Patents by Inventor Yoshihito Ijichi

Yoshihito Ijichi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Al alloy containing Cu and C and its manufacturing method
    Patent number: 10563290
    Abstract: Provided is a method for manufacturing an Al alloy that includes Cu and C, by a manufacturing method provided with a step for adding graphite particles, and particles of a carbonization promoter containing boron or a boron compound, to Al molten metal that includes Cu.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: February 18, 2020
    Assignees: SHIROGANE CO., LTD., METAL AND TECHNOLOGY INC.
    Inventors: Yoshihito Ijichi, Kenichi Ohshima
  • AL ALLOY CONTAINING CU AND C AND ITS MANUFACTURING METHOD
    Publication number: 20170253949
    Abstract: Provided is a method for manufacturing an Al alloy that includes Cu and C, by a manufacturing method provided with a step for adding graphite particles, and particles of a carbonization promoter containing boron or a boron compound, to Al molten metal that includes Cu.
    Type: Application
    Filed: September 9, 2015
    Publication date: September 7, 2017
    Applicants: SHIROGANE CO., LTD., METAL AND TECHNOLOGY INC.
    Inventors: Yoshihito IJICHI, Kenichi OHSHIMA
  • COPPER ALLOY AND COPPER ALLOY MANUFACTURING METHOD
    Publication number: 20150225816
    Abstract: A copper alloy having an electrical resistivity lower than those of current copper alloys and a tensile strength higher than those of current copper alloys and a method of manufacturing such a copper alloy are provided. The copper alloy is produced by adding a predetermined amount of carbon to a molten copper in a high-temperature environment of a temperature in the range of 1200° C. to 1250° C. such that the copper alloy has a carbon content in the range of 0.01% to 0.6% by weight.
    Type: Application
    Filed: April 21, 2015
    Publication date: August 13, 2015
    Inventors: Yoshihito IJICHI, Kenichi OHSHIMA
  • Copper alloy and copper alloy manufacturing method
    Patent number: 9033023
    Abstract: A copper alloy having an electrical resistivity lower than those of current copper alloys and a tensile strength higher than those of current copper alloys and a method of manufacturing such a copper alloy are provided. The copper alloy is produced by adding a predetermined amount of carbon to a molten copper in a high-temperature environment of a temperature in the range of 1200° C. to 1250° C. such that the copper alloy has a carbon content in the range of 0.01% to 0.6% by weight.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: May 19, 2015
    Assignees: SHIROGANE CO., LTD., UNIVERSITY OF TSUKUBA
    Inventors: Yoshihito Ijichi, Kenichi Ohshima
  • COPPER ALLOY AND COPPER ALLOY MANUFACTURING METHOD
    Publication number: 20120219452
    Abstract: A copper alloy having an electrical resistivity lower than those of current copper alloys and a tensile strength higher than those of current copper alloys and a method of manufacturing such a copper alloy are provided. The copper alloy is produced by adding a predetermined amount of carbon to a molten copper in a high-temperature environment of a temperature in the range of 1200° C. to 1250° C. such that the copper alloy has a carbon content in the range of 0.01% to 0.6% by weight.
    Type: Application
    Filed: September 3, 2010
    Publication date: August 30, 2012
    Applicants: UNIVERSITY OF TSUKUBA, SHIROGANE CO., LTD.
    Inventors: Yoshihito Ijichi, Kenichi Ohshima
  • ALLOY SOLDER AND ALLOY SOLDER MANUFACTURING METHOD
    Publication number: 20100296965
    Abstract: The present invention solves the problem of the bonding strength of a Pb-free alloy solder being inferior to that of the conventional Pb-containing alloy solder and provides a Pb-free alloy solder satisfactory in bonding reliability. An alloy solder is manufactured by adding a predetermined amount of carbon to a Pb-free solder in a high-temperature atmosphere of a temperature in the range of 800° C. to 1200° C. An alloy solder manufacturing method includes a melting process for melting a Pb-free solder by heating the Pb-free solder in a high-temperature atmosphere of a temperature in the range of 800° C. to 1200° C.
    Type: Application
    Filed: December 11, 2008
    Publication date: November 25, 2010
    Applicants: SHIROGANE CO., LTD., UNIVERSITY OF TSUKUBA
    Inventors: Yoshihito Ijichi, Kenichi Oshima