Abstract: An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

Abstract: An imaging system may include a light source for generating pulses of light and an image sensor for collecting reflected light from the generated pulses of light. The image sensor may include an array of pixels, each having a photosensitive element, a floating diffusion region, and two charge storage structures interposed between the photosensitive element and the floating diffusion region. A potential barrier structure may be interposed between the photosensitive element and the two charge storage structures. The photosensitive element may generate charge in response to ambient light and may set the potential barrier level of the potential barrier structure using the generated charge. The imaging system may perform time-of flight information generation using the potential barrier structures in each of the pixels.

Abstract: An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

Abstract: An imaging system may include a light source configured to irradiate an environment with non-color (IR) light. An image sensor in the imaging system may include pixels that are sensitive to the non-color light and color light. In particular, a light filter system may be formed over the pixels that pass the non-color light and the color light. Control circuitry may be configured to control the light source to pulse the non-color light during a global shutter operation of the image sensor. Control circuitry may also be configured to control the light source not to pulse during a rolling shutter operation of the image sensor. The image sensor may be configured to generate image signals for the global shutter operation and the rolling shutter operation. Readout circuitry may be configured to extract color information and non-color pulsed light information from the generated image signals.

Abstract: An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

Abstract: An imaging system may include an array of pixel blocks that each have multiple pixels over which a single microlens is formed. A lens system may be formed over the multiple pixels. The lens system may have an aperture and a filter system, which includes multiple portions each corresponding to a pixel of the multiple pixels, formed at the aperture. The multiple portions may have multiple band pass filters of different wavelengths. During imaging operations, a light emitting diode of a given wavelength may be used to brighten an object for detection. A band pass filter may correspond to the given wavelength of the light emitting diode. Subtraction circuitry may subtract signals obtained using a band pass filter from signals obtained using the band pass filter corresponding to the given wavelength to generate object detection data.

Abstract: An imaging device includes a camera 31, a light source 32, a polarizer 35 arranged between the camera 31 plus the light source 32 and an object 11, and a spatial light modulator 40A arranged between the polarizer 35 and the object 11 to control a revolution angle of an emitting light polarization plane relative to an incident light polarization plane.

Abstract: There is provided an imaging unit comprising at least one image sensor, a measuring instrument including at least one marker, a position computing unit, a determining unit, and an output controller, wherein the imaging unit is configured to acquire an image comprising a user and the marker, and provide the acquired image to the position computing unit, wherein the position computing unit is configured to compute a position of the marker with respect to the user based on the image provided by the imaging unit, and further provide the computed position to the determining unit, wherein the determining unit is configured to determine whether the computed position of the marker matches a retrieved measurement position, and further output the result of the determination to the output controller, and wherein the output controller is configured to provide an indication when the marker position matches the measurement position.

Abstract: An imaging system may include an array of pixel blocks that each have multiple pixels over which a single microlens is formed. A lens system may be formed over the multiple pixels. The lens system may have an aperture and a filter system, which includes multiple portions each corresponding to a pixel of the multiple pixels, formed at the aperture. The multiple portions may have multiple band pass filters of different wavelengths. During imaging operations, a light emitting diode of a given wavelength may be used to brighten an object for detection. A band pass filter may correspond to the given wavelength of the light emitting diode. Subtraction circuitry may subtract signals obtained using a band pass filter from signals obtained using the band pass filter corresponding to the given wavelength to generate object detection data.

Abstract: An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

Abstract: There is provided an imaging unit comprising at least one image sensor, a measuring instrument including at least one marker, a position computing unit, a determining unit, and an output controller, wherein the imaging unit is configured to acquire an image comprising a user and the marker, and provide the acquired image to the position computing unit, wherein the position computing unit is configured to compute a position of the marker with respect to the user based on the image provided by the imaging unit, and further provide the computed position to the determining unit, wherein the determining unit is configured to determine whether the computed position of the marker matches a retrieved measurement position, and further output the result of the determination to the output controller, and wherein the output controller is configured to provide an indication when the marker position matches the measurement position.

Abstract: An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

Abstract: There is provided an imaging unit comprising at least one image sensor, a measuring instrument including at least one marker, a position computing unit, a determining unit, and an output controller, wherein the imaging unit is configured to acquire an image comprising a user and the marker, and provide the acquired image to the position computing unit, wherein the position computing unit is configured to compute a position of the marker with respect to the user based on the image provided by the imaging unit, and further provide the computed position to the determining unit, wherein the determining unit is configured to determine whether the computed position of the marker matches a retrieved measurement position, and further output the result of the determination to the output controller, and wherein the output controller is configured to provide an indication when the marker position matches the measurement position.

Abstract: An imaging device includes a camera 31, a light source 32, a polarizer 35 arranged between the camera 31 plus the light source 32 and an object 11, and a spatial light modulator 40A arranged between the polarizer 35 and the object 11 to control a revolution angle of an emitting light polarization plane relative to an incident light polarization plane.

Abstract: An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

Abstract: An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

Abstract: A chip size package (CSP) includes an antenna for wireless communication, used in signal transmission and reception with external substrates, the antenna being formed as a wiring of a rewiring layer, the rewiring layer being disposed between a silicon layer and solder bumps.

Abstract: There is provided a camera module including: a lens; an image pickup device arranged on an optical axis of the lens; and an actuator section configured to reciprocate the image pickup device in an optical axis direction of the lens, wherein the actuator section includes a movable joint section on which the image pickup device is fixed, a parallel link mechanism section having a movable end section attached to the movable joint section and a mounting end section, and a movable element that is configured to perform displacement motion by a displacement amount depending on a level of a voltage to be applied and that is coupled to a coupling region between the movable joint section and the movable end section of the parallel link mechanism section in such a manner that the displacement motion is transmittable.

Abstract: An optical sensor is described herein. By way of example, the optical sensor comprises a first light filter on a first light-receiving surface of an image sensor, and a second light filter on a second light-receiving surface of the image sensor. The second light-receiving surface is on an opposite side of the image sensor from the first light-receiving surface. The characteristics of the first light filter are different than characteristics of the second light filter.

Abstract: There is provided an imaging unit comprising at least one image sensor, a measuring instrument including at least one marker, a position computing unit, a determining unit, and an output controller, wherein the imaging unit is configured to acquire an image comprising a user and the marker, and provide the acquired image to the position computing unit, wherein the position computing unit is configured to compute a position of the marker with respect to the user based on the image provided by the imaging unit, and further provide the computed position to the determining unit, wherein the determining unit is configured to determine whether the computed position of the marker matches a retrieved measurement position, and further output the result of the determination to the output controller, and wherein the output controller is configured to provide an indication when the marker position matches the measurement position.