Abstract: A flame-retardant polyamide composition comprising 10 to 80% by mass of a polyamide (A), 5 to 40% by mass of a flame retardant (B), 0.5 to 10% by mass of zinc borate and at least one other salt of zinc (C), 0 to 60% by mass of an inorganic reinforcing material (D), and 0 to 5% by mass of a drip preventing agent (E). The composition is advantageous in that it is free from environmental problems caused by an antimony compound and avoids a problem in productivity caused by the generation of gas which is the main cause of a mold deposit in the case of the combination use with a flame retardant containing bromine. In addition, the composition can exhibit excellent flame retardancy, toughness and melt fluidity, as well as good heat resistance and color stability in the reflow soldering step required in surface mounting in electric/electronic parts.