Abstract: A microchip plate made such that polymer substrates made, in particular, of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC) can be appropriately bonded to each other and a process for producing the microchip plate are provided. A microchip plate (1) of an embodiment is constituted by a first substrate (2) and a second substrate (3), which are bonded to each other through an adhesive layer (5), wherein the first substrate (2) and the second substrate (3) are formed by a COP or a COC, and the adhesive layer (5) is formed of paraffin or naphthene or formed including paraffin or naphthene and at least any one of an adhesion auxiliary material, a polymer constituting each of the first substrate and the second substrate, and a macromonomer.

Abstract: A resin bonding method according to the present invention is a resin bonding method for bonding a first resin and a second resin including (I) a step of irradiating spaces containing oxygen molecules with vacuum ultraviolet light having a wavelength of 175 nm or less, the spaces being in contact with surfaces of the first and second resins; and (II) a step of, after the irradiation, subjecting the surfaces to temperature rise while the surfaces are in contact with each other, to bond the first resin and the second resin together with the surfaces serving as bonding surfaces. In the step (I), the surfaces of the first and second resins may be further irradiated with the vacuum ultraviolet light. In this case, a light amount of the vacuum ultraviolet light having reached the surfaces is preferably, for example, 0.1 J/cm2 or more and 10 J/cm2 or less.

Abstract: This invention relates to a corrosion-resistant aluminum conductive material comprising an aluminum material consisting of aluminum or an aluminum alloy and a conductive film formed on the surface of said aluminum material wherein defects in the conductive film are substantially sealed off by a hot water treatment or a steam treatment and to a process for producing a corrosion-resistant aluminum conductive material which comprises forming a conductive film on the surface of an aluminum material and subjecting to a hot water treatment or a steam treatment thereby substantially sealing off defects in the conductive film. This invention makes it possible to substantially seal off the defects unavoidably developed on the surface of the conductive film without harming the excellent properties of the aluminum material and provide excellent corrosion resistance even when the thickness of the conductive film is small.

Abstract: A liquid treating apparatus includes a treating tank having at least two walls formed with a liquid inlet and a liquid outlet through each of which a liquid to be treated flows, respectively, and a filtering layer unit including an antibacterial filtering layer, an adsorptive filtering layer and a filtering layer, the filtering layer unit being disposed between the liquid inlet and outlet.

Abstract: On a surface of a transfer sheet, a resistor paste is first patterned, and a binder resin thereof is then heat-cured to form resistor layers. Next, an electrode paste containing a binder resin, which has a thermosetting temperature lower than a thermosetting temperature and a glass transition temperature of the binder resin of the resistor layers, is patterned on surfaces of the resistor layers and is then heat-cured, thereby forming electrode layers. By the steps described above, powdered silver contained in the electrode layers is unlikely to ooze into the resistor layers.

Abstract: A liquid treating apparatus includes a treating tank having at least two walls formed with a liquid inlet and a liquid outlet through each of which a liquid to be treated flows, respectively, and a filtering layer unit including an antibacterial filtering layer, an adsorptive filtering layer and a filtering layer, the filtering layer unit being disposed between the liquid inlet and outlet.

Abstract: A method for producing a resistor. The method includes a process for printing, in a prescribed pattern, a mixed solution containing a good solvent having solubility to a binder good solvent, a thermosetting binder resin, and a conductive filler. The method further includes a process for driving the mixed solution: and a process for curing the binder resin by baking. The good solvent is at least one selected from dipropylene glycol monomethyl ether, diethylene glycol monomethyl ether, and dipropylene glycol monoethyl ether. The poor solvent is at least one selected from terpineol eat 2-phenoxy ethanol and 2-benzyloxy ethanol.

Abstract: On a surface of a transfer sheet, a resistor paste is first patterned, and a binder resin thereof is then heat-cured to form resistor layers. Next, an electrode paste containing a binder resin, which has a thermosetting temperature lower than a thermosetting temperature and a glass transition temperature of the binder resin of the resistor layers, is patterned on surfaces of the resistor layers and is then heat-cured, thereby forming electrode layers. By the steps described above, powdered silver contained in the electrode layers is unlikely to ooze into the resistor layers.

Abstract: A resistor is produced so that dispersity of carbon black in the resistor is low in a surface of the resistor and high in an inner part thereof. In the surface of the resistor, current paths are formed by the carbon black with poor dispersity to minimize a contact resistance of a sliding contact or the like. In the inner part of the resistor, the carbon black is uniformly dispersed to increase a resistance. Accordingly, a total resistance value can be prevented from lowering.

Abstract: A resistor is provided that is made by laminating at least two resistive layers, where these resistors have conductive particles held in a binder resin. The resistors are laminated such that a top resistor covers a bottom resistor, and a surface of the top resistor is exposed. The resistivity of the top resistor is made smaller than that of the bottom resistor. The top resistor contains carbon fiber and carbon black, where the central particle size of the carbon fiber ranges from 3.5 to 9.0 &mgr;m. The resistor has excellent durability and micro-linearity characteristics. The resistor may also be used as a variable resistor.

Abstract: The invention provides a resistor excellent in micro-linearity and further, the durability to sliding as well as a high-precision variable resistor using the resistor and having a long life. A lower layer and an upper layer of the resistor are laminated, the surface of a resistor on which a slider is slid is formed of the upper layer and resistivity of the upper layer is smaller than that of the lower layer.

Abstract: A variable resistor uses a carbon fiber-base resistor with a specific distribution of carbon particle sizes. Because the particle size distribution of carbon fiber is approximately equal to the normal distribution and 80% by volume or more carbon fiber is included in the particle size range from 1 to 20 &mgr;m, high conductivity in the fiber length direction of carbon fiber that is served as structural material for improving the wear resistance does not affect the micro-linearity.

Abstract: The present invention provides a curable resin compound which is soluble in organic solvents and easy to use, and a method for producing the same. The curable resin compound comprises a structure and crosslinkable groups which end-cap the structure, the structure comprising three or four non-substituted benzene rings each of which is joined with each adjacent benzene ring by an ether or ketone linkage so that both types of linkages are present in the structure. Though the curable resin compound exhibits satisfactory solubilities in organic solvents, a composition comprising the compound can be cured by a crosslinking reaction to be insoluble in the organic solvents while being provided with improved solvent resistance and chemical resistance. Accordingly, the present invention also provides a cured-resin material derived from the aforementioned curable resin compound, the cured-resin material being excellent in solvent resistance, chemical resistance and thermal resistance.

Abstract: A copolymer of the present invention is produced by copolymerization of an electron-donating monomer having an electron-accepting group and an electron-accepting monomer having an electron-accepting group. The copolymer thus exhibits a high dielectric constant, a low level of hygroscopicity and good adhesion.

Abstract: An electroluminescence device comprises a matrix polymer that is a polymer obtained by polymerizing electron-accepting monomers having electron-accepting groups. The electron-accepting groups are cyanoalkyl groups and/or cyanoalkyl-oxyalkyl groups.