Patents by Inventor Yoshihisa Minerua

Yoshihisa Minerua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Energy beam curable hydrophilic pressure sensitive adhesive composition and use thereof
    Patent number: 6403215
    Abstract: An energy beam curable hydrophilic pressure sensitive adhesive composition includes a polymer (A) having an energy beam polymerizable group and an acid group and a neutralizer (B). Thus, a pressure sensitive adhesive composition suitable for use in a wafer surface protective sheet is provided. The wafer surface protective sheet protects a circuit pattern formed on a wafer surface from grinding dust, etc. at the time of grinding the back of the wafer. The pressure sensitive adhesive composition can easily be removed by washing with water, even if the pressure sensitive adhesive remains on the wafer surface after peeling of the pressure sensitive adhesive sheet.
    Type: Grant
    Filed: May 21, 1999
    Date of Patent: June 11, 2002
    Assignee: Lintec Corporation
    Inventors: Takeshi Kondo, Kiichiro Kato, Kazuhiro Takahashi, Yoshihisa Minerua