Patents by Inventor Yoshihisa Tamagawa
Yoshihisa Tamagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10540045Abstract: The transparent conductor involves a first laminate part including a transparent resin substrate and a transmittance-controlling layer, and a second laminate part including the transparent resin substrate, the transmittance-controlling layer, a metal layer containing silver or a silver alloy, and a metal oxide layer in the order presented. The first laminate part and the second laminate part are adjacent to each other in a direction perpendicular to the direction of lamination of the first laminate part and the second laminate part, and the difference between the transmittance of the first laminate part in the direction of lamination, T1, and the transmittance of the second laminate part in the direction of lamination, T2, (T2?T1) is 4% or more.Type: GrantFiled: April 22, 2016Date of Patent: January 21, 2020Assignee: TDK CORPORATIONInventors: Hiroshi Shingai, Yoshihisa Tamagawa, Motohiro Sakurai
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Patent number: 10527873Abstract: Provided is a transparent conductor including a transparent resin substrate, a first metal oxide layer, a metal layer containing a silver alloy, and a second metal oxide layer laminated in the order presented, wherein the second metal oxide layer contains zinc oxide, indium oxide, titanium oxide, and tin oxide.Type: GrantFiled: March 25, 2016Date of Patent: January 7, 2020Assignee: TDK CORPORATIONInventors: Hiroshi Shingai, Yoshihisa Tamagawa, Motohiro Sakurai
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Publication number: 20190393585Abstract: A transparent conductive film for antennas, includes: a transparent resin substrate; a first metal oxide layer; a metal layer containing silver or a silver alloy; and a second metal oxide layer, stacked in this order.Type: ApplicationFiled: January 22, 2018Publication date: December 26, 2019Applicant: TDK CORPORATIONInventors: Yoshihisa TAMAGAWA, Hiroshi SHINGAI, Kazuhisa INABA, Syunji MATSUBARA
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Patent number: 10510457Abstract: The transparent conductor includes a transparent resin substrate, a first metal oxide layer, a metal layer containing a silver alloy, and a second metal oxide layer in the order presented. The first metal oxide layer contains zinc oxide, indium oxide, and titanium oxide, and the content of SnO2 in the first metal oxide layer is 40 mol % or less with respect to the total of four components of zinc oxide, indium oxide, titanium oxide, and tin oxide in terms of ZnO, In2O3, TiO2, and SnO2, respectively. The second metal oxide layer contains the four components, and the content of SnO2 in the second metal oxide layer is 12 to 40 mol % with respect to the total of the four components in terms of ZnO, In2O3, TiO2, and SnO2, respectively.Type: GrantFiled: December 8, 2016Date of Patent: December 17, 2019Assignee: TDK CORPORATIONInventors: Hiroshi Shingai, Yoshihisa Tamagawa, Yoshihiko Tanabe, Motohiro Sakurai, Yoshinori Sato
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Publication number: 20190160783Abstract: A transparent conductor includes: a transparent resin base material; a first metal oxide layer; a metal layer including a silver alloy; and a second metal oxide layer, in this order. The first metal oxide layer contains at least one of tin oxide and niobium oxide. When the tin oxide and the niobium oxide are respectively set in terms of SnO2 and Nb2O5, a molar basis content of the total of SnO2 and Nb2O5 with respect to the total of metal oxides contained in the first metal oxide layer is greater than a molar basis content of the total of SnO2 and Nb2O5 with respect to the total of metal oxides contained in the second metal oxide layer, and the content in the first metal oxide layer is greater than or equal to 45 mol %.Type: ApplicationFiled: June 9, 2017Publication date: May 30, 2019Applicant: TDK CORPORATIONInventors: Hiroshi SHINGAI, Yoshihisa TAMAGAWA, Yoshihiko TANABE, Yoshinori SATO
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Publication number: 20180197649Abstract: The transparent conductor includes a transparent resin substrate, a first metal oxide layer, a metal layer containing a silver alloy, and a second metal oxide layer in the order presented. The first metal oxide layer contains zinc oxide, indium oxide, and titanium oxide, and the content of SnO2 in the first metal oxide layer is 40 mol % or less with respect to the total of four components of zinc oxide, indium oxide, titanium oxide, and tin oxide in terms of ZnO, In2O3, TiO2, and SnO2, respectively. The second metal oxide layer contains the four components, and the content of SnO2 in the second metal oxide layer is 12 to 40 mol % with respect to the total of the four components in terms of ZnO, In2O3, TiO2, and SnO2, respectively.Type: ApplicationFiled: December 8, 2016Publication date: July 12, 2018Applicant: TDK CORPORATIONInventors: Hiroshi SHINGAI, Yoshihisa TAMAGAWA, Yoshihiko TANABE, Motohiro SAKURAI, Yoshinori SATO
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Publication number: 20180113529Abstract: The transparent conductor involves a first laminate part including a transparent resin substrate and a transmittance-controlling layer, and a second laminate part including the transparent resin substrate, the transmittance-controlling layer, a metal layer containing silver or a silver alloy, and a metal oxide layer in the order presented. The first laminate part and the second laminate part are adjacent to each other in a direction perpendicular to the direction of lamination of the first laminate part and the second laminate part, and the difference between the transmittance of the first laminate part in the direction of lamination, T1, and the transmittance of the second laminate part in the direction of lamination, T2, (T2?T1) is 4% or more.Type: ApplicationFiled: April 22, 2016Publication date: April 26, 2018Applicant: TDK CORPORATIONInventors: Hiroshi SHINGAI, Yoshihisa TAMAGAWA, Motohiro SAKURAI
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Publication number: 20180024388Abstract: Provided is a transparent conductor including a transparent resin substrate, a first metal oxide layer, a metal layer containing a silver alloy, and a second metal oxide layer laminated in the order presented, wherein the second metal oxide layer contains zinc oxide, indium oxide, titanium oxide, and tin oxide.Type: ApplicationFiled: March 25, 2016Publication date: January 25, 2018Applicant: TDK CorporationInventors: Hiroshi SHINGAI, Yoshihisa TAMAGAWA, Motohiro SAKURAI
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Publication number: 20050092251Abstract: A vacuum processing apparatus 50 is provided with a bypass line 52 for causing a vacuum transfer chamber 4 and a load-lock chamber 12 to communicate with each other, and a bypass opening and shutting valve 54 for opening and shutting the corresponding bypass line 52, wherein by opening the bypass opening and shutting valve 54, a pressure-reduced state at the vacuum transfer chamber 4 side can be shifted to the load-lock chamber 12 side, and the pressure reduction of the load-lock chamber 12 can be carried out in a short time.Type: ApplicationFiled: December 2, 2004Publication date: May 5, 2005Applicant: TDK CORPORATIONInventors: Masanori Kosuda, Yoshihisa Tamagawa, Hideki Ishizaki
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Patent number: 6843883Abstract: A vacuum processing apparatus 50 is provided with a bypass line 52 for causing a vacuum transfer chamber 4 and a load-lock chamber 12 to communicate with each other, and a bypass opening and shutting valve 54 for opening and shutting the corresponding bypass line 52, wherein by opening the bypass opening and shutting valve 54, a pressure-reduced state at the vacuum transfer chamber 4 side can be shifted to the load-lock chamber 12 side, and the pressure reduction of the load-lock chamber 12 can be carried out in a short time.Type: GrantFiled: August 29, 2002Date of Patent: January 18, 2005Assignee: TDK CorporationInventors: Masanori Kosuda, Yoshihisa Tamagawa, Hideki Ishizaki
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Publication number: 20030051815Abstract: A vacuum processing apparatus 50 is provided with a bypass line 52 for causing a vacuum transfer chamber 4 and a load-lock chamber 12 to communicate with each other, and a bypass opening and shutting valve 54 for opening and shutting the corresponding bypass line 52, wherein by opening the bypass opening and shutting valve 54, a pressure-reduced state at the vacuum transfer chamber 4 side can be shifted to the load-lock chamber 12 side, and the pressure reduction of the load-lock chamber 12 can be carried out in a short time.Type: ApplicationFiled: August 29, 2002Publication date: March 20, 2003Inventors: Masanori Kosuda, Yoshihisa Tamagawa, Hideki Ishizaki