Abstract: A method of cutting a cut member out of an original sheet by means of thermal cutting and machining, and includes a hole-cutting process, a finishing process, and an outer periphery-cutting process. During the hole-cutting process, a hole is created in the original sheet by means of thermal cutting while leaving a machining allowance in addition to the finished size of the hole. During the finishing process, a cutting tool is inserted into the hole which has been created through the hole-cutting process, and the cutting tool is guided along the inner circumference of the hole so as to cut the thermally-cut end surface in order to machine the hole to the finished size. During the outer periphery-cutting process, the outer periphery of the cut member is cut by means of thermal cutting to take the cut member out of the original sheet.

Abstract: A sheet conveying apparatus according to one aspect of the present disclosure includes a housing, a sheet storage portion, a sheet conveying path, and a guide member. Housing is mounted to apparatus body that includes bottom portion having opening portion, and main sheet conveying path extending upward from opening portion to convey sheets, and includes top face portion arranged opposing bottom portion. Sheet conveying path extends from sheet storage portion to top face portion, and is configured to be capable of communicating with main sheet conveying path. Sheets are conveyed on sheet conveying path. Guide member is pivotably supported by housing, and is configured to be capable of changing its position between a first position where guide member follows along top face portion and a second position where guide member projects upward from top face portion to guide sheet toward main sheet conveying path from sheet conveying path.

Abstract: There is provided a dye-sensitized solar cell high in power generation efficiency. A dye-sensitized solar cell 10 includes: a transparent substrate 12; a conductive substrate 14; a porous semiconductor layer 16 containing a dye adsorbed thereto; and a conductive metal layer 18 arranged in contact with a side of the porous semiconductor layer 16 opposite to the transparent substrate 12 and serving as an anode electrode. The conductive metal layer 18 is formed of a metallic porous body having through-holes, and a multitude of holes of the metallic porous body are isotropically communicated with one another. The metallic porous body has a specific surface area of 0.1 m2/g or larger, a porosity of 30 to 60 vol. %, and a pore diameter of 1 ?m to 40 ?m, and is formed of a metal material, such as Ti, W, Ni, Pt or Au.

Abstract: Disclosed in certain embodiments is a method of inhibiting cell function comprising inducing the expression of a mRNA interferase that cleaves mRNA at GCU.

Abstract: A plurality of cutout members are cut out from a plate blank by a plasma arc generated from a plasma torch by a method including a piercing step and a cutting step. In the piercing step, an aperture is formed on an outer peripheral side of a cutout member by maintaining the plasma torch at a first height from the plate blank on the outer peripheral side of the cutout member while the plasma arc is generated from the plasma torch and by moving the plasma torch relative to the plate blank in a horizontal direction. In the cutting step, a continuous cutting groove is formed along an outer contour of the cutout member by setting the plasma torch at a second height lower than the first height and by moving the plasma torch in the horizontal direction along an incision part and a processing line continuing to the incision part.

Abstract: The present invention provides a novel use of a SPP system for replacing natural amino acid residues with non-naturally occurring amino acids in a protein or peptide, using cell based expression system.

Abstract: The present invention provides an improved and specific mRNA interferase and related methods of protein-based mRNA interference.

Abstract: A sheet conveying apparatus according to one aspect of the present disclosure includes a housing, a sheet storage portion, a sheet conveying path, and a guide member. Housing is mounted to apparatus body that includes bottom portion having opening portion, and main sheet conveying path extending upward from opening portion to convey sheets, and includes top face portion arranged opposing bottom portion. Sheet conveying path extends from sheet storage portion to top face portion, and is configured to be capable of communicating with main sheet conveying path. Sheets are conveyed on sheet conveying path. Guide member is pivotably supported by housing, and is configured to be capable of changing its position between a first position where guide member follows along top face portion and a second position where guide member projects upward from top face portion to guide sheet toward main sheet conveying path from sheet conveying path.

Abstract: An object is to provide a semiconductor device having a plate electrode adapted to a plurality of chips, capable of being produced at low cost, and having high heat cycle property. A semiconductor device according to the present invention includes a plurality of semiconductor chips formed on a substrate, and a plate electrode connecting electrodes of the plurality of semiconductor chips. The plate electrode has half-cut portions formed by half-pressing and the raised sides of the half-cut portions are bonded with the electrodes of the semiconductor chips.

Abstract: An object is to provide a semiconductor device having a plate electrode adapted to a plurality of chips, capable of being produced at low cost, and having high heat cycle property. A semiconductor device according to the present invention includes a plurality of semiconductor chips formed on a substrate, and a plate electrode connecting electrodes of the plurality of semiconductor chips. The plate electrode has half-cut portions formed by half-pressing and the raised sides of the half-cut portions are bonded with the electrodes of the semiconductor chips.

Abstract: Provided is a dye-sensitized solar cell, and a method for manufacturing the same, that in a technology in which a current collector electrode is used instead of a transparent conductive film, can be manufactured by a simple cell producing operation and is capable of achieving a desirably thin thickness for the current collector electrode. A dye-sensitized solar cell 10 includes a transparent substrate 12 provided on the side where solar light is incident, a conductive substrate 14 that serves as a cathode and is provided opposite the transparent substrate 12, a porous semiconductor layer 16, a porous conductive metal layer 18 that serves as a current collector electrode, and a porous insulating layer 20. The porous conductive metal layer 18 is a layer that has a thickness of 0.3 ?m to 100 ?m and is deposited on the porous insulating layer 20.

Abstract: A semiconductor device according to the present invention includes a plurality of semiconductor chips, a plate electrode disposed on the plurality of semiconductor chips for connecting the plurality of semiconductor chips, and an electrode disposed on the plate electrode. The electrode has a plurality of intermittent bonding portions to be bonded to the plate electrode and a protruded portion which is protruded erectly from the bonding portions. The protruded portion has an ultrasonic bonding portion which is parallel with the bonding portion and is ultrasonic bonded to an external electrode.

Abstract: The present invention includes a plate electrode to be a plate-shaped electrode member, an epoxy sheet serving as an integrated insulating sheet and provided on the plate electrode, a double printed board serving as a control board and provided on the epoxy sheet, and a board integrated electrode in which the plate electrode and the double printed board are formed integrally by the epoxy sheet.

Abstract: A reactor includes a core body having a U-shape block core and an I-shape block core arranged with a gap, a coil wound on an outer circumference of the core body, and a gap plate inserted into the gap between the U-shape block core and I-shape block core. The gap plate includes a coil retaining member extending towards and retaining the coil. By such a configuration, a reactor having temperature increase at the coil suppressed can be provided.

Abstract: To provide a dye-sensitized solar cell with suppressed photoelectric conversion efficiency deterioration due to a gap to be possibly be generated between a transparent member on which a light is incident and the dye-sensitized solar cell components. A dye-sensitized solar cell 10 is provided with a dye-sensitized solar cell components unit 14 arranged within a cylindrical transparent member 12, the unit having an electrolyte layer, current collecting electrode 18, and porous semiconductor layer 20 carrying dye cylindrically laminated in this order centering around a cathode electrode layer 16. The cathode electrode layer 16 is a spring body, and the dye-sensitized solar cell components unit 14 is pressed to the transparent member 12 with an elastic restoring force of the spring.

Abstract: A dye-sensitized solar cell is provided, wherein it can be produced by a relatively easy and simple process and ensures high conversion efficiency even in cases where the thickness of the porous semiconductor layer is increased. The dye-sensitized solar cell 10 includes, in the interior of or on the conductive-substrate-side surface of the porous semiconductor layer 16, conductive metal film 20, such as a film of tungsten, having a large number of randomly located penetrations 24. Penetrations 24 of the conductive metal film 20 are formed by forming a fine-particle layer on the surface of the porous semiconductor layer, forming a conductive metal film on the surface of the fine-particle layer, and making the fine-particle layer disappear by heating or solvent-cleaning.

Abstract: A dye-sensitized solar cell is provided, wherein it can be produced by a relatively easy and simple process and ensures high conversion efficiency even in cases where the thickness of the porous semiconductor layer is increased. The dye-sensitized solar cell 10 includes, in the interior of or on the conductive-substrate-side surface of the porous semiconductor layer 16, conductive metal film 20, such as a film of tungsten, having a large number of randomly located penetrations 24. Penetrations 24 of the conductive metal film 20 are formed by forming a fine-particle layer on the surface of the porous semiconductor layer, forming a conductive metal film on the surface of the fine-particle layer, and making the fine-particle layer disappear by heating or solvent-cleaning.

Abstract: A lattice pallet 13 having a large number of supporters for placing a plate 14 is installed to a table 12 so as to be freely fittable and removable. Bringing in of the plate 14 is performed by the method of raising the lattice pallet 13 with a crane with the plate 14 already having been loaded upon the lattice pallet 13 in a different location, transporting them over the table 12, and lowering them down onto the table 12. Directly after cutting has been completed, the lattice pallet 12 is raised and separated from the table 12 with the manufactured product and the left over material carried upon it and is taken away to a different location, and another lattice pallet 13 with another plate 14 mounted upon it is brought in with the crane upon the table 12, and the task of cutting this other plate 14 is commenced.

Abstract: In a main circuit 11 of the plasma cutter power supply device 6, a plurality of DC power units 14-1, . . . 14-n of low capacity are connected in parallel on their DC output sides, and are connected to a plasma torch 20. Each power unit 14-1, . . . 14-n can operate asynchronously and independently from each other. The power supply control device 6 controls the number of power units to be operated, and the intensity of output electrical current at which each of them is to be operated, according to the cutting conditions (the nature of the material to be cut, its thickness, and the cutting speed) and according to the number of power units which can be operated. If some of the power units are faulty, the power supply control device 6 controls the cutting conditions which can be accepted, according to the number of normal power units.

Abstract: A dye-sensitized solar cell is provided, wherein it can be produced by a relatively easy and simple process and ensures high conversion efficiency even in cases where the thickness of the porous semiconductor layer is increased. The dye-sensitized solar cell 10 includes, in the interior of or on the conductive-substrate-side surface of the porous semiconductor layer 16, conductive metal film 20, such as a film of tungsten, having a large number of randomly located penetrations 24. Penetrations 24 of the conductive metal film 20 are formed by forming a fine-particle layer on the surface of the porous semiconductor layer, forming a conductive metal film on the surface of the fine-particle layer, and making the fine-particle layer disappear by heating or solvent-cleaning.