Abstract: According to the present disclosure, a semiconductor device includes a semiconductor substrate, a first metal layer provided above the semiconductor substrate, a second metal layer provided above the first metal layer and containing Ni as a material and a third metal layer provided above the second metal layer and containing Cu or Ni as a material, wherein the second metal layer has a Vickers hardness of 400 Hv or more and is harder than the third metal layer, and the third metal layer is harder than the first metal layer.

Abstract: A hinge for connecting a first pivoting body to a second pivoting body in a relatively pivotable manner includes a sheet body configured to attach a first end of the sheet body to the first pivoting body, and to attach a second end of the sheet body to the second pivoting body. The sheet body includes a plurality of layered sheet members, and a pivot shaft between layered sheet members of the plurality of layered sheet members to allow the first end and the second end of the sheet body to pivot relative to each other. The pivot shaft includes a soft resin part between the layered sheet members.

Abstract: The object is to provide a technology capable of increasing the reliability of a power semiconductor device. A power semiconductor device includes: a substrate including an insulating layer and a circuit pattern that are disposed in this order; a power semiconductor element electrically connected to the circuit pattern; and an electrode terminal having a thinned portion including a welded portion welded to the circuit pattern by a fiber laser. A thickness of the circuit pattern is not less than 0.2 and not more than 0.5 mm, and a thickness of the thinned portion of the electrode terminal is not less than one time and not more than two times the thickness of the circuit pattern.

Abstract: A hinge for connecting a first pivoting body to a second pivoting body in a relatively pivotable manner includes a sheet body configured to attach a first end of the sheet body to the first pivoting body, and to attach a second end of the sheet body to the second pivoting body. The sheet body includes a plurality of layered sheet members, and a pivot shaft between layered sheet members of the plurality of layered sheet members to allow the first end and the second end of the sheet body to pivot relative to each other. The pivot shaft includes a soft resin part between the layered sheet members.

Abstract: The object is to provide a technology capable of increasing the reliability of a power semiconductor device. A power semiconductor device includes: a substrate including an insulating layer and a circuit pattern that are disposed in this order; a power semiconductor element electrically connected to the circuit pattern; and an electrode terminal having a thinned portion including a welded portion welded to the circuit pattern by a fiber laser. A thickness of the circuit pattern is not less than 0.2 and not more than 0.5 mm, and a thickness of the thinned portion of the electrode terminal is not less than one time and not more than two times the thickness of the circuit pattern.

Abstract: In a power semiconductor device, a front-surface electrode of a power semiconductor element is formed in such a manner that, on a first Cu layer consisting mainly of Cu, formed by non-electrolytic plating and having a Vickers hardness of 200 to 350 Hv, a second Cu layer consisting mainly of Cu, formed by non-electrolytic plating and having a Vickers hardness of 70 to 150 Hv and thus being softer than the first Cu layer, is laminated. The second Cu layer and a wire made of Cu are wire-bonded together.

Abstract: A power module is fabricated, employing a clad metal that is formed by pressure-laminating aluminum and copper, in such a manner that the aluminum layer of the clad metal is bonded such as by ultrasonic bonding to the surface electrode of the power semiconductor chip and a wire is bonded to the copper layer thereof to establish electrical circuit. The clad metal is thermally treated in advance at a temperature higher than the operating temperature of the power semiconductor chip to sufficiently form intermetallic compounds at the interface between the aluminum layer and the copper layer for the intermetallic compounds so as not to grow in thickness after the bonding processes.

Abstract: A power module is fabricated, employing a clad metal that is formed by pressure-laminating aluminum and copper, in such a manner that the aluminum layer of the clad metal is bonded such as by ultrasonic bonding to the surface electrode of the power semiconductor chip and a wire is bonded to the copper layer thereof to establish electrical circuit. The clad metal is thermally treated in advance at a temperature higher than the operating temperature of the power semiconductor chip to sufficiently form intermetallic compounds at the interface between the aluminum layer and the copper layer for the intermetallic compounds so as not to grow in thickness after the bonding processes.

Abstract: A thrust transmitting plate 14b on a cylinder hole bottom side portion of an adjuster nut 14, a drive side cam plate 12, and a cam spring 15 for biasing the thrust transmitting plate 14b toward the drive side cam plate 12 are accommodated in a generally cylindrical housing 16. Parts of the arc face of the circumferential wall of the housing 16 are deformed inwardly to form flat portions 16d. Engaging apertures 16e are formed in the flat portions 16d such that the engaging protrusions 14d are movable only in the cylinder axis direction when they are engaged. Portions of the circumferential wall of the housing 16 are protruded outwardly in convex shapes by presswork to form plural locking parts 16g arranged in the circumferential direction. The housing 16 is configured so as to be mounted in a cylinder hole 8 by latching those locking parts 16g to a circumferential groove 8f formed in the cylinder hole 8.

Abstract: A thrust transmitting plate 14b on a cylinder hole bottom side portion of an adjuster nut 14, a drive side cam plate 12, and a cam spring 15 for biasing the thrust transmitting plate 14b toward the drive side cam plate 12 are accommodated in a generally cylindrical housing 16. Parts of the arc face of the circumferential wall of the housing 16 are deformed inwardly to form flat portions 16d. Engaging apertures 16e are formed in the flat portions 16d such that the engaging protrusions 14d are movable only in the cylinder axis direction when they are engaged. Portions of the circumferential wall of the housing 16 are protruded outwardly in convex shapes by presswork to form plural locking parts 16g arranged in the circumferential direction. The housing 16 is configured so as to be mounted in a cylinder hole 8 by latching those locking parts 16g to a circumferential groove 8f formed in the cylinder hole 8.

Abstract: A flickerless television receiver displays image signals having the horizontal/vertical scanning frequencies thereof increased to two times the horizontal/vertical scanning frequencies of the broadcast signals to be received. Flickerless display performance can be confirmed with a single television receiver by generating signals to extract every other field for image displaying and showing two kinds of image signals, namely double-speed image signal and extracted image signal. A display unit displays double-speed image signals having horizontal and vertical scanning frequencies of image signals increased to two times by conversion, wherein extracted image signals formed by extracting every other field or frame from screen images are generated and two kinds of images formed of the double-speed image signals and extracted image signals are simultaneously displayed on one screen.

Abstract: The present invention relates to improvement in a working apparatus, such as an electronic part automatic-mounting apparatus comprising carriers for holding and moving works on a working line and a work head for applying a predetermined operation at a predetermined position on the work moved by the carriers, to a work station. The apparatus also includes: head driving means for moving the work head in directions (for examples, a Y direction) different from the moving direction of the work (for example, an X direction) and carrier driving means for moving the carriers along the working line sequentially from a work feed position to a work station, onto a work discharge position and then moving or restoring the work back to the work feed position (7). The carrier driving means also position the point of operation on the work in the moving direction fo the work at the work station.

Abstract: The present invention provides a wire winding method and apparatus in which for winding wire on a toroidal core having a hole therethrough, one end of the wire is inserted through the toroidal core from one side thereof, the wire protruding from the toroidal core is drawn out and this drawn out wire is wound on the core, and, then, with a tension applied, the tip of the wire is again inserted through the toroidal core, which operation is repeated. The tip of the wire gripped by a drawing out member is cut between the drawing out member and a gripping member before inserting the end of the wire through the aforementioned toroidal core, the cut being made such that the distance between the gripping position and the tip of the cut wire is a predetermined value, so that the length of wire from the tip to the gripping member is always the same when the wire is inserted through the hole in the core.