Abstract: Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.

Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 m2/g or more.

Abstract: Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.

Abstract: A semiconductor device manufacturing method includes a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with light and thereby separating the semiconductor member from the supporting member. The temporary fixation material layer has a light absorbing layer that generates heat upon absorbing light and a resin cured product layer including a cured product of a curable resin component. The curable resin component includes a hydrocarbon resin, and a storage modulus at 25° C. for the cured product of the curable resin component is 5 to 100 MPa.

Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.

Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.

Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.

Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.

Abstract: Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.

Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.

Abstract: Selective adsorbents are prepared by dispersing powdery adsorbents in a composition for forming a crosslinked high molecular weight polymer, then dispersing in fine droplets the dispersion in a vehicle and performing crosslinking reaction to form a crosslinked polymer. The fine powders of adsorbents are enclosed within the crosslinked polymer and dispersed in three-dimensional spaces. Hydroxyl group containing polymeric substance and crosslinking agent or a monomer mixture of ethylenically unsaturated monomer and crosslinking monomer is used in said composition. The selective adsorbents can be useful in separation or purification of various organic compounds.

Abstract: A cellulose microcapsule having absorbing capacity, consisting of outer semipermeable barrier layer of cellulose and absorbent powders dispersed within inner cellulose gel matrix is prepared by dispersing adsorbent powders in a solution of cellulose dissolved in a solvent which is not adversely affected by the adsorbing capacity of adsorbent powders and capable of dissolving cellulose, then forming the dispersion into droplets and finally precipitating cellulose on the droplets. It is excellent in resistance to chemicals such as acids, alkalis or organic solvents and is useful for various purposes.

Abstract: A novel cellulose microcapsule having adsorbing capacity, consisting of outer semipermeable barrier layer of cellulose and adsorbent powders dispersed within inner cellulose gel matrix, is prepared by ester hydrolysis of a precursor microcapsule consisting of cellulose ester derivative and adsorbent powders. It is excellent in resistance to chemicals such as acids, alkalis or organic solvents and is useful for various purposes.

Abstract: Encapsulated medicaments are prepared by dissolving a wall material for capsules in at least one organic solvent poorly miscible with water which has a boiling point of less than 100.degree.C., a vapor pressure higher than that of water and a dielectric constant of less than about 10, dissolving or dispersing in the resulting solution a medicament which is insoluble or slightly soluble in water, dispersing the resulting solution or dispersion to the form of fine drops in a liquid vehicle comprising an aqueous solution of a hydrophilic colloid or surface active agent, and then removing the organic solvent by evaporation.

Abstract: Selective adsorbing particles are prepared by dispersing activated charcoal in a hydrophilic solvent solution of a polymer capable of forming a semi-permeable film in a coagulating medium and then adding the dispersion dropwise into a coagulating bath. The selective adsorbing particles have adsorption capacity substantially the same as that of untreated activated charcoal. Separation of organic compounds is performed by a method wherein a solution containing a mixture of adsorptive organic compounds and non-adsorptive compounds is contacted with the selective adsorbing particles. The method is suitable for separation or purification of various organic compounds such as antibiotics, dyestuffs, nucleic acids, preteins or enzymes.

Abstract: A novel molecular sieving particle containing adsorbent powders dispersed in matrix of micro-porous polymer gels is prepared by dispersing adsorbent powders into a polymeric material solution dissolved in a solvent, then emulsifying the thus prepared dispersion into a vehicle having a boiling point higher than that of the solvent and finally removing the solvent by evaporation. This molecular sieving particle has excellent molecular sieving effect as well as excellent adsorption capacity, and applicable in various applications.

Abstract: Microcapsules are made by (a.) dispersing or dissolving a core substance in a film-forming polymer solution, (b.) emulsifying in fine droplets the resulting dispersion or solution in a vehicle which is poorly miscible with the solvent of the polymer solution and which doesn't dissolve said polymer to prepare an emulsion, and (c.) adding to the emulsion a non-solvent for the polymer wherein the non-solvent is miscible with the solvent, poorly miscible with the vehicle, and does not dissolve the polymer, whereby the solvent is removed by being absorbed by non-solvent emulsion droplets to precipitate the polymer film around the core substance.