Abstract: The present invention is to improve the quality and appearance of a second molded product such as a secondary molded product obtained by further resin-molding a first molded product such as a primary molded product, for example. The present invention is a method for manufacturing a resin molded product in which a second molded product is obtained by further performing resin molding on a resin-molded first molded product using a first mold with a cavity formed and a second mold facing the first mold, the method including a disposing step of disposing the first molded product in the cavity and disposing a resin material on the first molded product, and a mold clamping step of clamping the first mold and the second mold after the disposing step.

Abstract: The present invention is intended to prevent resin from sticking to a molding surface of a first molding die that holds an object to be molded, without using a release film, and is a resin molding apparatus that performs resin molding on the object to be molded, the resin molding apparatus including: a first molding die that holds the object to be molded; a second molding die that is provided in a manner facing the first molding die and that has a cavity for holding resin material; and a cover plate that is provided between the object to be molded and the first molding die, that covers a molding surface of the first molding die, and that has rigidity for maintaining its own shape.

Abstract: A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a resin-molded body and the like superior to hard-chromium plating to allow an ejector pin to efficiently eject and release the resin-molded body from the die.

Abstract: In an apparatus for molding resin to seal electronic parts, an internal die space defined at least by pots, cull portions, resin passages and cavities when an upper mold section and a lower mold section are closed, is cut off or sealed from the exterior atmosphere. Thereupon the die space is evacuated using a first evacuation by a vacuum source and a second or instantaneous evacuation by an instantaneous evacuation mechanism. The vacuum source for the first evacuation may be an active vacuum pump, while the instantaneous evacuation mechanism may be a vacuum tank that has been previously pumped down, for example. Using this apparatus, it is possible to quickly improve the degree of vacuum in the internal die space by efficiently and reliably discharging air, moisture and gas from the internal die space to the exterior due to a synergistic action of the evacuation and the instantaneous evacuation. Consequently, the formation of voids in resin molded members is prevented.

Abstract: In a method of sealing electronic parts with molded resin, a hollow sealing member is arranged on a mold surface of an upper mold section of a mold comprising the upper mold section and a lower mold section, so that the hollow sealing member is pressurized and expanded to convexly project from the mold surface of the upper mold section. In this state, the lower mold section is upwardly moved to be brought into contact with the expanded hollow sealing member. Further, an internal space portion, including pots, cull portions, resin passages and cavities, which is enclosed with the expanded hollow sealing member is set in a state isolated from the exterior when the upper mold section and the lower mold section are closed, so that the internal space portion is forcibly evacuated in this state. Thus, air, moisture and gases are efficiently and reliably suction-discharged from the internal space portion, whereby the internal space portion is set at a prescribed degree of vacuum.

Abstract: A fixture for fixing an annular upper air isolation member which is provided around an outer side of an upper mold section to an upper mounting plate is released, thereby rotating the air isolation member by a rotational member and fixing the same by a rotational position regulating member. An upper chase unit is exchanged through an upper opening which is defined by the upper mounting plate and the rotated air isolation member. A lower chase unit is also exchanged in a similar manner. Due to this structure, a sealing mechanism for a resin sealing/molding apparatus for electronic parts which can readily and quickly exchange a mold in response to small lot production of various types of products is provided.

Abstract: In a method of molding resin to seal electronic parts, an internal die space defined at least by pots, cull portions, resin passages and cavities when an upper mold section and a lower mold section are closed, is cut off or sealed from the exterior atmosphere. Thereupon the die space is evacuated using a first evacuation by a vacuum source and a second or instantaneous evacuation by an instantaneous evacuation mechanism. The vacuum source for the first evacuation may be an active vacuum pump, while the instantaneous evacuation mechanism may be a vacuum tank that has been previously pumped down, for example. According to this method, it is possible to quickly improve the degree of vacuum in the internal die space by efficiently and reliably discharging air, moisture and gas from the internal die space to the exterior due to a synergistic action of the evacuation and the instantaneous evacuation. Consequently, the formation of voids in resin molded members is prevented.

Abstract: In an apparatus for molding resin to seal an electronic part, a sealed space portion is formed between molding surfaces of an upper mold section and a lower mold section by covering an outer side periphery of a pot, a resin path and a cavity. A resin tablet is heated at its bottom portion and peripheral portion in the pot of the lower mold section to expand upwardly from its top portion. Air and moisture included inside the resin tablet is expelled into the sealed space portion which is evacuated including any air and moisture inside the sealed space portion, whereby the formation of voids in the molded resin body is avoided.

Abstract: In a method for molding resin to seal an electronic part, a sealed space portion is formed between molding surfaces of an upper mold section and a lower mold section by covering an outer side periphery of a pot, a resin path and a cavity. A resin tablet is heated at its bottom portion and peripheral portion in the pot of the lower mold section to expand upwardly from its top portion. Air and moisture included inside the resin tablet is expelled into the sealed space portion which is evacuated including any air and moisture inside the sealed space portion, whereby the formation of voids in the molded resin body is avoided.