEDICAL CO., LTD.
    Inventors: Tomohide ASAI, Yoshihiro TANAKA, Ikumi SUZUKI, Satoko SEO, Tomoyuki USUI, Tomo SHIMIZU, Osamu MIYAZAKI
  • Patent number: 11538710
    Abstract: There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: December 27, 2022
    Assignee: DISCO CORPORATION
    Inventors: Takatoshi Sakurai, Yoshihiro Omuro, Katsuhiko Suzuki
  • Publication number: 20220406670
    Abstract: A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.
    Type: Application
    Filed: August 24, 2022
    Publication date: December 22, 2022
    Inventors: Kazutoshi TSUYUTANI, Yoshihiro SUZUKI, Akira MOTOHASHI
  • Publication number: 20220405964
    Abstract: An object is captured in an image taken by the camera. An external shape of the object is recognized from the image. An internal shape of the object is recognized from the image. Parts information of the object is then determined, using a result of the recognition of the external shape and/or a result of recognition of the internal shape.
    Type: Application
    Filed: June 20, 2022
    Publication date: December 22, 2022
    Applicant: Konica Minolta, Inc.
    Inventors: Daichi Suzuki, Yoshiyuki TOSO, Yoshihiro Inagaki, Yusuke MURAKAMI
  • Patent number: 11523878
    Abstract: A handpiece-type high-frequency vibration cutting device includes a housing (10); a vibration device (21); a holding member (11); a tool (12); and a controller (20) to control the operations of the vibration device (21). The controller (20) controls the vibration of the tool (12) due to the vibration device (21) such that the vibration is burst oscillation in which vibration and stop of vibration are repeated. The controller (20) also controls the entire burst frequency f1 of the tool (12) to be included in the range of 1 to 8 [Hz], one cycle of the burst frequency f1 including a burst period with the holding member (11) vibrating and a stop period with the tool (12) not vibrating. The controller (20) also controls the vibration frequency f2 of the tool (12) during the burst period such that the vibration frequency f2 is in the range of 20 to 60 [kHz].
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: December 13, 2022
    Assignee: Micron Machinery Co., Ltd.
    Inventors: Mohee Sagae, Satoshi Kobayashi, Yoshihiro Minagawa, Hiroki Suzuki, Norihiko Nakajima
  • Publication number: 20220364228
    Abstract: A cleaning method according to an aspect of the present disclosure includes: supplying a halogen-containing gas that does not contain fluorine to an interior of a processing container that is capable of being exhausted via an exhaust pipe to perform a cleaning; and supplying a fluorine-containing gas to at least one of the interior of the processing container and an interior of the exhaust pipe to perform the cleaning after the supplying the halogen-containing gas to perform the cleaning.
    Type: Application
    Filed: August 6, 2020
    Publication date: November 17, 2022
    Inventors: Yoshihiro TAKEZAWA, Daisuke SUZUKI, Hiroyuki HAYASHI, Tatsuya MIYAHARA, Keisuke FUJITA, Masami OIKAWA, Sena FUJITA
  • Publication number: 20220355828
    Abstract: A driving handover control device includes a memory and a processor coupled to the memory. In a case in which driving is handed over from a first state in which a vehicle travels in accordance with instruction from a remote operator of the vehicle to a second state in which the vehicle travels in accordance with operation by a passenger of the vehicle, the processor implements a transition from the first state to a third state in which the vehicle travels autonomously without instruction from the remote operator or operation by the passenger, and, after the transition from the first state to the third state, implements a transition from the third state to the second state.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 10, 2022
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Toshiki KINDO, Yuji SUZUKI, Mutsumi MATSUURA, Tomoaki MIYAZAWA, Shunsuke TANIMORI, Kuniaki JINNAI, Kohta TARAO, Yoshihiro MAEKAWA, Hiroki AWANO, Tae SUGIMURA, Tomoyuki KURIYAMA, Yusuke YOKOTA, Makoto MATSUSHITA, Yasuki NAKAGAWA, Atsushi HANAWA
  • Publication number: 20220355826
    Abstract: A driving handover control device includes a memory and a processor coupled to the memory. In a case in which driving is handed over from a first state in which a vehicle travels in accordance with instruction from a first remote operator of the vehicle to a second state in which the vehicle travels in accordance with instruction from a second remote operator who is different from the first remote operator, the processor implements a transition from the first state to a third state in which the vehicle travels autonomously without instruction from the first remote operator or the second remote operator, and, after the transition from the first state to the third state, implements a transition from the third state to the second state.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 10, 2022
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Toshiki KINDO, Yuji SUZUKI, Mutsumi MATSUURA, Tomoaki MIYAZAWA, Shunsuke TANIMORI, Kuniaki JINNAI, Kohta TARAO, Yoshihiro MAEKAWA, Hiroki AWANO, Tae SUGIMURA, Tomoyuki KURIYAMA, Yusuke YOKOTA, Makoto MATSUSHITA, Yasuki NAKAGAWA, Atsushi HANAWA
  • Patent number: 11492731
    Abstract: A method of producing a partially separated fiber bundle wherein, while a fiber bundle includes a plurality of single fibers travels along a lengthwise direction of the fiber bundle, a separator provided with a plurality of projected parts is penetrated into the fiber bundle to create a separation-processed part, and entangled parts, where the single fibers are interlaced, are formed at contact parts with the projected parts in at least one separation-processed part, thereafter the separator is removed from the fiber bundle, and after passing through an entanglement accumulation part including the entangled parts, the separator is penetrated again into the fiber bundle, characterized in that a separation processing time t1 during being penetrated with the separator and a time t2 from being removed with the separator to being penetrated again into the fiber bundle satisfy Equation (1): 0.03?t2/(t1+t2)?0.5.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: November 8, 2022
    Assignee: Toray Industries, Inc.
    Inventors: Tetsuya Motohashi, Takafumi Hashimoto, Katsuhiro Miyoshi, Yoshihiro Kawahara, Tamotsu Suzuki, Chiasa Sato
  • Patent number: 11480447
    Abstract: A fader device includes a conductive shaft, a conductive moving body, and a conductive portion. The conductive moving body is movable in the longitudinal direction of the shaft and includes a gap between it and the conductive shaft. The conductive portion brings the shaft and the moving body into electrical continuity. A signal generation portion generates a touch sense signal. A detection portion detects contact with the conductive moving body based on a signal output according to a capacitance generated between the conductive shaft and the conductive moving body in response to the touch sense signal.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: October 25, 2022
    Assignee: Yamaha Corporation
    Inventors: Yoshihiro Natsume, Yoshihiro Suzuki
  • Publication number: 20220319845
    Abstract: To provide a method of depositing a silicon film that can crystallize the silicon film at low temperature and in a short time, and also can deposit the silicon film with high flatness. A method of depositing a silicon film includes supplying a silicon-containing gas on a seed layer, depositing an amorphous silicon film on the seed layer, supplying chlorosilane gas to the amorphous silicon film, and crystallizing the amorphous silicon film while forming a chlorosilane cap layer on the amorphous silicon film.
    Type: Application
    Filed: March 14, 2022
    Publication date: October 6, 2022
    Inventors: Tatsuya MIYAHARA, Yoshihiro TAKEZAWA, Daisuke SUZUKI, Hiroyuki HAYASHI
  • Publication number: 20220319846
    Abstract: A method of crystallizing an amorphous silicon film includes depositing the amorphous silicon film on a seed layer formed over a substrate while heating the amorphous silicon film at a first temperature, and forming a crystal nucleus in an outer layer of the amorphous silicon film by causing migration of silicon in the outer layer by heating the amorphous silicon film at a second temperature higher than the first temperature.
    Type: Application
    Filed: March 17, 2022
    Publication date: October 6, 2022
    Inventors: Tatsuya MIYAHARA, Daisuke SUZUKI, Yoshihiro TAKEZAWA, Yuki TANABE
  • Patent number: 11462447
    Abstract: A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: October 4, 2022
    Assignee: TDK CORPORATION
    Inventors: Kazutoshi Tsuyutani, Yoshihiro Suzuki, Akira Motohashi
  • Publication number: 20220299077
    Abstract: This disk brake includes an attachment member that has support portions movably supporting a pair of brake pads, and a caliper that pressurizes the brake pads against a disk. The attachment member has outer circumferential frame portions, a coupling beam portion, and support main body portions. The outer circumferential frame portions extend in a disk circumferential direction so as to cover the disk while straddling the disk. The coupling beam portion couples the support portions to each other. The support main body portions form the support portions. The outer frame constituting portions constitute the outer frames of the support main body portions. Positions of disk-axially outward side end surfaces in a disk axial direction are the same as positions of the disk-axially outward side end surfaces of the caliper or on sides outward in the disk axial direction.
    Type: Application
    Filed: November 26, 2020
    Publication date: September 22, 2022
    Inventors: Miyuki UNO, Junichi HASHIMOTO, Shinji SUZUKI, Yoshihiro IWAMA, Masaru ODA
  • Patent number: 11446762
    Abstract: A laser irradiation apparatus (1) according to one embodiment irradiates a workpiece (16) with a laser beam (15) while conveying the workpiece (16) caused to float with the use of a flotation unit (10). The flotation unit (10) includes precision float regions (11a, 11b) and rough float regions (13a to 13j). The precision float regions (11a, 11b) are configured to cause the workpiece (16) to float by utilizing ejection and suction of a gas, and the rough float regions are configured to cause the workpiece (16) to float by utilizing ejection of a gas without suction of a gas.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: September 20, 2022
    Assignee: JSW AKTINA SYSTEM CO., LTD.
    Inventors: Takahiro Fuji, Yuki Suzuki, Takahiro Mikami, Yoshihiro Yamaguchi
  • Publication number: 20220282151
    Abstract: A wavelength conversion member includes a sintered body of a phosphor. An average diameter of pores in an arbitrary cross section falls within a range of not less than 0.28 ?m and not more than 0.98 ?m. A ratio of an area of pores to a whole area in an arbitrary cross section falls within a range of not less than 0.04% and not more than 2.7%. An average diameter of grains of the phosphor in an arbitrary cross section falls within a range of not less than 1 ?m and not more than 3 ?m.
    Type: Application
    Filed: August 7, 2020
    Publication date: September 8, 2022
    Applicants: TAMURA CORPORATION, NATIONAL INSTITUTE FOR MATERIALS SCIENCE
    Inventors: Yusuke ARAI, Hiroyuki SAWANO, Daisuke INOMATA, Yoshihiro YAMASHITA, Rikiya SUZUKI, Kiyoshi SHIMAMURA, Encarnacion Antonia GARCIA VILLORA
  • Publication number: 20220281293
    Abstract: A blower includes an air introduction box, a casing, an impeller, a filter medium, a frame body, a first partition plate and a second partition plate. The filter medium captures a foreign matter contained in a first air and a second air flowing from the air introduction box to the impeller. The frame body houses the filter medium and is installed in a filter installation portion upstream of the impeller. The first partition plate is fixed to the frame body and divides a space upstream of the filter medium into a plurality of regions. The second partition plate is fixed to the frame body and divides a space downstream of the filter medium into a plurality of regions. The filter medium is interposed between the first partition plate and the second partition plate.
    Type: Application
    Filed: May 23, 2022
    Publication date: September 8, 2022
    Inventor: Yoshihiro SUZUKI
  • Publication number: 20220267142
    Abstract: A sensor package substrate has through holes V1 and V2 at a position overlapping a sensor chip mounting area. The through hole V1 has a minimum inner diameter at a depth position D1, and the through hole V2 has a minimum inner diameter at a depth position D2 different from the depth position D1. Thus, since the plurality of through holes are formed at a position overlapping the sensor chip mounting area, the diameter of each of the through holes can be reduced. This makes foreign matters unlikely to enter through the through holes, and a reduction in the strength of the substrate is suppressed. In addition, since the depth position D1 and depth position D2 are located at different depth levels, it is possible to sufficiently maintain the strength of a part of the substrate that is positioned between the through holes V1 and V2.
    Type: Application
    Filed: June 5, 2020
    Publication date: August 25, 2022
    Inventors: Kazutoshi TSUYUTANI, Yoshihiro SUZUKI
  • Patent number: 11420877
    Abstract: A method for producing lithium fluorosulfonate which includes reacting XSO3H, wherein X is a leaving group other than fluorine, with a lithium source and a fluorine source. Also disclosed is a composition containing XSO3H.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: August 23, 2022
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Yuuki Suzuki, Akiyoshi Yamauchi, Kotaro Hayashi, Yoshihiro Yamamoto, Yosuke Kishikawa, Tatsuya Ohtsuka, Atsushi Maruo, Hiroyuki Arima
  • Publication number: 20220238474
    Abstract: An electronic component embedded substrate includes an electronic component and a heat transfer block which are embedded in insulating layers, a first wiring patterns facing a first surface of the heat transfer block, a second wiring pattern facing a second surface of the heat transfer block, a first via conductor connecting the first wiring pattern and the first surface of the heat transfer block, and a second via conductor connecting the second wiring pattern and the second surface of the heat transfer block. The first and second surfaces and are insulated from each other. Thus, even when an electronic component of a type having large heat generation and being prohibited from connecting to a ground pattern is mounted, the second wiring pattern functioning as a heat dissipation pattern can be connected to a ground pattern on a motherboard.
    Type: Application
    Filed: June 5, 2020
    Publication date: July 28, 2022
    Inventors: Toshiyuki ABE, Yoshihiro SUZUKI, Hironori CHIBA, Tetsuya YAZAKI, Hiroshige OHKAWA