Patents by Inventor Yoshihisa Mineura
Yoshihisa Mineura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7105226Abstract: Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on one side thereof, an energy radiation curable pressure sensitive adhesive layer and, superimposed on the other side thereof, a removable pressure sensitive adhesive layer composed of an adhesive having a modulus of elasticity at 120° C. of 5×105 Pa or less. The pressure sensitive adhesive double coated sheet according to the invention enables efficiently processing a work piece with high precision. In particular the pressure sensitive adhesive double coated sheet is suitable to a process capable of producing IC chips of high thickness precision with high yield by reducing warp and minimizing carrying breakage in the grinding of extremely thin or large diameter silicon wafers and capable of performing back grinding and dicing in the same configuration.Type: GrantFiled: May 6, 2002Date of Patent: September 12, 2006Assignee: Lintec CorporationInventors: Hayato Noguchi, Yoshihisa Mineura, Kazuyosi Ebe, Katsuhiko Horigome
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Patent number: 6878441Abstract: A pressure sensitive adhesive sheet comprising a substrate, an intermediate layer superimposed thereon and a pressure sensitive adhesive layer superimposed on the intermediate layer, characterized in that the pressure sensitive adhesive layer exhibiting an elastic modulus at 23° C. ranging from 5.0×104 to 1.0×107 Pa, the intermediate layer exhibiting an elastic modulus at 23° C. which is not greater than the elastic modulus at 23° C. of the pressure sensitive adhesive layer, or the intermediate layer exhibiting an elastic modulus at 40° C. of less than 1.0×106 Pa. At the time of working of the back of an adherend having a surface whose unevenness height differences are large, this pressure sensitive adhesive sheet is preferably stuck to the adherend surface to thereby protect it during the working and to enable performing the grinding at a uniform thickness without the occurrence of dimples.Type: GrantFiled: January 15, 2003Date of Patent: April 12, 2005Assignee: Lintec CorporationInventors: Takeshi Kondo, Kazuhiro Takahashi, Yoshihisa Mineura
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Patent number: 6793762Abstract: The invention is concerned with a pressure sensitive adhesive sheet comprising a substrate and, superimposed thereon, a pressure sensitive adhesive layer, said substrate exhibiting a maximum value of dynamic viscoelasticity tan &dgr; of at least 0.5 at a temperature ranging from −5 to 80° C. At the time of working of the back of an adherend having a surface whose irregular height differences are large, this pressure sensitive adhesive sheet is preferably stuck to the adherend surface to thereby protect it during the working.Type: GrantFiled: May 28, 1999Date of Patent: September 21, 2004Assignee: Lintec CorporationInventors: Takeshi Kondo, Kazuhiro Takahashi, Yoshihisa Mineura
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Publication number: 20030104199Abstract: A pressure sensitive adhesive sheet comprising a substrate, an intermediate layer superimposed thereon and a pressure sensitive adhesive layer superimposed on the intermediate layer, characterized in that the pressure sensitive adhesive layer exhibiting an elastic modulus at 23° C. ranging from 5.0×104 to 1.0×107 Pa, the intermediate layer exhibiting an elastic modulus at 23° C. which is not greater than the elastic modulus at 23° C. of the pressure sensitive adhesive layer, or the intermediate layer exhibiting an elastic modulus at 40° C. of less than 1.0×106 Pa. At the time of working of the back of an adherend having a surface whose unevenness height differences are large, this pressure sensitive adhesive sheet is preferably stuck to the adherend surface to thereby protect it during the working and to enable performing the grinding at a uniform thickness without the occurrence of dimples.Type: ApplicationFiled: January 15, 2003Publication date: June 5, 2003Applicant: Lintec CorporationInventors: Takeshi Kondo, Kazuhiro Takahashi, Yoshihisa Mineura
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Patent number: 6544371Abstract: A method of securing semiconductor chips comprises the steps of: sticking semiconductor chips at their backs to a transfer tape having an adhesive superimposed thereon at spaced intervals; peeling the semiconductor chips from the transfer tape such that the adhesive is transferred onto the backs of the semiconductor chips; and securing the semiconductor chips by way of the adhesive onto a substrate. The method also includes variations such as sticking the transfer tape to a substrate at predetermined sites for securing semiconductor chips and then peeling the base material of the transfer tape to transfer the adhesive to the predetermined sites on the substrate, followed by securing the semiconductor chips thereto.Type: GrantFiled: June 14, 2001Date of Patent: April 8, 2003Assignee: Lintec CorporationInventors: Hideo Senoo, Yoshihisa Mineura
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Patent number: 6524701Abstract: A pressure sensitive adhesive sheet comprising a substrate, an intermediate layer superimposed thereon and a pressure sensitive adhesive layer superimposed on the intermediate layer, characterized in that the pressure sensitive adhesive layer exhibiting an elastic modulus at 23° C. ranging from 5.0×104 to 1.0×107 Pa, the intermediate layer exhibiting an elastic modulus at 23° C. which is not greater than the elastic modulus at 23° C. of the pressure sensitive adhesive layer, or the intermediate layer exhibiting an elastic modulus at 40° C. of less than 1.0×106 Pa. At the time of working of the back of an adherend having a surface whose unevenness height differences are large, this pressure sensitive adhesive sheet is preferably stuck to the adherend surface to thereby protect it during the working.Type: GrantFiled: November 19, 1999Date of Patent: February 25, 2003Assignee: Lintec CorporationInventors: Takeshi Kondo, Kazuhiro Takahashi, Yoshihisa Mineura
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Publication number: 20030029544Abstract: Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on one side thereof, an energy radiation curable pressure sensitive adhesive layer and, superimposed on the other side thereof, a removable pressure sensitive adhesive layer composed of an adhesive having a modulus of elasticity at 120° C. of 5×105 Pa or less.Type: ApplicationFiled: May 6, 2002Publication date: February 13, 2003Applicant: LINTEC CORPORATIONInventors: Hayato Noguchi, Yoshihisa Mineura, Kazuyosi Ebe, Katsuhiko Horigome
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Publication number: 20030031866Abstract: A pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on both sides thereof, pressure sensitive adhesive layers, at least one of the pressure sensitive adhesive layers being composed of an energy radiation curable pressure sensitive adhesive. The pressure sensitive adhesive double coated sheet enables efficient processing of a work piece with high precision. In particular, the pressure sensitive adhesive double coated sheet is suitable to a process capable of producing IC chips of high thickness precision with high yield by reducing warpage and minimizing carrying breakage in the grinding of extremely thin or large diameter silicon wafers and capable of performing back grinding and dicing in the same configuration.Type: ApplicationFiled: July 16, 2002Publication date: February 13, 2003Applicant: Lintec CorporationInventors: Hayato Noguchi, Yoshihisa Mineura, Kazuyoshi Ebe
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Patent number: 6398892Abstract: Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on both sides thereof, pressure sensitive adhesive layers, at least one of the pressure sensitive adhesive layers being composed of an energy radiation curable pressure sensitive adhesive. The pressure sensitive adhesive double coated sheet according to the invention enables efficiently processing a work piece with high precision. In particular the pressure sensitive adhesive double coated sheet is suitable to a process capable of producing IC chips of high thickness precision with high yield by reducing warpage and minimizing carrying breakage in the grinding of extremely thin or large diameter silicon wafers and capable of performing back grinding and dicing in the same configuration. Further, the invention provides a process of producing semiconductors of high reliability in which the above pressure sensitive adhesive double coated sheet is used.Type: GrantFiled: August 25, 1999Date of Patent: June 4, 2002Assignee: Lintec CorporationInventors: Hayato Noguchi, Yoshihisa Mineura, Kazuyoshi Ebe
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Publication number: 20020028331Abstract: A transfer tape comprising a base material and, superimposed thereon with intervals, an adhesive. This transfer tape enables transferring a given amount of adhesive to an extremely small item such as a semiconductor chip or to portions of extremely small area such as sites of a lead frame predetermined for mounting IC chips by simple operation.Type: ApplicationFiled: June 14, 2001Publication date: March 7, 2002Applicant: LINTEC CORPORATIONInventors: Hideo Senoo, Yoshihisa Mineura
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Patent number: 6235366Abstract: An adhesive sheet used for semiconductor wafer processing; with the adhesive sheet consisting of a release liner, an adhesive layer and a base film which are laminated in order of description, having a great length and being folded zigzag into equal sections so that one section is superposed exactly upon another.Type: GrantFiled: January 21, 1999Date of Patent: May 22, 2001Assignee: Lintec CorporationInventors: Masatoshi Matsumoto, Mitsugu Koike, Hitoshi Maruhashi, Yoshihisa Mineura
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Patent number: 6225194Abstract: A process for producing a chip, comprising the steps of: attaching an object to be diced on a pressure sensitive adhesive sheet comprising at least one layer of shrinkable film and a pressure sensitive adhesive layer; dicing the object into chips, and shrinking the shrinkable film to thereby reduce an area in which the chips are in contact with the pressure sensitive adhesive. In this process, chips of small thickness and large area can easily be picked up without the need to use a thrust needle in the chip pickup step.Type: GrantFiled: July 15, 1999Date of Patent: May 1, 2001Assignee: Lintec CorporationInventors: Hayato Noguchi, Yoshihisa Mineura, Hideki Numazawa, Kazuyoshi Ebe
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Patent number: 5976691Abstract: A process for producing a chip, comprising the steps of:a attaching an object to be diced on a pressure sensitive adhesive sheet comprising at least one layer of shrinkable film and a pressure sensitive adhesive layer;dicing the object into chips, andshrinking the shrinkable film to thereby reduce an area in which the chips are in contact with the pressure sensitive adhesive. In this process, chips of small thickness and large area can easily be picked up without the need to use a thrust needle in the chip pickup step.Type: GrantFiled: December 17, 1997Date of Patent: November 2, 1999Assignee: Lintec CorporationInventors: Hayato Noguchi, Yoshihisa Mineura, Hideki Numazawa, Kazuyoshi Ebe
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Patent number: 5955512Abstract: A pressure sensitive adhesive composition is disclosed which comprises an acrylic copolymer (A), an energy beam polymerizable urethane acrylate oligomer (B) and an energy beam polymerizable compound having one acryloyl group or methacryloyl group in each molecule thereof (C). This composition is preferred to further contain a plasticizer (D), a crosslinking agent (E) and/or a photopolymerization initiator (F) according to necessity. The pressure sensitive adhesive composition has satisfactory pressure sensitive adherence and initial adhesion before the irradiation with energy beam and the adhesive strength thereof is sharply reduced with maintaining the rubber elasticity after the irradiation with energy beam. Further, the pressure sensitive adhesive composition ensures excellent chip alignability in the expanding step subsequent to dicing.Type: GrantFiled: April 24, 1997Date of Patent: September 21, 1999Assignee: Lintec CorporationInventors: Hideki Numazawa, Yoshihisa Mineura
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Patent number: 4841652Abstract: An adhesive sheet which comprises a support sheet and an adhesive layer containing a migratory substance, disposed on one side of the support sheet. This adhesive sheet may be applied to many types of articles and will leave behind a dye mark on the article indicating that it has been applied and subsequently removed.Type: GrantFiled: February 25, 1987Date of Patent: June 27, 1989Assignee: Efuesukei Kabushiki KaishaInventors: Hitoshi Sakashita, Yoshihisa Mineura, Toshihiko Sato