Abstract: An optical element material which is obtained by curing a resin composition for photoimprinting containing a photocurable monomer (A) of the formula (1) and a photocurable monomer (B) of the formula (2) in a weight ratio of from 30/70 to 87/13, and containing a photopolymerization initiator (C) in a content of from 0.01 to 30 parts by weight per 100 parts by weight of the total weight of the monomer (A) and the monomer (B), and which has a shrinkage on curing of at most 4.5%, and a method for producing it: wherein R1 is —CH?CH2, —CH2CH2—O—CH?CH2, —CH2—C(CH3) ?CH2 or a glycidyl group; R2 and R3 are each independently hydrogen or a C1-4 alkyl group; R4 and R5 are each independently —O—CH?CH2, —O—CH2CH2—O—CH?CH2, —O—CO—CH?CH2, —O—CO—C(CH3)?CH2, —O—CH2CH2—O—CO—CH?CH2, —O—CH2CH2—O—CO—C(CH3)?CH2 or a glycidyl ether group; and R6 and R7 are each independently hydrogen or a C1-4 alkyl group.

Abstract: A resin composition for photoimprinting, a cured product of the resin composition which is excellent in etching and heat resistance, and a pattern forming process using the resin composition are provided. The resin composition contains photocurable monomer (A) containing at least one carbazole compound of formula (I): a photocurable monomer (B) containing at least one compound of the following formulae (II), (III), and (IV): and a photopolymerization initiator (C). The weight ratio of the photocurable monomer (A) to the photocurable monomer (B) is from 30/70 to 87/13.

Abstract: An optical element material which is obtained by curing a resin composition for photoimprinting containing a photocurable monomer (A) of the formula (1) and a photocurable monomer (B) of the formula (2) in a weight ratio of from 30/70 to 87/13, and containing a photopolymerization initiator (C) in a content of from 0.01 to 30 parts by weight per 100 parts by weight of the total weight of the monomer (A) and the monomer (B), and which has a shrinkage on curing of at most 4.5%, and a method for producing it: wherein R1 is —CH?CH2, —CH2CH2—O—CH?CH2, —CH2—C(CH3)?CH2 or a glycidyl group; R2 and R3 are each independently hydrogen or a C1-4 alkyl group; R4 and R5 are each independently —O—CH?CH2, —O—CH2CH2—O—CH?CH2, —O—CO—CH?CH2, —O—CO—C(CH3)?CH2, —O—CH2CH2—O—CO—CH?CH2, —O—CH2CH2—O—CO—C(CH3)?CH2 or a glycidyl ether group; and R6 and R7 are each independently hydrogen or a C1-4 alkyl group.

Abstract: There are provided an etching mask which has a superior thermal imprinting characteristic and also a good anti-etching characteristic, a base material with the etching mask, a microfabricated product to which those etching mask and base material are applied, and a production method of the microfabricated product. The etching mask formed of a thermoplastic resin containing at least one kind of skeleton expressed by a chemical formula (1) or a chemical formula (2) in a main chain wherein R1, R2, R3, R4, R5, R6, R7, R8 in the formulae (1), (2) can be different or same one another, each of which is a hydrogen atom, a deuterium atom, a hydrocarbon group having a carbon number of 1 to 15, a halogen atom, or a substituent group containing a hetero atom like oxygen or sulfur, and may form a ring structure one another and wherein m and n are integers equal to or greater than 0.

Abstract: A resin composition for photoimprinting, a cured product of the resin composition which is excellent in etching and heat resistance, and a pattern forming process using the resin composition are provided. The resin composition contains photocurable monomer (A) containing at least one carbazole compound of formula (I): a photocurable monomer (B) containing at least one compound of the following formulae (II), (III), and (IV): and a photopolymerization initiator (C). The weight ratio of the photocurable monomer (A) to the photocurable monomer (B) is from 30/70 to 87/13.

Abstract: The present invention provides an imprinting device and an imprinting method which can uniformly apply pressure between a mold and a molding object and which can increase and decrease a temperature at a fast speed. An imprinting device is for transferring a pattern on a mold to a film molding object, and comprises a stage for holding the mold, a pressurizing-chamber casing which configures a pressurizing-chamber together with the molding object, sealing means which airtightly seals a space between the pressurizing-chamber casing and the molding object, opening and closing means which opens and closes the space between the pressurizing-chamber casing and the molding object, pressurizing means which adjusts atmospheric pressure in the pressurizing-chamber, heating means which heats either one of or both of the mold and the molding object, and degassing means which eliminates any gas present between the mold and the molding object.

Abstract: The present invention provides an imprinting device and an imprinting method which can uniformly apply pressure between a mold and a molding object and which can increase and decrease a temperature at a fast speed. An imprinting device is for transferring a pattern on a mold to a film molding object and comprises a stage for holding the mold, a pressurizing-chamber casing which configures a pressurizing-chamber together with the molding object, sealing means which airtightly seals a space between the pressurizing-chamber casing and the molding object, opening and closing means which opens and closes the space between the pressurizing-chamber casing and the molding object, pressurizing means which adjusts atmospheric pressure in the pressurizing-chamber, heating means which heats either one of or both of the mold and the molding object, and degassing means which eliminates any gas present between the mold and the molding object.

Abstract: The present invention provides an imprinting device and an imprinting method which can uniformly apply pressure between a mold and a molding object and which can increase and decrease a temperature at a fast speed. An imprinting device is for transferring a pattern on a mold to a film molding object, and comprises a stage for holding the mold, a pressurizing-chamber casing which configures a pressurizing-chamber together with the molding object, sealing means which airtightly seals a space between the pressurizing-chamber casing and the molding object, opening and closing means which opens and closes the space between the pressurizing-chamber casing and the molding object, pressurizing means which adjusts atmospheric pressure in the pressurizing-chamber, heating means which heats either one of or both of the mold and the molding object, and degassing means which eliminates any gas present between the mold and the molding object.

Abstract: There are provided an etching mask which has a superior thermal imprinting characteristic and also a good anti-etching characteristic, a base material with the etching mask, a microfabricated product to which those etching mask and base material are applied, and a production method of the microfabricated product. The etching mask formed of a thermoplastic resin containing at least one kind of skeleton expressed by a chemical formula (1) or a chemical formula (2) in a main chain wherein R1, R2, R3, R4, R5, R6, R7, R8 in the formulae (1), (2) can be different or same one another, each of which is a hydrogen atom, a deuterium atom, a hydrocarbon group having a carbon number of 1 to 15, a halogen atom, or a substituent group containing a hetero atom like oxygen or sulfur, and may form a ring structure one another and wherein m and n are integers equal to or greater than 0.

Abstract: There are provided a resin solution substantially applicable to thermal imprinting, a thin film thereof, and manufacturing methods of those. A thermal imprinting resin solution for forming a thin film used for thermal imprinting applications comprises a thermoplastic resin and greater than or equal to at least one kind of solvent which can dissolve the resin, and an containing amount of foreign particles having a grain diameter larger than or equal to 0.2 ?m is controlled to be less than 3000 particles/cm3. Moreover, remaining volatile compositions in a thin film are set to be less than or equal to 0.25% when the thin film is formed from the thermal imprinting resin solution.

Abstract: An olefin polymerization solid catalyst including a reaction product of a transition metal compound and an organoaluminum compound carried on a support having silica treated with an organoaluminum-oxy compound.

Abstract: An olefin polymerization solid catalyst which comprises having a reaction product of (C) a transition metal compound of the following formula (1) or (2) and (D) an organoaluminum compound carried on a support having (A) silica treated with (B) an organoaluminum-oxy compound; (R1aCp)m(R2bCp)nM-(-X-Ar-Yc)4-(m+n)??(1) wherein M is titanium, zirconium or hafnium, Cp is a group having a cyclopentadienyl structure, R1 and R2 are a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an alkylaryl group, an arylalkyl group or an alkylsilyl group, X is an oxygen atom or a sulfur atom, Ar is an aromatic ring, Y may be the same or different and is a hydrogen atom or a substituent selected from the group consisting of a hydrocarbon group, an alkylsilyl group, a halogen atom, a halogenated hydrocarbon group, a nitrogen-containing organic group, an oxygen-containing organic group or a sulfur-containing organic group, a and b are an integer of from 0 to 5, m and n are an integer of from 0 to 3, m+n is an integ

Abstract: A solid catalyst for olefin polymerization, which comprises a silica carrier (A) having a specific surface area of from 600 to 850 m2/g, a pore volume of from 0.1 to 0.8 ml/g and an average particle size of from 2 to 12 &mgr;m, and an organoaluminum-oxy compound (B) and a Group IVB transition metal compound (C) containing a ligand having a cyclopentadienyl skeleton, supported on the carrier (A).

Abstract: A solid catalyst for olefin polymerization, which comprises a silica carrier (A) having a specific surface area of from 600 to 850 m2/g, a pore volume of from 0.1 to 0.8 ml/g and an average particle size of from 2 to 12 &mgr;m, and an organoaluminum-oxy compound (B) and a Group IVB transition metal compound (C) containing a ligand having a cyclopentadienyl skeleton, supported on the carrier (A).