Abstract: A radiation detector includes: an elongated wavelength conversion member that emits fluorescent light according to incident radiation; a photoelectric conversion element that receives the fluorescent light emitted from the wavelength conversion member, and generates an electrical signal; and a light condenser that is disposed between the wavelength conversion member and the photoelectric conversion element, and focuses the fluorescent light emitted from the wavelength conversion member on the photoelectric conversion element. The optical axis of the radiation incident on the wavelength conversion member and the optical axis of the light condenser extend in directions different from each other in view of the longitudinal direction of the wavelength conversion member. One focal point of the light condenser is disposed at the wavelength conversion member. The other focal point is disposed at the photoelectric conversion element.

Abstract: Provided is a control unit of a conveying apparatus, the conveying apparatus including: a conveying unit that conveys recording paper along a conveyance path; an imaging unit that images the recording paper; and a light emitting unit arranged on an opposite side of the imaging unit across the conveyance path, wherein the control unit detects conveyance information of the recording paper based on image information of the recording paper imaged by the imaging unit in a state in which light from the light emitting unit is transmitted through the recording paper. The control unit detects the conveyance information of the recording paper based on a plurality of images of the recording paper imaged at different timings by the imaging unit.

Abstract: Provided is a conveying apparatus including a conveying unit that conveys a recording paper along a conveyance path, an imaging unit that images the recording paper to detect conveyance information on the recording paper, and a light source unit that emits light to the recording paper imaged by the imaging unit, wherein the light source unit has a shape of a rod elongated in a conveyance direction of the recording paper.

Abstract: Provided is a control unit of a conveying apparatus, the conveying apparatus including: a conveying unit that conveys recording paper along a conveyance path; and an imaging unit that images the recording paper, wherein the control unit detects conveyance information of the recording paper based on image information of a plurality of different regions in image information of the recording paper P imaged by the imaging unit.

Abstract: Provided is a control unit of a conveying apparatus, the conveying apparatus including: a conveying unit that conveys recording paper along a conveying path; and an imaging unit that images the recording paper and an object not conveyed by the conveying unit, wherein the control unit acquires actual conveyance information of the recording paper from image information of the recording paper imaged by the imaging unit and image information of the object imaged by the imaging unit.

Abstract: Provided is a control unit of a conveying apparatus, the conveying apparatus including: a conveying unit that conveys recording paper along a conveyance path; an imaging unit that images the recording paper; and a light emitting unit arranged on an opposite side of the imaging unit across the conveyance path, wherein the control unit detects conveyance information of the recording paper based on image information of the recording paper imaged by the imaging unit in a state in which light from the light emitting unit is transmitted through the recording paper. The control unit detects the conveyance information of the recording paper based on a plurality of images of the recording paper imaged at different timings by the imaging unit.

Abstract: There is provided with a method for manufacturing a resin product. One embodiment includes performing a modification process on a portion of a surface of the resin product not less than two times by different methods to modify the portion such that a plating metal can be deposited on the portion.

Abstract: Provided is an antenna unit performing at least one of transmission and reception of data, the antenna unit including: a resin substrate including projections and recesses formed parallel to and adjacent to each other on an upper surface; and an antenna conductor continuously formed to meander in one direction along top portions of the projections and bottom portions of the recesses.

Abstract: There is provided with a method for manufacturing a resin product. One embodiment includes performing a modification process on a portion of a surface of the resin product not less than two times by different methods to modify the portion such that a plating metal can be deposited on the portion.

Abstract: A liquid ejecting head includes an energy generating element for generating energy utilized for ejecting liquid containing a medicine, and a plurality of ejection outlets, provided for said energy generating element, for ejecting the liquid. Each of the ejection outlets has a rotationally asymmetrical cross-section in a plane parallel to the energy generating element.

Abstract: A liquid cartridge of the present invention has a liquid ejection portion 1 for ejecting liquid droplets, a reservoir E1 for storing liquid, and a communicating member 3 for providing communication between both of them. The reservoir E1 has first and second storage portions 10a, 10b isolated by films 6 to 8 arranged spaced from each other and an atmospheric release portion. When a small diameter portion 5a is inserted into an applied concave portion 4 of the liquid ejection portion 1, a tip 3a of the communicating member 3 breaks through the first to third films 6 to 8 sequentially in the period from the beginning to the end of insertion. Consequently, liquid in the first storage portion 10a is filled into the ejection head 2 and thereafter liquid stored in the second storage portion 10b is filled.

Abstract: A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of the semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein a distance between the outer surface of the light-receiving region and the third surface of the light-transmission member is 0.5 mm or more.

Abstract: A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein the light-transmission member comprises low ?-ray glass.

Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

Abstract: In a method for cutting a solid-state image pickup device of the present invention, a glass cover plate is diced with a surface thereof being protected, so that chipping of the glass cover plate can be significantly prevented. In addition, since a CCD wafer is adhered after the glass cover plate is diced, no glass fragments scattered due to chipping of the glass cover plate touch the CCD wafer, or cause damage to the CCD wafer, thereby a cutting of solid-state image pickup device can be achieved with high accuracy and high quality.

Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

Abstract: There are provided a semiconductor substrate 101 on which solid-state imaging devices are formed, and a translucent member 201 provided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrate 101 to a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate 101.

Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

Abstract: A method for cutting a solid-state image pickup device with high accuracy and high quality is provided which does not cause any chipping and prevents damages to a wafer surface. A temporary bonding agent is coated to a back surface of a glass cover plate which is opposite to the surface having a spacer, and a transparent protective wafer having a surface to which an adhesive sheet having a reducible adhesive strength is attached is adhered to the surface of the glass cover plate to which the temporary bonding agent is coated, with the adhesive sheet facing to the glass cover plate surface. The adhered glass cover plate and protective wafer are cut from the surface of the glass cover plate to the temporary bonding agent. After a CCD wafer is bonded to the cut glass cover plate, the protective wafer, the adhesive sheet, and the temporary bonding agent are peeled off, and the CCD wafer is cut to obtain individual chips.

Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.