Abstract: A method for detecting positions of a plurality of electrode pads of semiconductor chips formed on a semiconductor wafer includes: setting an imaging target region greater than a semiconductor chip on the semiconductor wafer; performing split imaging so as to entirely cover the imaging target region; and detecting positions of electrode pads of the semiconductor chip by processing images obtained by the split imaging. The split imaging is performed by using an imaging device which enlarges and images a region smaller than the imaging target region by one imaging.

Abstract: A method for detecting positions of a plurality of electrode pads of semiconductor chips formed on a semiconductor wafer includes: setting an imaging target region greater than a semiconductor chip on the semiconductor wafer; performing split imaging so as to entirely cover the imaging target region; and detecting positions of electrode pads of the semiconductor chip by processing images obtained by the split imaging. The split imaging is performed by using an imaging device which enlarges and images a region smaller than the imaging target region by one imaging.

Abstract: A probe inspection apparatus includes a mounting section mounting an inspection target, a loader section having a convey mechanism for conveying the inspection target on the mounting section, a prober section for inspecting the inspection target conveyed by the convey mechanism, a controller for controlling movements of the prober section and the loader section, and a display unit having a display panel for displaying an operation panel for operating the controller. The operation panel has operation touch keys for operating the controller with an operation content displayed in a user country language, and identification symbol touch keys for displaying an operation content corresponding to the operation keys in a language different from the user country language.

Abstract: A probe apparatus in which a wafer having IC chips arrayed with electrode pads is supported by a pedestal, and the pedestal is moved relatively to a probe card in the X, Y, Z directions to bring the electrode pads into contact with probes of the probe card so as to perform an electric measurement of the part to be inspected, the apparatus includes a parameter setting part for setting a distance in the Z direction between the probe and the electrode pad when the pedestal is moved along the X, Y planes to specify the initial position of the chip, a memory unit for storing the distance in the Z direction set by the parameter setting part, and a control unit for moving the pedestal in the Z direction in a manner to be apart from the probe card on the basis of the distance in the Z direction stored in the memory unit to move the chip to the initial position, and moving relatively the pedestal in the Z direction from the position to the probe card so as to contact the electrode pad of the chip with the probe.

Abstract: In a method of inspecting the electric characteristics of wafers, detecting for second and subsequent alignment operations of probe cards is automatically executed. In an apparatus for inspecting the electric characteristics of wafer, different types of wafers can be continuously inspected using the same probe card on the basis of prestored alignment data of each type of wafers.