Abstract: Provided is a grain-oriented electrical steel sheet including a base steel sheet, an intermediate layer which is disposed in contact with the base steel sheet and mainly includes silicon oxide, and an insulation coating which is disposed in contact with the intermediate layer and mainly includes phosphate and colloidal silica, in which the base steel sheet contains predetermined chemical composition, BN having an average particle size of 50 to 300 nm is present, when an emission intensity of B is measured using glow discharge emission analysis, predetermined conditions are satisfied, and a ratio of a major axis to a minor axis of BN is 1.5 or less.

Abstract: Provided is a resin composition comprises a cyanate ester compound (A), an amine adduct compound (B) and a borate ester (C).

Abstract: A vehicle canister mounting structure for a vehicle, the vehicle including a frame and an upper structure, such as a cabin, mounted on the frame, includes a primary bracket and a secondary bracket. The primary bracket is fastened to the frame by a primary fastener. The secondary bracket is fastened to the primary bracket by a secondary fastener and is attached to a canister. One of the primary fastener and the secondary fastener is configured to allow fastening to be performed from above the frame. The other of the primary and secondary fasteners is configured to allow fastening to be performed from below the frame.

Abstract: A semiconductor device includes a semiconductor element, a bonding wire that is electrically connected to the semiconductor element, a connection terminal, and sealing material that seals the semiconductor element, the bonding wire, and a part of the connection terminal. In addition, the connection terminal includes a plate-shaped lead part having a bonding area to which the bonding wire is bonded and an anchor part protruding from a first side part of the lead part. In the semiconductor device, since the rear surface of a die pad and the rear surface of the lead part exposed to the outside in a sealing main surface of the sealing material occupy a predetermined area or more, the heat dissipation of the semiconductor device is improved.

Abstract: A vehicle canister mounting structure for a vehicle, the vehicle including a frame and an upper structure, such as a cabin, mounted on the frame, includes a primary bracket and a secondary bracket. The primary bracket is fastened to the frame by a primary fastener. The secondary bracket is fastened to the primary bracket by a secondary fastener and is attached to a canister. One of the primary fastener and the secondary fastener is configured to allow fastening to be performed from above the frame. The other of the primary and secondary fasteners is configured to allow fastening to be performed from below the frame.

Abstract: A device for mounting a canister includes an externally threaded element, a rod element, a canister, and an internally threaded element screwed. The externally threaded element is located on a vehicle body member. The rod element is also located on the vehicle body member and extends parallel to the externally threaded element. The canister includes a casing. The casing includes a mounting portion and a retaining portion. The mounting portion defines an insertion hole configured to allow the externally threaded element to be inserted thereinto. The retaining portion includes a retention area. The retaining portion is configured to hold onto the rod element when the rod element has been inserted through the retention area. The internally threaded element is screwed on the externally threaded element after the externally threaded element has been inserted through the insertion hole.

Abstract: Provided is a semiconductor device including a semiconductor chip; a frame member having a chip placement surface on which the semiconductor chip is provided; and a first suspension lead and a second suspension lead connected to the frame member and provided on any side of the frame member, wherein M1?L1+L2 is satisfied, where L1 is a distance from an arrangement position of the first suspension lead to a corner of the chip placement surface close to the first suspension lead, L2 is a distance from an arrangement position of the second suspension lead to a corner of the chip placement surface close to the second suspension lead, and M1 is a distance from the arrangement position of the first suspension lead to the arrangement position of the second suspension lead.

Abstract: A semiconductor device includes a semiconductor element, a bonding wire that is electrically connected to the semiconductor element, a connection terminal, and sealing material that seals the semiconductor element, the bonding wire, and a part of the connection terminal. In addition, the connection terminal includes a plate-shaped lead part having a bonding area to which the bonding wire is bonded and an anchor part protruding from a first side part of the lead part. In the semiconductor device, since the rear surface of a die pad and the rear surface of the lead part exposed to the outside in a sealing main surface of the sealing material occupy a predetermined area or more, the heat dissipation of the semiconductor device is improved.

Abstract: The present invention provides a novel cyanic acid ester compound that has excellent solvent solubility and provides a cured product having a low rate of thermal expansion and having excellent flame retardance and heat resistance, and a resin composition containing the compound, etc. The present invention provides a resin composition whose cured product obtained by curing can achieve a printed circuit board excellent in peel strength, glass transition temperature, rate of thermal expansion, rate of water absorption, and thermal conductivity. The present invention provides a resin composition whose cured product obtained by curing can achieve a printed circuit board not only having a high glass transition temperature and low thermal expansibility but being also excellent in flexural modulus and thermal conductivity.

Abstract: To enhance the reliability of a semiconductor device. A semiconductor device is provided that includes a semiconductor element having a first pad, a frame member having a second pad, a connection member that contains at least one of copper and silver and connects the first pad and the second pad, and a sealing portion that is formed of resin composition containing no sulfur and seals the semiconductor element, the frame member, and the connection member, wherein arithmetic mean roughness of an upper surface of the first pad is equal to or greater than 0.02 ?m. Arithmetic mean roughness of an upper surface of the second pad may be greater than the arithmetic mean roughness of the first pad. Sulfur content contained in the resin composition may be less than NH4 ion content contained in the resin composition.

Abstract: Provided is a semiconductor device including a semiconductor chip; a frame member having a chip placement surface on which the semiconductor chip is provided; and a first suspension lead and a second suspension lead connected to the frame member and provided on any side of the frame member, wherein M1?L1+L2 is satisfied, where L1 is a distance from an arrangement position of the first suspension lead to a corner of the chip placement surface close to the first suspension lead, L2 is a distance from an arrangement position of the second suspension lead to a corner of the chip placement surface close to the second suspension lead, and M1 is a distance from the arrangement position of the first suspension lead to the arrangement position of the second suspension lead.

Abstract: The present invention provides a novel cyanic acid ester compound that has excellent solvent solubility and provides a cured product having a low rate of thermal expansion and having excellent flame retardance and heat resistance, and a resin composition containing the compound, etc. The present invention provides a resin composition whose cured product obtained by curing can achieve a printed circuit board excellent in peel strength, glass transition temperature, rate of thermal expansion, rate of water absorption, and thermal conductivity. The present invention provides a resin composition whose cured product obtained by curing can achieve a printed circuit board not only having a high glass transition temperature and low thermal expansibility but being also excellent in flexural modulus and thermal conductivity.

Abstract: To enhance the reliability of a semiconductor device. A semiconductor device is provided that includes a semiconductor element having a first pad, a frame member having a second pad, a connection member that contains at least one of copper and silver and connects the first pad and the second pad, and a sealing portion that is formed of resin composition containing no sulfur and seals the semiconductor element, the frame member, and the connection member, wherein arithmetic mean roughness of an upper surface of the first pad is equal to or greater than 0.02 ?m. Arithmetic mean roughness of an upper surface of the second pad may be greater than the arithmetic mean roughness of the first pad. Sulfur content contained in the resin composition may be less than NH4 ion content contained in the resin composition.

Abstract: An evaporated fuel processing apparatus includes a casing provided with a tank port, and the casing is provided with at least one adsorbent layer filled with adsorbent which adsorbs/desorbs evaporated fuel generated in a fuel tank or the like, a vapor-liquid separator separating the evaporated fuel introduced from the tank port into a vapor phase component and a liquid phase component thereof, respectively, and a filter separating the vapor-liquid separator from the adsorbent layer, and, a liquid storing member which is a component separate from the casing, and is opened at at least a tank port side for storing the separated liquid phase component is attached in the casing, and, the filter is fixed to an inner circumferential surface of the casing and the liquid storing member is sandwiched between the casing and the filter.

Abstract: A disk brake device has a rotor, a carrier, a caliper, an inner pad, and a braking operation mechanism. The braking operation mechanism includes a base plate, a wedge plate, and a slide member movement mechanism which moves the wedge plate in a direction perpendicular to a braking surface while moving the wedge plate to slide in a rotating direction of the rotor. The carrier includes an inner-side rotating-direction movement restricting portion which faces the base plate in the rotating direction of the rotor and abuts against the base plate in the rotating direction of the rotor to restrict movement of the base plate in the rotating direction. The base plate is held by the caliper to be movable in the direction perpendicular to the braking surface with movement of the base plate in the rotating direction of the rotor kept restricted by the inner-side rotating-direction movement restricting portion.

Abstract: An evaporated fuel processing apparatus includes a casing provided with a tank port, and the casing is provided with at least one adsorbent layer filled with adsorbent which adsorbs/desorbs evaporated fuel generated in a fuel tank or the like, a vapor-liquid separator separating the evaporated fuel introduced from the tank port into a vapor phase component and a liquid phase component thereof, respectively, and a filter separating the vapor-liquid separator from the adsorbent layer, and, a liquid storing member which is a component separate from the casing, and is opened at at least a tank port side for storing the separated liquid phase component is attached in the casing, and, the filter is fixed to an inner circumferential surface of the casing and the liquid storing member is sandwiched between the casing and the filter.

Abstract: A disk brake device has a rotor, a carrier, a caliper, an inner pad, and a braking operation mechanism. The braking operation mechanism includes a base plate, a wedge plate, and a slide member movement mechanism which moves the wedge plate in the direction perpendicular to a braking surface while moving the wedge plate to slide in the rotating direction of the rotor. The carrier includes inner-side rotating-direction movement restricting portions which hold the base plate therebetween. The disk brake device further includes a pressing positioning member inserted into one of gaps between the inner-side rotating-direction movement restricting portions and both ends of the base member so as to be attached to the base member. The pressing positioning member presses the base plate in the direction away from the inner-side rotating-direction movement restricting portion to position the base plate relative to the carrier in the rotating direction.

Abstract: A disk brake device has a rotor, a carrier, a caliper, an inner pad, and a braking operation mechanism. The braking operation mechanism includes a base plate held by the caliper; a wedge plate which holds the inner pad; a first motion conversion mechanism which moves the wedge plate in a direction perpendicular to a braking surface while moving the wedge plate to slide in a rotating direction of the rotor; an electric motor which includes a motor output shaft which outputs a rotational driving force; and a second motion conversion mechanism which includes a cam drive shaft and moves the wedge plate to slide in the rotating direction of the rotor in parallel to the braking surface. The electric motor is attached to the caliper such that the motor output shaft is positioned on the outer circumferential side with respect to the cam drive shaft.

Abstract: The instant disclosure describes various exemplary systems and methods for exonerating an untrusted software component based solely on a trusted software component's non-optional or “hard” dependency on the untrusted software component. In one example, a method for exonerating untrusted software components in this manner may include: 1) identifying a dependent software component, 2) determining that the dependent software component is a non-optional dependent component of at least one trusted software component, and then 3) classifying the dependent software component as a trusted software component. As detailed herein, such a method may enable security software to quickly and efficiently exonerate untrusted components by association without having to scan or perform other intrusive and/or resource-intensive security operations on such untrusted software components.

Abstract: A fuel cutoff valve has a housing defining therein a float chamber and a float disposed in the float chamber. The housing defines a connection passage positioned above the float chamber and fluidly connecting the float chamber with outside of the housing and a hole positioned below the fluid chamber fluidly connecting the float chamber with outside of the housing. The float has a valve part that is configured to close the connection passage and defines therein a first passage passing through the float in a vertical direction and a second passage extending from a part of the first passage to an outer surface of the float in a substantial horizontal direction.