Patents by Inventor Yoshihisa Nagamine

Yoshihisa Nagamine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6733899
    Abstract: There are provided a step of forming a structure in which a first concave portion is formed in a predetermined portion on one surface of a metal plate and also a convex portion that protrudes from other surface of the metal plate is formed by formation of the first concave portion and a second concave portion is formed in a predetermined portion on an outside of a peripheral portion of the convex portion, by shaping the metal plate by means of stamping using a die, and a step of cutting the convex portion formed on the other surface of the metal plate.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: May 11, 2004
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Sumio Uehara, Yoshihisa Nagamine, Toshifumi Iizuka
  • Publication number: 20030157359
    Abstract: There are provided a step of forming a structure in which a first concave portion is formed in a predetermined portion on one surface of a metal plate and also a convex portion that protrudes from other surface of the metal plate is formed by formation of the first concave portion and a second concave portion is formed in a predetermined portion on an outside of a peripheral portion of the convex portion, by shaping the metal plate by means of stamping using a die, and a step of cutting the convex portion formed on the other surface of the metal plate.
    Type: Application
    Filed: February 14, 2003
    Publication date: August 21, 2003
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Sumio Uehara, Yoshihisa Nagamine, Toshifumi Iizuka
  • Patent number: 6442990
    Abstract: A plate-shaped member having a recess useful for an electronic part and particularly for a heat dissipation plate for a semiconductor element, the inside and outside of which member are flat. The plate-shaped member has a recess defined by a bottom wall portion and a side wall portion extending from a peripheral end of the bottom wall portion formed without bending a metallic plate, by press forming. The upper and lower surfaces of the side wall and the bottom wall are formed in parallel and flat, and the thickness of the bottom wall is smaller than the thickness of the metallic plate and, further, the thickness, between the upper surface and the lower surface, of the side wall is larger than the thickness of the metallic plate.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: September 3, 2002
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hiroyuki Komatsu, Yoshihisa Nagamine, Akira Takahashi