Abstract: The present invention is directed to improving an insulating property of a backing in which a lead array is buried. The method includes a coating forming process, in which insulating coatings are formed with respect to at least a plurality of lead rows included in a plurality of lead frames; after the forming of the insulating coatings, a plate manufacturing process, in which a plurality of backing plates are manufactured by pouring a backing material towards a lead row in each of the plurality of lead frames so that the lead row and the backing material are integrated with each other; and a laminating process, in which the plurality of backing plates are laminated.

Abstract: A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

Abstract: A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

Abstract: A thermal-transfer printing apparatus includes a roll-paper-supplying unit that rotates an image-receiving paper roll and unwinds and winds a roll type of first image-receiving paper, and a print unit that includes a thermal head for heating a thermal transfer sheet and that forms an image by transferring a color material from the thermal transfer sheet to the first image-receiving paper. With the image-receiving paper roll removed, a reverse unit that reverses a sheet type of second image-receiving paper is mountable in a region in which the image-receiving paper roll used to be contained. The print unit forms the image on the first image-receiving paper in a first printing mode in which the image-receiving paper roll is contained in the region, and the print unit forms an image on both surfaces of the second image-receiving paper in a second printing mode in which the reverse unit is mounted on the region.

Abstract: An image is formed on a principal surface and a side face of a card. A thermal transfer printing apparatus includes a first feeding unit configured to feed an intermediate transfer medium including a transfer layer that is disposed on one surface of a substrate in such a manner as to be peelable from the substrate, a second feeding unit configured to feed a thermal transfer sheet including a colorant layer disposed on one surface of a base material, a printing unit configured to heat the thermal transfer sheet based on image data and transfer an ink of the colorant layer onto the transfer layer to form an image, and a transfer unit configured to heat the intermediate transfer medium and transfer the transfer layer having the image formed thereon onto a principal surface and a side face of the card.

Abstract: A thermal-transfer printing apparatus includes a roll-paper-supplying unit that rotates an image-receiving paper roll and unwinds and winds a roll type of first image-receiving paper, and a print unit that includes a thermal head for heating a thermal transfer sheet and that forms an image by transferring a color material from the thermal transfer sheet to the first image-receiving paper. With the image-receiving paper roll removed, a reverse unit that reverses a sheet type of second image-receiving paper is mountable in a region in which the image-receiving paper roll used to be contained. The print unit forms the image on the first image-receiving paper in a first printing mode in which the image-receiving paper roll is contained in the region, and the print unit forms an image on both surfaces of the second image-receiving paper in a second printing mode in which the reverse unit is mounted on the region.

Abstract: An image is formed on a principal surface and a side face of a card. A thermal transfer printing apparatus includes a first feeding unit configured to feed an intermediate transfer medium including a transfer layer that is disposed on one surface of a substrate in such a manner as to be peelable from the substrate, a second feeding unit configured to feed a thermal transfer sheet including a colorant layer disposed on one surface of a base material, a printing unit configured to heat the thermal transfer sheet based on image data and transfer an ink of the colorant layer onto the transfer layer to form an image, and a transfer unit configured to heat the intermediate transfer medium and transfer the transfer layer having the image formed thereon onto a principal surface and a side face of the card.

Abstract: A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

Abstract: A manufacturing method for an ultrasonic probe including the steps of forming a plurality of unit fixing plates. Laminating each unit fixing plates to one another to form a fixing base and inserting lead wires into grooves formed in the fixing base. Partially cutting away and smoothing both principal surfaces of the fixing base to expose lead wires. Fixing a piezoelectric plate to one principal surface of the fixing base and cutting out between the lead wires in a one dimension direction and a two dimension direction, to divide up said piezoelectric plate and the fixing base into a plurality of piezoelectric elements.

Abstract: The invention relates to an ultrasonic probe in which the array accuracy of lead wires, and heat resistance when connecting to a connector are enhanced, and a manufacturing method therefor. The ultrasonic probe of the invention is one in which a plurality of piezoelectric elements are arrayed in a two-dimensional direction on a fixing base, and lead wires from the lower surface of each of the piezoelectric elements are inserted through the fixing base, and the electrically connected lead wires are led out, and the fixing base has an opening portion in an array direction of the piezoelectric elements, and comprises unit fixing plates laminated in the array direction, and grooves through which the lead wires are inserted, are formed on one principal surface of the unit fixing plates, and damper material is filled into the opening portion. The invention is also for a manufacturing method for the ultrasonic probe.

Abstract: The invention relates to an ultrasonic probe in which the array accuracy of lead wires, and heat resistance when connecting to a connector are enhanced, and a manufacturing method therefor. The ultrasonic probe of the invention is one in which a plurality of piezoelectric elements are arrayed in a two-dimensional direction on a fixing base, and lead wires from the lower surface of each of the piezoelectric elements are inserted through the fixing base, and the electrically connected lead wires are led out, and the fixing base has an opening portion in an array direction of the piezoelectric elements, and comprises unit fixing plates laminated in the array direction, and grooves through which the lead wires are inserted, are formed on one principal surface of the unit fixing plates, and damper material is filled into the opening portion. The invention is also for a manufacturing method for the ultrasonic probe.

Abstract: The invention is constructed such that, in an ultrasonic probe in which a peripheral side face of a piezoelectric plate is covered with a shielding case, and an acoustic matching layer is provided on an ultrasonic wave transmission reception face including the piezoelectric plate and the shielding case, there is provided a voltage proof material on a tip side of the shielding case including at least an aperture end face. Moreover, the piezoelectric plate may be a divided type ultrasonic probe which is divided into two by a shielding plate, and the voltage proof material is provided on the tip side of the shielding plate including the end face. The voltage proof material may be a polyimide tape. As a result, it is possible to provide an ultrasonic probe which has a shielding function, and in which destruction of the acoustic matching layer caused by the applied voltage is prevented. Thus, excellent voltage endurance is maintained.

Abstract: A matrix type ultrasonic probe is disclosed, which has a backing material, and a plurality of piezoelectric elements having upper and lower face electrodes, respectively, and arrayed in two-dimensional directions on the backing material. The ultrasonic probe further has first mounts provided for every piezoelectric element and fixedly secured to the backing material, signal lines provided for every piezoelectric element and embedded in the backing material to be exposed on the surface of the respective first mounts, and second mounts provided for every piezoelectric element to be fixedly secured to the lower face of the piezoelectric element and formed therein with through-holes. The first and second mounts are fixedly secured to one another by means of conductive adhesive, and the signal lines and the lower face electrodes are electrically connected to one another by means of the conductive adhesive.

Abstract: The invention relates to an ultrasonic probe in which the array accuracy of lead wires, and heat resistance when connecting to a connector are enhanced, and a manufacturing method therefor. The ultrasonic probe of the invention is one in which a plurality of piezoelectric elements are arrayed in a two-dimensional direction on a fixing base, and lead wires from the lower surface of each of the piezoelectric elements are inserted through the fixing base, and the electrically connected lead wires are led out, and the fixing base has an opening portion in an array direction of the piezoelectric elements, and comprises unit fixing plates laminated in the array direction, and grooves through which the lead wires are inserted, are formed on one principal surface of the unit fixing plates, and damper material is filled into the opening portion. The invention is also for a manufacturing method for the ultrasonic probe.

Abstract: The invention is constructed such that, in an ultrasonic probe in which a peripheral side face of a piezoelectric plate is covered with a shielding case, and an acoustic matching layer is provided on an ultrasonic wave transmission reception face including the piezoelectric plate and the shielding case, there is provided a voltage proof material on a tip side of the shielding case including at least an aperture end face. Moreover, the piezoelectric plate may be a divided type ultrasonic probe which is divided into two by a shielding plate, and the voltage proof material is provided on the tip side of the shielding plate including the end face. The voltage proof material may be a polyimide tape. As a result, it is possible to provide an ultrasonic probe which has a shielding function, and in which destruction of the acoustic matching layer caused by the applied voltage is prevented. Thus, excellent voltage endurance is maintained.

Abstract: A matrix type ultrasonic probe is disclosed, which has a backing material, and a plurality of piezoelectric elements having upper and lower face electrodes, respectively, and arrayed in two-dimensional directions on the backing material. The ultrasonic probe further has first mounts provided for every piezoelectric element and fixedly secured to the backing material, signal lines provided for every piezoelectric element and embedded in the backing material to be exposed on the surface of the respective first mounts, and second mounts provided for every piezoelectric element to be fixedly secured to the lower face of the piezoelectric element and formed therein with through-holes. The first and second mounts are fixedly secured to one another by means of conductive adhesive, and the signal lines and the lower face electrodes are electrically connected to one another by means of the conductive adhesive.

Abstract: A matrix type ultrasonic probe is disclosed, which has a backing material, and a plurality of piezoelectric elements having upper and lower face electrodes, respectively, and arrayed in two-dimensional directions on the backing material. The ultrasonic probe further has first mounts provided for every piezoelectric element and fixedly secured to the backing material, signal lines provided for every piezoelectric element and embedded in the backing material to be exposed on the surface of the respective first mounts, and second mounts provided for every piezoelectric element to be fixedly secured to the lower face of the piezoelectric element and formed therein with through-holes. The first and second mounts are fixedly secured to one another by means of conductive adhesive, and the signal lines and the lower face electrodes are electrically connected to one another by means of the conductive adhesive.

Abstract: A variable type ultrasonic probe is provided, in which each of piezoelectric units accommodated in the probe is separated into a plurality of piezoelectric elements, and the piezoelectric units are easily arrayed in an arcuately curved arrangement. The ultrasonic probe has therein a piezoelectric unit separated into at least three piezoelectric elements, i.e., a central element and both opposite end elements, and disposed on a backing member in a manner such that a lower face electrode of each piezoelectric element is led out. A leading-out wiring board provided with conductive paths formed on both major faces thereof is arranged on the lower faces of the one end and central piezoelectric elements. The lower face electrodes of the one end element and central element are electrically led out by the upper face conductive path and the lower face conductive path of the leading-out wiring board, respectively.

Abstract: A variable type ultrasonic probe is provided, in which each of piezoelectric units accommodated in the probe is separated into a plurality of piezoelectric elements, and the piezoelectric units are easily arrayed in an arcuately curved arrangement. The ultrasonic probe has therein a piezoelectric unit separated into at least three piezoelectric elements, i.e., a central element and both opposite end elements, and disposed on a backing member in a manner such that a lower face electrode of each piezoelectric element is led out. A leading-out wiring board provided with conductive paths formed on both major faces thereof is arranged on the lower faces of the one end and central piezoelectric elements. The lower face electrodes of the one end element and central element are electrically led out by the upper face conductive path and the lower face conductive path of the leading-out wiring board, respectively.