Abstract: A mining riser pipe is extended from above water toward a water bottom containing water bottom resources, and a lower portion of an insertion pipe connected to a lower portion of the mining riser pipe is inserted into the water bottom. A liquid is supplied into the insertion pipe and a rotation shaft extends axially inside both of pipes is rotated to rotate stirring blades attached to a lower portion of the rotation shaft inside the insertion pipe, thereby drilling and dissolving mud S inside the insertion pipe into a slurry form by is raised to an upper portion of the insertion pipe by a stirring flow generated by the rotation of the stirring blades, and the raised mud is lifted above the water through the mining riser pipe by a lifting force.

Abstract: A semiconductor device that comprises, on a substrate, a pixel region where a plurality of pixels are arranged, and a monitor region is provided. In the pixel region, a plurality of lenses are arranged on an underlayer such that the underlayer is not exposed, and in the monitor region, a plurality of monitor lenses are arranged on the underlayer. The plurality of monitor lenses include a pair of monitor lenses arranged such that the underlayer is not exposed between two monitor lenses adjacent to each other, and a pair of monitor lenses arranged with an exposed portion where the underlayer is exposed between two monitor lenses adjacent to each other.

Abstract: A mining riser pipe is extended from above water toward a water bottom containing water bottom resources, and a lower portion of an insertion pipe connected to a lower portion of the mining riser pipe is inserted into the water bottom. A liquid is supplied into the insertion pipe and a rotation shaft extends axially inside both of pipes is rotated to rotate stirring blades attached to a lower portion of the rotation shaft inside the insertion pipe, thereby drilling and dissolving mud S inside the insertion pipe into a slurry form is raised to an upper portion of the insertion pipe by a stirring flow generated by the rotation of the stirring blades, and the raised mud is lifted above the water through the mining riser pipe by lifting force.

Abstract: A mining riser pipe is extended toward a water bottom, and a lower portion of an insertion pipe connected to a lower portion of the mining riser pipe is inserted into the water bottom. A liquid is supplied into the insertion pipe, and a rotation shaft extends inside both pipes and stirring blades attached to a lower portion of the rotation shaft are rotated inside the insertion pipe, thereby drilling and dissolving mud inside the insertion pipe into a slurry. Then, the mud S is raised to an upper portion of the insertion pipe by a stirring flow generated by the stirring blades, and the raised mud slurry is lifted above the water through the mining riser pipe 2, and a rotation speed of the stirring blades is lower in an initial process at an early stage of the drilling than in a subsequent process.

Abstract: A light-emitting element includes a first electrode, a second electrode, and a light-emitting layer between the first electrode and the second electrode. The light-emitting element includes a transmittance-increasing layer with increasing transmittance in an optical path of light emitted from the light-emitting layer.

Abstract: A method for recovering rare-earth mud including steps of: (A) penetrating a mud gathering pipe into a layer containing rare-earth mud under the seafloor, (B) preparing a slurry containing a rare earth by loosening rare-earth mud in the mud gathering pipe, and (C) transferring the slurry through a mud raising pipe. A rare-earth mud recovery system including: a mud gathering pipe configured to penetrate into a layer containing rare-earth mud under a seafloor; a stirring device configured to loosen rare-earth mud in the mud gathering pipe; and a mud raising pipe connected to the mud gathering pipe.

Abstract: The present disclosure relates to an organic light-emitting device including an insulating layer, an organic light-emitting element disposed on the main surface of the insulating layer, and a color filter layer covering the organic light-emitting element and including a first color filter that passes light with a first wavelength and a second color filter that passes light with a second wavelength different from the first wavelength, wherein the concentration of an organic alkali having a nitrogen atom and a hydroxy group contained in the color filter layer is less than 108.2 ng/cm2.

Abstract: A curved surface constituting a convex surface or a concave surface of each of a plurality of lenses includes at least a silicon nitride layer and another silicon nitride layer. An interlayer having a composition different from a composition of the silicon nitride layer and a composition of the other silicon nitride layer is arranged between the silicon nitride layer and the other silicon nitride layer, and a thickness of the interlayer is less than a thickness of the silicon nitride layer and a thickness of the other silicon nitride layer.

Abstract: A color filter array is provided. The array comprises a first color filter, a second color filter, and a third color filter that are arranged on a base member and respectively have different colors. The first color filter and the third color filter are arranged adjacent to each other, the second color filter includes a portion placed between an end portion of the third color filter and the base member, and the end portion of the third color filter and the portion of the second color filter are in contact with the first color filter.

Abstract: An imprinting system according to an embodiment includes a first measuring device measuring an intensity of light reflected from an end of a shot area of a monitor substrate being an area on which imprinting has been performed, a dripping condition generating device generating a dripping condition of a resin-based mask material on the basis of the measured intensity of light, and an imprinting apparatus performing imprinting using the dripping condition. The imprinting apparatus includes a second measuring device measuring an intensity of light reflected from an end of a first shot area of a production substrate being an area on which imprinting has been performed, and a control unit adjusting arrangement of droplets of a resin-based mask material ejected on a second shot area of the production substrate being an area on which imprinting is to be performed on the basis of an intensity of light reflected from an end of the first shot area.

Abstract: A curved surface constituting a convex surface or a concave surface of each of a plurality of lenses includes at least a silicon nitride layer and another silicon nitride layer. An interlayer having a composition different from a composition of the silicon nitride layer and a composition of the other silicon nitride layer is arranged between the silicon nitride layer and the other silicon nitride layer, and a thickness of the interlayer is less than a thickness of the silicon nitride layer and a thickness of the other silicon nitride layer.

Abstract: An imprinting system according to an embodiment includes a first measuring device measuring an intensity of light reflected from an end of a shot area of a monitor substrate being an area on which imprinting has been performed, a dripping condition generating device generating a dripping condition of a resin-based mask material on the basis of the measured intensity of light, and an imprinting apparatus performing imprinting using the dripping condition. The imprinting apparatus includes a second measuring device measuring an intensity of light reflected from an end of a first shot area of a production substrate being an area on which imprinting has been performed, and a control unit adjusting arrangement of droplets of a resin-based mask material ejected on a second shot area of the production substrate being an area on which imprinting is to be performed on the basis of an intensity of light reflected from an end of the first shot area.

Abstract: According to one embodiment, an imprint apparatus including multiple types of imprint units and a conveyor to convey a substrate is provided. Each of the imprint units includes a suction mechanism configured to hold the substrate with multiple suction portions on a substrate holder, and a template having an imprint surface on which a concavo-convex pattern is formed on one face of a template substrate and having a recessed region in the other face, the recessed region corresponding to the imprint surface. The imprint units have different depths of the recessed regions in the templates and different arrangements of the suction portions in the suction mechanisms depending on the types.

Abstract: According to one embodiment, a device substrate includes a multilayer film that includes a film constituting a device element and is disposed on a substrate. A main face on which the device element is disposed includes a patterning region on which a resist is to be applied during an imprint process, and a bevel region provided as a region from a peripheral edge portion of the patterning region to an end portion of the device substrate. The bevel region includes a region where an upper surface of the bevel region becomes lower toward the end portion of the device substrate relative to an upper surface of the patterning region. The upper surface of the bevel region has an inclination angle of 10° or more and 90° or less with respect to the upper surface of the patterning region, at a boundary between the patterning region and the bevel region.

Abstract: According to one embodiment, a template includes a template pattern and a liquid repellent pattern. The template pattern is formed on a substrate. The liquid repellent pattern has liquid repellency to a resist and are disposed on a periphery of a region for arrangement of the template pattern.

Abstract: An imprinting apparatus includes a substrate holding unit having a first region configured to receive a substrate, and a second region positioned outside a periphery of a first region, the substrate holding unit including a resist removing mechanism including at least one of an exhaust mechanism and an air supply mechanism disposed in the second region. The apparatus further includes a template holding unit configured to hold a template defining recess patterns such that the recess patterns face the substrate holding unit, and such that the template can come into contact with a resist deposited onto the substrate, and one or more nozzles configured to discharge the resist onto the substrate.

Abstract: According to one embodiment, a device substrate includes a multilayer film that includes a film constituting a device element and is disposed on a substrate. A main face on which the device element is disposed includes a patterning region on which a resist is to be applied during an imprint process, and a bevel region provided as a region from a peripheral edge portion of the patterning region to an end portion of the device substrate. The bevel region includes a region where an upper surface of the bevel region becomes lower toward the end portion of the device substrate relative to an upper surface of the patterning region. The upper surface of the bevel region has an inclination angle of 10° or more and 90° or less with respect to the upper surface of the patterning region, at a boundary between the patterning region and the bevel region.

Abstract: According to one embodiment, a device substrate includes a multilayer film that includes a film constituting a device element and is disposed on a substrate. A main face on which the device element is disposed includes a patterning region on which a resist is to be applied during an imprint process, and a bevel region provided as a region from a peripheral edge portion of the patterning region to an end portion of the device substrate. The bevel region includes a region where an upper surface of the bevel region becomes lower toward the end portion of the device substrate relative to an upper surface of the patterning region. The upper surface of the bevel region has an inclination angle of 10° or more and 90° or less with respect to the upper surface of the patterning region, at a boundary between the patterning region and the bevel region.

Abstract: According to one embodiment, a device substrate includes a multilayer film that includes a film constituting a device element and is disposed on a substrate. A main face on which the device element is disposed includes a patterning region on which a resist is to be applied during an imprint process, and a bevel region provided as a region from a peripheral edge portion of the patterning region to an end portion of the device substrate. The bevel region includes a region where an upper surface of the bevel region becomes lower toward the end portion of the device substrate relative to an upper surface of the patterning region. The upper surface of the bevel region has an inclination angle of 10° or more and 90° or less with respect to the upper surface of the patterning region, at a boundary between the patterning region and the bevel region.

Abstract: According to one embodiment, a template includes a template pattern and a liquid repellent pattern. The template pattern is formed on a substrate. The liquid repellent pattern has liquid repellency to a resist and are disposed on a periphery of a region for arrangement of the template pattern.