Abstract: A device operable to apply an identification mark to a semiconductor wafer and inspect the applied mark immediately after its application. Engraving information and wafer thickness data are suppled to an engraving device and the engraving operation applies the mark to the wafer accordingly. A camera then reads the applied mark as read information and a comparator compares the read information to the engraving information and an error is determined in an information processing device. In order to maintain efficient operation of the mark application process, the error determined in the information processing device is then used to control the engraving device as it applies identification marks.

Abstract: The engraving information such as the characters and barcodes of an engraving identification mark is inputted into a engraving device body. An identification markis engraved on a sliced wafer by a laser head. A turntable supporting the sliced wafer is rotated so that the identification mark thereof is disposed under a reading camera. The identification mark is read by the reading camera. The engraving information inputted in the engraving device body and the engraved mark read in the reading device body are compared in an information processing device. The engraving is thus controlled by the engraving device body in accordance with the compared result.

Abstract: To provide a semiconductor wafer lapping method capable of preventing deformation of a press platen caused by repeating lapping and improving deterioration of TTV caused by rotation stop of semiconductor wafers. In a semiconductor wafer lapping method comprising the steps of placing a lapping carrier having holding holes loaded with semiconductor wafers between an upper press platen and a lower press platen which rotate in opposite directions, rotating the lapping carrier, and lapping the semiconductor wafers, the rotation speed of the lapping carrier is abruptly changed to induce rotation of the semiconductor wafers in the holding holes of the lapping carrier.