Abstract: A pressure sensor has a stem in which a pressure introduction hole into which a pressure medium is introduced and a diaphragm deformable according to the pressure of the pressure medium are formed, and a strain detecting element which is arranged on the diaphragm via an insulating film and being configured to output a detection signal according to the deformation of the diaphragm. The strain detecting element is configured to have a portion made of polysilicon. A low doping layer having a higher electrical resistivity than polysilicon and a higher crystallinity than the insulating film is arranged between the insulating film and the strain detecting element.

Abstract: A printed circuit board is fabricated in a manufacturing process. In an inspection process, first and second light sources of an inspection device irradiate the printed circuit board with first and second light having first and second wavelength distributions. First and second imaging devices produce a monochromatic first image and a color second image of an inspection subject region of the printed circuit board based on the first and second light respectively reflected by the printed circuit board. Presence and absence of a defect is determined based on at least the first image by automatic optical inspection. Further, verification of the defect is performed by visual observation of at least the second image.

Abstract: A base insulating layer and a cover insulating layer of a first printed circuit board are formed of a first insulating material, and a base insulating layer and a cover insulating layer of a second printed circuit board are formed of a second insulating material. During inspection of the first printed circuit board, the first printed circuit board is irradiated with first light having a peak wavelength in a first wavelength range, and an image is produced based on reflected light from the first printed circuit board. During inspection of the second printed circuit board, the second printed circuit board is irradiated with second light having a peak wavelength in a second wavelength region different from the first wavelength region, and an image is produced based on reflected light from the second printed circuit board.

Abstract: A base insulating layer and a cover insulating layer of a first printed circuit board are formed of a first insulating material, and a base insulating layer and a cover insulating layer of a second printed circuit board are formed of a second insulating material. During inspection of the first printed circuit board, the first printed circuit board is irradiated with first light having a peak wavelength in a first wavelength range, and an image is produced based on reflected light from the first printed circuit board. During inspection of the second printed circuit board, the second printed circuit board is irradiated with second light having a peak wavelength in a second wavelength region different from the first wavelength region, and an image is produced based on reflected light from the second printed circuit board.

Abstract: A printed circuit board is fabricated in a manufacturing process. In an inspection process, first and second light sources of an inspection device irradiate the printed circuit board with first and second light having first and second wavelength distributions. First and second imaging devices produce a monochromatic first image and a color second image of an inspection subject region of the printed circuit board based on the first and second light respectively reflected by the printed circuit board. Presence and absence of a defect is determined based on at least the first image by automatic optical inspection. Further, verification of the defect is performed by visual observation of at least the second image.

Abstract: A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform.

Abstract: An inspection device includes a light emitting unit emitting incident light that enters the insulating cover layer and a light receiving unit receiving reflected light that is reflected from the incident light on the surface of the insulating cover layer. The light emitting unit includes a first light emitting portion in a ring state that emits the incident light so that the angle thereof with respect to the surface of the insulating base layer is in the range of 25° or less and a second light emitting portion in a ring state that emits the incident light so that the angle thereof with respect to the surface of the insulating base layer is in the range of 35 to 65°.

Abstract: A wired circuit board includes a conductive pattern, and an insulating layer covering the conductive pattern and having a transmittance of not more than 30% with respect to a wavelength in a range of 600 to 680 nm.

Abstract: A producing method of a wired circuit board includes the steps of preparing the wired circuit board, placing the wired circuit board on a support table, and applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light, table reflected light and foreign-matter reflected light to inspect the conductive pattern and the foreign matter based on a contrast therebetween. In the step of inspecting the conductive pattern and the foreign matter, a reflectance of the table reflected light is in a range of 25 to 55%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.

Abstract: A producing method of a wired circuit board includes the steps of applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light which is the light reflected by a conductive pattern, table reflected light which is the light reflected by a support table via an insulating layer exposed from the conductive pattern, and foreign-matter reflected light which is the light reflected by a foreign matter present on the insulating layer to inspect the conductive pattern and the foreign matter based on a contrast therebetween. A reflectance of the table reflected light is in a range of 30 to 70%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.

Abstract: An inspection device includes a light emitting unit emitting incident light that enters the insulating cover layer and a light receiving unit receiving reflected light that is reflected from the incident light on the surface of the insulating cover layer. The light emitting unit includes a first light emitting portion in a ring state that emits the incident light so that the angle thereof with respect to the surface of the insulating base layer is in the range of 25° or less and a second light emitting portion in a ring state that emits the incident light so that the angle thereof with respect to the surface of the insulating base layer is in the range of 35 to 65°.

Abstract: A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform.

Abstract: A producing method of a wired circuit board includes the steps of preparing the wired circuit board, placing the wired circuit board on a support table, and applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light, table reflected light and foreign-matter reflected light to inspect the conductive pattern and the foreign matter based on a contrast therebetween. In the step of inspecting the conductive pattern and the foreign matter, a reflectance of the table reflected light is in a range of 25 to 55%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.

Abstract: A producing method of a wired circuit board includes the steps of applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light which is the light reflected by a conductive pattern, table reflected light which is the light reflected by a support table via an insulating layer exposed from the conductive pattern, and foreign-matter reflected light which is the light reflected by a foreign matter present on the insulating layer to inspect the conductive pattern and the foreign matter based on a contrast therebetween. A reflectance of the table reflected light is in a range of 30 to 70%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.

Abstract: A producing method of a wired circuit board includes the steps of preparing an insulating base layer, forming a wire on the insulating base layer, forming an insulating cover layer on the insulating base layer so as to cover the wire, and irradiating the insulating cover layer with light with a wavelength of more than 700 nm and less than 950 nm to inspect for foreign substance with a reflected light from the insulating cover layer.

Abstract: A producing method of a wired circuit board includes the steps of preparing an insulating base layer, forming a wire on the insulating base layer, forming an insulating cover layer on the insulating base layer so as to cover the wire, and applying near-infrared light with a wavelength of more than 700 nm and less than 950 nm from either one of the insulating base layer and the insulating cover layer through the other insulating layer to thereby inspect a foreign substance with the light transmitted therethrough.

Abstract: A wired circuit board includes a conductive pattern, and an insulating layer covering the conductive pattern and having a transmittance of not more than 30% with respect to a wavelength in a range of 600 to 680 nm.

Abstract: The present invention relates to an anti-inflammatory eye drop comprising a drug selectively inhibiting COX-2, selected from the group consisting of etodolac, N-(2-(cyclohexyloxy)-4-nitrophenyl) methane-sulfonamide and meloxicam, which only slightly damages corneal epithelium and conjunctiva and which is excellent in the anti-inflammatory effect.

Abstract: A high vacuum apparatus which comprises:a vacuum vessel,a mechanical booster connected to the vacuum vessel,a rotary pump connected to the mechanical booster,a gas inlet provided with a connecting pipe which connects the mechanical booster with the rotary pump, to introduce a gas into the suction side of the rotary pump so as to maintain the degree of vacuum in the suction side of the rotary pump lower than the maximum degree of vacuum attainable of the rotary pump, so that substantially no contamination of the atmosphere in the vacuum vessel by the reverse diffusing oil vapor occurs.

Abstract: This invention relates to an apparatus for transferring a mold from a centrifugal compacting device to the next place in the process of manufacturing a concrete pole or pile, by using many jacks to raise a mold from on the centrifugal compacting device for the transferring operation to rails on which the mold is put to be transferred to the next place.