Patents by Inventor Yoshihiro Tomomatsu

Yoshihiro Tomomatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11940347
    Abstract: A pressure sensor has a stem in which a pressure introduction hole into which a pressure medium is introduced and a diaphragm deformable according to the pressure of the pressure medium are formed, and a strain detecting element which is arranged on the diaphragm via an insulating film and being configured to output a detection signal according to the deformation of the diaphragm. The strain detecting element is configured to have a portion made of polysilicon. A low doping layer having a higher electrical resistivity than polysilicon and a higher crystallinity than the insulating film is arranged between the insulating film and the strain detecting element.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: March 26, 2024
    Assignees: DENSO CORPORATION, NAGANO KEIKI CO., LTD.
    Inventors: Hiroshi Kodama, Naoki Yoshida, Kaori Miyashita, Eiji Takeda, Nobuaki Yamada, Yoshihiro Tomomatsu, Yasushi Yanagisawa, Yusuke Midorikawa, Shirou Kamanaru, Kenichi Yokoyama, Inao Toyoda, Hisayuki Takeuchi, Naohisa Niimi, Masao Takahashi, Yasutake Ura, Kouji Asano, Yukihiro Kamada
  • Publication number: 20220042868
    Abstract: A pressure sensor has a stem in which a pressure introduction hole into which a pressure medium is introduced and a diaphragm deformable according to the pressure of the pressure medium are formed, and a strain detecting element which is arranged on the diaphragm via an insulating film and being configured to output a detection signal according to the deformation of the diaphragm. The strain detecting element is configured to have a portion made of polysilicon. A low doping layer having a higher electrical resistivity than polysilicon and a higher crystallinity than the insulating film is arranged between the insulating film and the strain detecting element.
    Type: Application
    Filed: October 22, 2021
    Publication date: February 10, 2022
    Inventors: Hiroshi KODAMA, Naoki YOSHIDA, Kaori MIYASHITA, Eiji TAKEDA, Nobuaki YAMADA, Yoshihiro TOMOMATSU, Yasushi YANAGISAWA, Yusuke MIDORIKAWA, Shirou KAMANARU, Kenichi YOKOYAMA, Inao TOYODA, Hisayuki TAKEUCHI, Naohisa NIIMI, Masao TAKAHASHI, Yasutake URA, Kouji ASANO, Yukihiro KAMADA
  • Patent number: 7802468
    Abstract: Disclosed is a pressure sensor 1 for a vehicle including a sensing element 10 for measuring the pressure of brake fluids in fluid passages, a sensor housing 20 for accommodating the sensing element 10, and contact probes 30 that are electrically connected to the sensing element 10 and an electronic control unit 300 (control unit). Each contact probe 30 includes a sleeve 31, a coil spring 32 (elastic member) housed in the sleeve 31, the rod 33 inserted into the sleeve 31. The sleeve 31 is connected to the sensing element 10 in a state that the sleeve 31 is fixed in the sensor housing 20, and the rod 33 is pressed to the electronic unit 300 by pressing force of the coil spring 32.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: September 28, 2010
    Assignees: Nissin Kogyo Co., Ltd., Nagano Keiki Co., Ltd.
    Inventors: Tatsuya Shinohara, Masahiko Nakano, Atsushi Imai, Yoshihiro Tomomatsu
  • Publication number: 20090038388
    Abstract: Disclosed is a pressure sensor 1 for a vehicle including a sensing element 10 for measuring the pressure of brake fluids in fluid passages, a sensor housing 20 for accommodating the sensing element 10, and contact probes 30 that are electrically connected to the sensing element 10 and an electronic control unit 300 (control unit). Each contact probe 30 includes a sleeve 31, a coil spring 32 (elastic member) housed in the sleeve 31, the rod 33 inserted into the sleeve 31. The sleeve 31 is connected to the sensing element 10 in a state that the sleeve 31 is fixed in the sensor housing 20, and the rod 33 is pressed to the electronic unit 300 by pressing force of the coil spring 32.
    Type: Application
    Filed: August 8, 2008
    Publication date: February 12, 2009
    Applicants: Nissin Kogyo Co., Ltd., Nagano Keiki Co., Ltd.
    Inventors: Tatsuya Shinohara, Masahiko Nakano, Atsushi Imai, Yoshihiro Tomomatsu
  • Patent number: 6619132
    Abstract: A pressure sensor (1) has a circuit board (5) having a circuit portion (11) for amplifying an electric signal detected by a pressure detecting element (2C) and attached with an IC die (16), and a terminal (12) for inputting and outputting the electric signal from the circuit portion (11). The circuit portion (11) and the terminal (12) have a frame (11A, 12D) formed by a metal plate, the metal plate being provided with resin molds (14, 15). The circuit portion (11) and the terminal (12) are continuously formed, so that steps for soldering etc. is not necessary.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: September 16, 2003
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Atsushi Imai, Kouzou Yamagishi, Yoshihiro Tomomatsu
  • Patent number: 6584851
    Abstract: A pressure sensor has a joint (1) having a pressure port (13), a pressure detecting device (2) bonded to the joint (1) to convert fluid pressure to an electric signal and a housing (5) provided to an output side of the pressure detecting device (2), the pressure sensor further including a flange member (3) bonded to the joint (1) and having a through-hole (26) for the pressure detecting device (2) to be inserted and a connector (6) bonded to the flange member (3) to fix the housing (5).
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: July 1, 2003
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Kouzou Yamagishi, Yoshihiro Tomomatsu, Atsushi Imai
  • Publication number: 20020100331
    Abstract: A pressure sensor (1) has a circuit board (5) having a circuit portion (11) for amplifying an electric signal detected by a pressure detecting element (2C) and attached with an IC die (16), and a terminal (12) for inputting and outputting the electric signal from the circuit portion (11). The circuit portion (11) and the terminal (12) have a frame (11A, 12D) formed by a metal plate, the metal plate being provided with resin molds (14, 15). The circuit portion (11) and the terminal (12) are continuously formed, so that steps for soldering etc. is not necessary.
    Type: Application
    Filed: January 31, 2002
    Publication date: August 1, 2002
    Inventors: Atsushi Imai, Kouzou Yamagishi, Yoshihiro Tomomatsu
  • Publication number: 20020062697
    Abstract: A pressure sensor has a joint (1) having a pressure port (13), a pressure detecting device (2) bonded to the joint (1) to convert fluid pressure to an electric signal and a housing (5) provided to an output side of the pressure detecting device (2), the pressure sensor further including a flange member (3) bonded to the joint (1) and having a through-hole (26) for the pressure detecting device (2) to be inserted and a connector (6) bonded to the flange member (3) to fix the housing (5).
    Type: Application
    Filed: November 29, 2001
    Publication date: May 30, 2002
    Inventors: Kouzou Yamagishi, Yoshihiro Tomomatsu, Atsushi Imai