Abstract: A marker pattern for enhancing resolution of a defect location along an axis in semiconductor defect analysis, and in particular, a marker pattern providing greater resolution in locating bit line defects using thermal laser stimulation methods such as OBIRCH. In an example, the marker pattern may consist of large markers, each having a set of associated small markers. Each of the small markers may be offset along an axis from each other. By identifying the small marker and its associated large marker which align with the defect, the bit line containing the defect may be more easily identified.

Abstract: A marker pattern for enhancing resolution of a defect location along an axis in semiconductor defect analysis, and in particular, a marker pattern providing greater resolution in locating bit line defects using thermal laser stimulation methods such as OBIRCH. In an example, the marker pattern may consist of large markers, each having a set of associated small markers. Each of the small markers may be offset along an axis from each other. By identifying the small marker and its associated large marker which align with the defect, the bit line containing the defect may be more easily identified.

Abstract: During an erasing sequence, after a preprogram operation (S1), an erasing operation (S3), and an APDE operation (S5) are executed and confirmation by an APDE verify operation (S6: P) and confirmation by an erase-verify operation (S7: P) are completed, step A is executed prior to a soft-program operation (S10) of a plurality of memory cells. A dummy memory cell program operation (S8) is continuously executed until a completion of a program operation is confirmed by a dummy memory cell program verify operation (S9). By execution of the program operation on the dummy memory cells, a voltage stress similar to that of a program operation is applied to memory cells in an over-erased state via bit lines. Thereby, the over-erased state is reduced thereby lowering a column leak current. Erroneous recognition during a soft-program verify operation (S11) can be prevented, and excessive soft-programming can be avoided.

Abstract: During an erasing sequence, after a preprogram operation (S1), an erasing operation (S3), and an APDE operation (S5) are executed and confirmation by an APDE verify operation (S6: P) and confirmation by an erase-verify operation (S7: P) are completed, step A is executed prior to a soft-program operation (S10) of a plurality of memory cells. A dummy memory cell program operation (S8) is continuously executed until a completion of a program operation is confirmed by a dummy memory cell program verify operation (S9). By execution of the program operation on the dummy memory cells, a voltage stress similar to that of a program operation is applied to memory cells in an over-erased state via bit lines. Thereby, the over-erased state is reduced thereby lowering a column leak current. Erroneous recognition during a soft-program verify operation (S11) can be prevented, and excessive soft-programming can be avoided.