Abstract: Sunlight incident in a lamp through a lens is prevented from being collected on a portion formed between a front end of a reflector and a lens holding frame through an opening formed in front of the portion. A vehicle lamp includes a light emitting portion, a lens that projects light emitted from the light emitting portion, a reflector including a first reflective surface that reflects light emitted from the light emitting portion toward the lens, an opening formed between a front end of the reflector and a frame, the frame that holds the lens, and a second reflective surface that is formed between the front end of the reflector and the frame, and reflects external light incident in the vehicle lamp through the lens.

Abstract: A film forming method includes preparing a substrate having an amorphous silicon film on a surface thereof, diffusing nickel into the amorphous silicon film by supplying a nickel source gas to the amorphous silicon film, and forming a polycrystalline silicon film by heating the amorphous silicon film, and crystallizing the amorphous silicon film by metal-induced lateral crystallization using the nickel diffused in the amorphous silicon film as a nucleus.

Abstract: The present disclosure provides a technology of obtaining a ceramic product including a decorative film which has a sufficient chemical resistance and can reduce damage during cleaning. A decorative composition disclosed herein contains at least a noble metal element and a glass matrix element. The glass matrix element contains a rare-earth element and a first element which is at least one selected from the group consisting of Si and Al. In the decorative composition disclosed herein, the content of the rare-earth element in the glass matrix element is from 1 mol % to 45 mol % inclusive, and the content of the first element in the glass matrix element is from 50 mol % to 90 mol % inclusive. This allows the decorative film having both alkali resistance and acid resistance at high level to be formed.

Abstract: A rotary connector apparatus includes a stator, a rotator, and an adjustment structure. The stator is configured to be attached to a vehicle body. The rotator is provided rotatably about a rotation axis with respect to the stator. The stator and the rotator define a cable housing space provided to surround the rotation axis. The adjustment structure is configured to allow the rotation axis to move with respect to the vehicle body in a state where the stator is attached to the vehicle body. The adjustment structure includes a coupling structure configured to couple the stator to the vehicle body. The coupling structure supports the stator movably with respect to the vehicle body to change an angle of the rotation axis with respect to the vehicle body in a state where the coupling structure couples the stator to the vehicle body.

Abstract: Provided is an automated analysis device with which sufficient reaction process data can be acquired irrespective of the scale of the device, and with which it is possible to ensure freedom of the device configuration. An automated analysis device 100 is provided with: a reaction disk 1 which circumferentially accommodates a plurality of reaction vessels 2; a specimen dispensing mechanism 11 which dispenses a specimen into the reaction vessels 2; a reagent dispensing mechanism 7 which dispenses a reagent into the reaction vessels 2; a measuring unit 4 which measures a reaction process of a mixture of the specimen and the reagent in the reaction vessels 2; and a cleaning mechanism 3 which cleans the reaction vessels 2 after measurement.

Abstract: Provided is an automated analysis device with which sufficient reaction process data can be acquired irrespective of the scale of the device, and with which it is possible to ensure freedom of the device configuration. An automated analysis device 100 is provided with: a reaction disk 1 which circumferentially accommodates a plurality of reaction vessels 2; a specimen dispensing mechanism 11 which dispenses a specimen into the reaction vessels 2; a reagent dispensing mechanism 7 which dispenses a reagent into the reaction vessels 2; a measuring unit 4 which measures a reaction process of a mixture of the specimen and the reagent in the reaction vessels 2; and a cleaning mechanism 3 which cleans the reaction vessels 2 after measurement.

Abstract: A blower includes a fluid introducing box, a fan, a casing, a tubular portion disposed inside the fan to introduce a first fluid and a second fluid separately into the fan, and an upper end portion defining an inlet into the tubular portion. The casing has a suction port forming portion defining a suction port. The upper end portion is disposed between the suction port forming portion and the fluid introducing box. A gap passage is defined between the upper end portion and the suction port forming portion. At least one of the first fluid or the second fluid is introduced into the gap passage from a passage inlet and fluids through the gap passage toward a downstream portion. A distance between the upper end portion and the suction port forming portion in the axial direction at the downstream portion is less than that at the passage inlet.

Abstract: An upstream space forming portion of a centrifugal blower has a space division portion that divides an upstream space into an inner connection space and an outer connection space. The outer connection space has an overlapping space that overlaps the space division portion in an axial direction, and a non-overlapping space excluding the overlapping space from the outer connection space. A suction port has an outer overlapping portion located outside the separation cylinder in a radial direction, and an outer non-overlapping portion excluding the outer overlapping portion from the separation cylinder located outside in the radial direction. A relationship S1/S2?0.5 is satisfied when a first area S1 is defined by projecting a boundary between the overlapping space and the non-overlapping space in the radial direction, and a second area S2 is defined by projecting the outer overlapping portion in the axial direction.

Abstract: Disclosed herein is a semiconductor IC-embedded substrate that includes insulating layers, conductor layers, and a semiconductor IC embedded in the insulating layers. The insulating layers includes first and second insulating layers. The conductor layers includes a first conductor layer having a first wiring pattern and a second conductor layer having a second wiring pattern. The semiconductor IC includes a rewiring pattern connected in common to power supply pads. The rewiring pattern is connected to the first wiring pattern via a first opening of the first insulating layer. The first wiring pattern is connected to the second wiring pattern via second openings of the second insulating layer. The first opening is greater in area than each of the second openings.

Abstract: A rotation operation device includes: a rotation shaft including a first end portion and a second end portion spaced apart from each other in an axial direction of the rotation shaft; a knob having conductivity, the knob being provided at the first end portion of the rotation shaft and being configured to rotate the rotation shaft; a touch sensor configured to detect a contact with the knob; and an elastic body having conductivity, the elastic body including a first end connected to the knob and a second end connected to the touch sensor. The knob includes a surface facing in the axial direction of the rotation shaft towards the second end portion of the rotation shaft, the surface of the knob includes a recess portion recessed in the axial direction, and the first end of the elastic body is disposed in the recess portion.

Abstract: A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

Abstract: A fader device includes a conductive shaft, a conductive moving body, and a conductive portion. The conductive moving body is movable in the longitudinal direction of the shaft and includes a gap between it and the conductive shaft. The conductive portion brings the shaft and the moving body into electrical continuity. A signal generation portion generates a touch sense signal. A detection portion detects contact with the conductive moving body based on a signal output according to a capacitance generated between the conductive shaft and the conductive moving body in response to the touch sense signal.

Abstract: A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

Abstract: A blower includes an air introduction box, a casing, an impeller, a filter medium, a frame body, a first partition plate and a second partition plate. The filter medium captures a foreign matter contained in a first air and a second air flowing from the air introduction box to the impeller. The frame body houses the filter medium and is installed in a filter installation portion upstream of the impeller. The first partition plate is fixed to the frame body and divides a space upstream of the filter medium into a plurality of regions. The second partition plate is fixed to the frame body and divides a space downstream of the filter medium into a plurality of regions. The filter medium is interposed between the first partition plate and the second partition plate.

Abstract: A sensor package substrate has through holes V1 and V2 at a position overlapping a sensor chip mounting area. The through hole V1 has a minimum inner diameter at a depth position D1, and the through hole V2 has a minimum inner diameter at a depth position D2 different from the depth position D1. Thus, since the plurality of through holes are formed at a position overlapping the sensor chip mounting area, the diameter of each of the through holes can be reduced. This makes foreign matters unlikely to enter through the through holes, and a reduction in the strength of the substrate is suppressed. In addition, since the depth position D1 and depth position D2 are located at different depth levels, it is possible to sufficiently maintain the strength of a part of the substrate that is positioned between the through holes V1 and V2.

Abstract: An electronic component embedded substrate includes an electronic component and a heat transfer block which are embedded in insulating layers, a first wiring patterns facing a first surface of the heat transfer block, a second wiring pattern facing a second surface of the heat transfer block, a first via conductor connecting the first wiring pattern and the first surface of the heat transfer block, and a second via conductor connecting the second wiring pattern and the second surface of the heat transfer block. The first and second surfaces and are insulated from each other. Thus, even when an electronic component of a type having large heat generation and being prohibited from connecting to a ground pattern is mounted, the second wiring pattern functioning as a heat dissipation pattern can be connected to a ground pattern on a motherboard.

Abstract: Disclosed herein is a circuit board that includes first and second conductor layers, an insulating layer positioned between the first and second conductor layers, and a via conductor formed inside a via penetrating the insulating layer and connecting the first and second conductor layers. The via has a shape in which a diameter thereof is reduced in a depth direction. The via has a first section positioned on the first conductor layer side and a second section positioned on the second conductor layer side. A reduction in the diameter per unit depth in the first section is greater than that in the second section.

Abstract: A blower includes a fluid introducing box, a fan, a casing, a tubular portion disposed inside the fan to introduce a first fluid and a second fluid separately into the fan, and an upper end portion defining an inlet into the tubular portion. The casing has a suction port forming portion defining a suction port. The upper end portion is disposed between the suction port forming portion and the fluid introducing box. A gap passage is defined between the upper end portion and the suction port forming portion. At least one of the first fluid or the second fluid is introduced into the gap passage from a passage inlet and fluids through the gap passage toward a downstream portion. A distance between the upper end portion and the suction port forming portion in the axial direction at the downstream portion is less than that at the passage inlet.

Abstract: The passage opening and closing device includes a casing in which an opening edge forms an opening of an air passage, and a sliding door slidably movable inside the casing to open and close the opening. A door end part of the sliding door faces a door facing wall of the opening edge when the sliding door is positioned at a closed position where the sliding door closes the opening. A gap flow-path extending in the door moving direction is formed between the door facing wall and the door end part. A distance between the door end part and the door facing wall decreases downstream in air flow in the gap flow-path so that the gap flow-path is a convergent flow path.