Abstract: A cooling plate that includes: a plate that is attached to a heat generating element; feed flow paths and return flow paths for coolant that are alternatingly arranged along a plate face of the plate; and a plurality of coolant flow paths that are formed in a plurality of levels within the plate closer to the heat generating element than the feed flow paths and the return flow paths, the plurality of coolant flow paths placing adjacent paths of the feed flow paths and the return flow paths in parallel communication through each of the levels.

Abstract: A cooling plate that includes: a plate that is attached to a heat generating element; feed flow paths and return flow paths for coolant that are alternatingly arranged along a plate face of the plate; and a plurality of coolant flow paths that are formed in a plurality of levels within the plate closer to the heat generating element than the feed flow paths and the return flow paths, the plurality of coolant flow paths placing adjacent paths of the feed flow paths and the return flow paths in parallel communication through each of the levels.

Abstract: A channel distribution type cooling plate where a space between a first coolant storage part for inflow of coolant and a second cooling storage part for outflow of coolant formed at the two ends of an upper space of a main body provided with a lower space for removing heat of a heat generating member is partitioned by a meandering type partition wall to form coolant distribution paths connected to the first coolant storage part and coolant collection paths connected to the second coolant storage part, the bottom of the coolant distribution paths and the coolant collection paths are communicated by a plurality of through holes with the lower space, and side surfaces of the partition wall at the coolant distribution path sides are formed with subchannels for running coolant from the first coolant storage part, in order to improve the cooling efficiency at the coolant outlet side.

Abstract: A laminated chip includes: semiconductor chips that are laminated; and multiple types of adhesive insulating resin films that include mutually different characteristics and that are filled between the semiconductor chips, wherein the multiple types of the adhesive insulating resin films are arranged in a chip plane direction, depending on a demand characteristic for each region in a chip plane.

Abstract: A channel distribution type cooling plate where a space between a first coolant storage part for inflow of coolant and a second cooling storage part for outflow of coolant formed at the two ends of an upper space of a main body provided with a lower space for removing heat of a heat generating member is partitioned by a meandering type partition wall to form coolant distribution paths connected to the first coolant storage part and coolant collection paths connected to the second coolant storage part, the bottom of the coolant distribution paths and the coolant collection paths are communicated by a plurality of through holes with the lower space, and side surfaces of the partition wall at the coolant distribution path sides are formed with subchannels for running coolant from the first coolant storage part, in order to improve the cooling efficiency at the coolant outlet side.

Abstract: A substrate unit includes: a substrate arranged with a first heat generating element on one surface and a second heat generating element on the other surface; a first cooler that is arranged on one surface side of the substrate and that is in contact with the first heat generating element; a second cooler that is arranged on the other surface side of the substrate and that is in contact with the second heat generating element; a supply port provided in the first cooler, the supply port supplying the coolant to the first cooler; a discharge port provided in the first cooler, the discharge port discharging the coolant in the first cooler; and transport tubes that are connected to the first cooler and the second cooler, the transport tubes allowing the coolant to be transported between the first cooler the second cooler.

Abstract: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

Abstract: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers earch composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air curents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are dispossed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

Abstract: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

Abstract: A cooling device includes a chassis that partitions a first space, a second space, and a third space sandwiched between the first space and the second space, a printed circuit board accommodated in the chassis that extends from the first space to the second space while traversing the third space, a fan occupying the third space outside a predetermined space that produces an air flow from the first space toward the second space by rotation of a rotor blade, wherein the predetermined space is ensured between the printed circuit board and the fan in the third space and an air duct member that occupies the predetermined space to form a flow passage of the air flow from an intake port to an exhaust port on the printed circuit board, wherein the intake port is opened to the second space and the exhaust port is opened to the first space.

Abstract: This invention relates to a package unit including a semiconductor package that houses a semiconductor chip, and a heat sink attached thereto. A peripheral wall section that surrounds a thermal junction member is provided on a stiffener. More preferably, a tip end section of the peripheral wall section is allowed to fit into a slit provided on the heat sink. The peripheral wall section may be provided on a heat spreader instead. It is possible to prevent the thermal junction member from falling outside without incurring addition of new components or new occupancy of the area on a system substrate.

Abstract: A cooling device includes a chassis that partitions a first space, a second space, and a third space sandwiched between the first space and the second space, a printed circuit board accommodated in the chassis that extends from the first space to the second space while traversing the third space, a fan occupying the third space outside a predetermined space that produces an air flow from the first space toward the second space by rotation of a rotor blade, wherein the predetermined space is ensured between the printed circuit board and the fan in the third space and an air duct member that occupies the predetermined space to form a flow passage of the air flow from an intake port to an exhaust port on the printed circuit board, wherein the intake port is opened to the second space and the exhaust port is opened to the first space.

Abstract: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

Abstract: This invention relates to a package unit including a semiconductor package that houses a semiconductor chip, and a heat sink attached thereto. A peripheral wall section that surrounds a thermal junction member is provided on a stiffener. More preferably, a tip end section of the peripheral wall section is allowed to fit into a slit provided on the heat sink. The peripheral wall section may be provided on a heat spreader instead. It is possible to prevent the thermal junction member from falling outside without incurring addition of new components or new occupancy of the area on a system substrate.