Abstract: The invention provides a method for releasing a first polymer film, wherein a layered body is prepared by adhering, to each other, an inorganic substrate and a first polymer film on which an electronic device has been formed; the first polymer film side of the layered body is placed and fixed so as to be in contact with a vacuum suction plate, a partition wall is provided on a side surface of the layered body, and a second polymer film that is larger than the inorganic substrate is layered onto the inorganic substrate side of the layered body, so as to provide an enclosed space formed by the vacuum suction plate, the second polymer film, and the partition wall; and a releasing portion is provided between the first polymer film and the inorganic substrate and air is injected into this releasing portion to release the first polymer film.