Abstract: A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein the first ground terminal GND1, the second ground terminal GND2, and the third ground terminal GND3 are arranged along the second side B2 to be separated from one another and electrically isolated from one another.

Abstract: A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein a first gap M1 between side surfaces of the first and the second central wiring lines, which side surfaces are close to each other and face each other, and a second gap M2 between side surfaces of the second and the third central wiring lines, which side surfaces are close to each other and face each other, are bent on the top surface of the substrate.

Abstract: A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein the first to the third control signal terminals Q1, Q2, and Q3 are arranged in a direction along which the first side B1 extends in a manner that one ends of the first to the third control signal terminals are in the vicinity of the first side B1 of the substrate B, and wherein the fourth to the sixth control signal terminals Q4, Q5, and Q6 are arranged in a direction along which the second side B2 extends in a manner that one ends of the fourth to the sixth control signal terminals are in the vicinity of the second side B2 of the substrate B.

Abstract: A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein a first gap M1 between side surfaces of the first and the second central wiring lines, which side surfaces are close to each other and face each other, and a second gap M2 between side surfaces of the second and the third central wiring lines, which side surfaces are close to each other and face each other, are bent on the top surface of the substrate.

Abstract: A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein the first to the third control signal terminals Q1, Q2, and Q3 are arranged in a direction along which the first side B1 extends in a manner that one ends of the first to the third control signal terminals are in the vicinity of the first side B1 of the substrate B, and wherein the fourth to the sixth control signal terminals Q4, Q5, and Q6 are arranged in a direction along which the second side B2 extends in a manner that one ends of the fourth to the sixth control signal terminals are in the vicinity of the second side B2 of the substrate B.

Abstract: A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein the first to the third control signal terminals Q1, Q2, and Q3 are arranged in a direction along which the first side B1 extends in a manner that one ends of the first to the third control signal terminals are in the vicinity of the first side B1 of the substrate B, and wherein the fourth to the sixth control signal terminals Q4, Q5, and Q6 are arranged in a direction along which the second side B2 extends in a manner that one ends of the fourth to the sixth control signal terminals are in the vicinity of the second side B2 of the substrate B.