Patents by Inventor Yoshihisa Fuse

Yoshihisa Fuse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-molding die
    Patent number: 6402495
    Abstract: A resin-molding die for embedding in a molded resin a plurality of bus bars connected with each other via a bridge portion includes a supporting member formed on a first mold, for supporting the bus bars, a pin-receiving hole formed in the supporting member at a position associated with the bridge portion, and a pin provided on a second mold at the position associated with the bridge portion and the pin-receiving hole, for cutting and raising the bridge portion substantially at an intermediate part thereof.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: June 11, 2002
    Assignee: Kabushiki Kaisha T AN T
    Inventors: Hisashi Soga, Kouichi Sinzawa, Yoshihisa Fuse
  • Resin-molding die
    Publication number: 20010006688
    Abstract: A resin-molding die for embedding in a molded resin a plurality of bus bars connected with each other via a bridge portion includes a supporting member formed on a first mold, for supporting the bus bars, a pin-receiving hole formed in the supporting member at a position associated with the bridge portion, and a pin provided on a second mold at the position associated with the bridge portion and the pin-receiving hole, for cutting and raising the bridge portion substantially at an intermediate part thereof.
    Type: Application
    Filed: December 19, 2000
    Publication date: July 5, 2001
    Inventors: Hisashi Soga, Kouichi Sinzawa, Yoshihisa Fuse