Patents by Inventor Yoshihiro Yokoto

Yoshihiro Yokoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat spreader and semiconductor device and package using the same
    Publication number: 20040238946
    Abstract: A semiconductor device and package has a heat spreader directly disposed on the reverse surface of the semiconductor device. This heat spreader includes a diamond layer or a layer containing diamond and ceramics such as silicon carbide and aluminum nitride. The heat spreader is directly formed on a substrate for the semiconductor device. In particular, the heat spreader is composed of a diamond layer and one or two metal or ceramic members, which are bonded to the diamond layer with one or two polymer adhesive layers. This diamond layer has a fiber structure across the thickness or a microcrystalline structure. Cilia are formed on a surface of the diamond layer facing the one or two metal or ceramic members.
    Type: Application
    Filed: November 6, 2003
    Publication date: December 2, 2004
    Applicant: Kabushik Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Takeshi Tachibana, Kazushi Hayashi, Kenichi Inoue, Yoshihiro Yokoto, Koji Kobashi, Nobuyuki Kawakami, Takashi Kobori