Abstract: The semiconductor manufacturing apparatus includes a film forming part and a control part. The film forming part forms a stacked film on a semiconductor substrate. The stacked film has a lower layer and an upper layer on the lower layer. The control part controls the film forming part. The control part controls the film forming part to form the upper layer film in which an inclination of a film thickness is inverted with respect to that of the lower layer film.

Abstract: A piping component according to an embodiment includes a first joint member and a second joint member. The first joint member has a first covering portion. The first covering portion covers one of end portions of a bonding unit between the first joint member and a first piping unit, located in an insertion direction of the first piping unit, from a side of a hollow of the first joint member. The second joint member has a second covering portion. The second covering portion covers one of end portions of a bonding unit between the second joint member and a second piping unit, located in an insertion direction of the second piping unit, from a side of a hollow of the second joint member.