Patents by Inventor Yoshihisa Yamanaka

Yoshihisa Yamanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10022897
    Abstract: A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: July 17, 2018
    Assignee: OMRON Corporation
    Inventors: Isao Makuta, Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Norikazu Kitamura, Masayuki Shinohara, Kazuhide Hirota, Toshikaga Taguchi, Masayuki Kojima, Yukihiro Takahashi
  • Patent number: 9643369
    Abstract: A transfer molding method includes supplying melted resin to a first metallic mold, conveying the first metallic mold onto which the resin was supplied to a position opposing a second metallic mold, performing transfer molding by sandwiching the resin between the two metallic molds, and cooling the resin after performing transfer molding. The performing transfer molding includes discharging residual air that remains in a recess via a groove portion.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: May 9, 2017
    Assignee: OMRON Corporation
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshinori Ito, Yoshikaga Taguchi, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Masayuki Kojima, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki
  • Patent number: 9618180
    Abstract: An area light source device has a transfer-molded optical member, and a light source disposed in a position facing at least one of end faces of the optical member. Light incident to the optical member from the light source is output through a light exit surface of the optical member. A cutting back clearance portion is provided in at least one of corner portions of the end face of the optical member.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: April 11, 2017
    Assignee: OMRON Corporation
    Inventors: Koichi Takemura, Gouo Kurata, Yoshihisa Yamanaka, Masayuki Kojima, Morihisa Ota
  • Patent number: 9452572
    Abstract: A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: September 27, 2016
    Assignee: OMRON Corporation
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Yoshikaga Taguchi, Masayuki Kojima
  • Patent number: 9162405
    Abstract: A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: October 20, 2015
    Assignee: OMRON Corporation
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Kazutaka Kaneko, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki, Masayuki Kojima
  • Publication number: 20150251341
    Abstract: A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.
    Type: Application
    Filed: February 8, 2013
    Publication date: September 10, 2015
    Applicant: OMRON CORPORATION
    Inventors: Isao Makuta, Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Norikazu Kitamura, Masayuki Shinohara, Kazuhide Hirota, Toshikaga Taguchi, Masayuki Kojima, Yukihiro Takahashi
  • Patent number: 9116264
    Abstract: A method for producing a light guide plate includes forming a light introduction part that introduces light incident through an end face, and forming a light guide plate body that has a thickness less than a maximum thickness of the light introduction part, forming the light guide plate body to be continuously joined to the light introduction part, and forming the light guide plate body so as to cause a light controller to output the incident light to an outside. The light guide plate producing method further includes a conveying step of conveying a resin sheet between a first die and a second die, which are disposed while facing each other, wherein a transfer surface is provided in at least one of surfaces facing each other in the first and second dies.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: August 25, 2015
    Assignee: OMRON Corporation
    Inventors: Isao Makuta, Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Norikazu Kitamura, Masayuki Shinohara, Kazuhide Hirota, Yoshikaga Taguchi, Masayuki Kojima, Yukihiro Takahashi
  • Publication number: 20150021797
    Abstract: A transfer molding method includes supplying melted resin to a first metallic mold, conveying the first metallic mold onto which the resin was supplied to a position opposing a second metallic mold, performing transfer molding by sandwiching the resin between the two metallic molds, and cooling the resin after performing transfer molding. The performing transfer molding includes discharging residual air that remains in a recess via a groove portion.
    Type: Application
    Filed: June 20, 2014
    Publication date: January 22, 2015
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshinori Ito, Yoshikaga Taguchi, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Masayuki Kojima, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki
  • Publication number: 20140125917
    Abstract: A method for producing a light guide plate includes forming a light introduction part that introduces light incident through an end face, and forming a light guide plate body that has a thickness less than a maximum thickness of the light introduction part, forming the light guide plate body to be continuously joined to the light introduction part, and forming the light guide plate body so as to cause a light controller to output the incident light to an outside. The light guide plate producing method further includes a conveying step of conveying a resin sheet between a first die and a second die, which are disposed while facing each other, wherein a transfer surface is provided in at least one of surfaces facing each other in the first and second dies.
    Type: Application
    Filed: February 8, 2013
    Publication date: May 8, 2014
    Applicant: OMRON CORPORATION
    Inventors: Isao Makuta, Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Norikazu Kitamura, Masayuki Shinohara, Kazuhide Hirota, Yoshikaga Taguchi, Masayuki Kojima, Yukihiro Takahashi
  • Publication number: 20140125918
    Abstract: A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface.
    Type: Application
    Filed: February 8, 2013
    Publication date: May 8, 2014
    Applicant: OMRON Corporation
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Kazutaka Kaneko, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki, Masayuki Kojima
  • Publication number: 20140125921
    Abstract: An area light source device has a transfer-molded optical member, and a light source disposed in a position facing at least one of end faces of the optical member. Light incident to the optical member from the light source is output through a light exit surface of the optical member. A cutting back clearance portion is provided in at least one of corner portions of the end face of the optical member.
    Type: Application
    Filed: February 8, 2013
    Publication date: May 8, 2014
    Applicant: OMRON CORPORATION
    Inventors: Koichi Takemura, Gouo Kurata, Yoshihisa Yamanaka, Masayuki Kojima, Morihisa Ota
  • Publication number: 20140124965
    Abstract: A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.
    Type: Application
    Filed: February 8, 2013
    Publication date: May 8, 2014
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Yoshikaga Taguchi, Masayuki Kojima