Abstract: There is provided a mounting table on which a substrate to be inspected is mounted. The mounting table comprises: a plurality of temperature sensors, each configured to measure a temperature of a corresponding one of a plurality of spots on the mounting table; and electrode pads, each connected to a corresponding one of the temperature sensors and installed on a mounting surface.

Abstract: An inspection system includes an inspection device that includes a stage on which a substrate is mounted and inspects the substrate on the stage, a temperature adjustment mechanism that adjusts the temperature of the stage, a substrate accommodating part, a temperature measurement substrate standby part that makes a temperature measurement substrate wait, a transfer unit that transfers the substrate and the temperature measurement substrate onto the stage, and a camera used for aligning the substrate on the stage. The temperature measurement substrate includes, on the surface thereof, a temperature measurement member whose state changes depending on the temperature. The transfer unit transfers the temperature measurement substrate onto the stage, the camera images the temperature measurement member, and the temperature of the temperature measurement substrate is measured from a change in the state of the temperature measurement member.

Abstract: In a method for contact accuracy assurance in an inspection apparatus, an alignment substrate having first marks is placed and aligned on a stage, and a position checking member, which is a transparent body simulating a probe card and has second marks at positions corresponding to the first marks, is coupled to a mounting part where the probe card is to be coupled. Further, the alignment substrate is placed in a contact area directly below the position checking member. Horizontal deviations between the first and the second marks are detected by capturing images of the first and the second marks with position checking cameras provided above the position checking member at positions respectively corresponding to the second marks to capture the images from a top down angle. The contact accuracy between the substrate and probes of the probe card is assured when the deviations are within an allowable range.

Abstract: There is provided a testing wafer that simulates heat generation of an inspection target substrate. The testing wafer includes a heater pattern, a plurality of temperature sensors, and first and second electrode pads. The heater pattern is configured to heat the testing wafer having the same shape as a shape of the inspection target substrate. The temperature sensors are configured to respectively measure temperatures of multiple locations on the testing wafer. The first electrode pads are connected to the heater pattern and the second electrode pads are connected to the temperature sensors. The first and second electrode pads are installed to be in contact with probes of a probe card.

Abstract: A temperature measurement member measures a temperature of an inspection object or a temperature of a mounting table on which the inspection object is placed inside an inspection apparatus that inspects the inspection object. The temperature measurement member is attached to an attachment position of a probe card used for electrical characteristic inspection in the inspection apparatus, and includes a main body having substantially a same shape as the probe card; a probe formed to extend from the main body toward the mounting table in a state in which the temperature measurement member is attached to the attachment position; and a temperature sensor configured to measure the temperature of the inspection object or the mounting table. The sensor transmits/receives a temperature measurement-related electrical signal to/from an inspection part via the probe card in the electrical characteristic inspection, and transmits a temperature measurement result to the inspection part.

Abstract: According to the present invention, in an inspection device which performs an inspection on a substrate with a tester by contacting the substrate with a plurality of probes of a probe card, this contact accuracy assurance method includes: placing, on a stage, an alignment substrate which has a plurality of marks; aligning the alignment substrate on the stage; mounting, at a prescribed position of a mounting part of the probe card, a position checking member which has a plurality of second marks at positions corresponding to the first marks of the alignment substrate, and which is composed of a transparent body simulating the probe card; placing the alignment substrate at a prescribed position in a contact region directly below the position checking member; capturing images of the first and second marks with positon checking cameras which have vertical image capturing directions and are provided at positions respectively corresponding to the second marks in an upper side of the position checking member, and de

Abstract: There is provided a testing wafer that simulates heat generation of an inspection target substrate. The testing wafer includes a heater pattern, a plurality of temperature sensors, and first and second electrode pads. The heater pattern is configured to heat the testing wafer having the same shape as a shape of the inspection target substrate. The temperature sensors are configured to respectively measure temperatures of multiple locations on the testing wafer. The first electrode pads are connected to the heater pattern and the second electrode pads are connected to the temperature sensors. The first and second electrode pads are installed to be in contact with probes of a probe card.

Abstract: A temperature measurement member measures a temperature of an inspection object or a temperature of a mounting table on which the inspection object is placed inside an inspection apparatus that inspects the inspection object. The temperature measurement member is attached to an attachment position of a probe card used for electrical characteristic inspection in the inspection apparatus, and includes a main body having substantially a same shape as the probe card; a probe formed to extend from the main body toward the mounting table in a state in which the temperature measurement member is attached to the attachment position; and a temperature sensor configured to measure the temperature of the inspection object or the mounting table. The sensor transmits/receives a temperature measurement-related electrical signal to/from an inspection part via the probe card in the electrical characteristic inspection, and transmits a temperature measurement result to the inspection part.

Abstract: An inspection system includes an inspection device that includes a stage on which a substrate is mounted and inspects the substrate on the stage, a temperature adjustment mechanism that adjusts the temperature of the stage, a substrate accommodating part, a temperature measurement substrate standby part that makes a temperature measurement substrate wait, a transfer unit that transfers the substrate and the temperature measurement substrate onto the stage, and a camera used for aligning the substrate on the stage. The temperature measurement substrate includes, on the surface thereof, a temperature measurement member whose state changes depending on the temperature. The transfer unit transfers the temperature measurement substrate onto the stage, the camera images the temperature measurement member, and the temperature of the temperature measurement substrate is measured from a change in the state of the temperature measurement member.